Abstract: An output system includes a terminal device, an image-forming apparatus, and a server device. The terminal device includes an acquirer that acquires content from the server device, a generator that generates job data including a setting for outputting the content based on the acquired content, a transmitter that transmits the job data to the image-forming apparatus, and a reception slip outputter that outputs a reception slip including a reception number corresponding to the generated job data. The image-forming apparatus includes a receiver that receives the job data from the terminal device, and an outputter that outputs the content after executing a job based on the job data corresponding to the reception number when the reception number is input.

Abstract: Provided is a release control agent containing a silicone resin having a weight average molecular weight based on standard polystyrene by gel permeation chromatography of 3,000 to 6,000 and expressed by the average unit formula: (R13SiO1/2)a(SiO4/2)1.0, wherein each R1 independently represents an alkyl group with 1 to 6 carbon atoms, and “a” represents a number from 0.5 to 1.5, and (B) a diorganopolysiloxane having at least two silicon-bonded alkenyl groups in a molecule and/or (C) an ?-olefin with 12 to 24 carbon atoms. Also provided is a releasable film-forming silicone composition containing the release control agent. The releasable film-forming silicone composition forms a releasable film with little change in release force and that does not reduce the residual adhesive strength of a pressure sensitive adhesive (PSA) after long-term aging in a state adhered to the PSA despite exhibiting a relatively large release force with respect to the PSA.

Abstract: Provided is: a curing reactive silicone composition having sufficient toughness and pressure sensitive adhesive strength to temporarily secure various substrate even in an uncured state, having heat meltability and excellent moldability of a sheet or the like, and that can be quickly cured by high energy irradiation to achieve high adhesive strength; a method of manufacturing a sheet thereof a cured product thereof that can achieve high adhesive strength by crimping; and applications thereof. The curing reactive silicone composition comprises: (A) an MQ resin; (B) a chain organopolysiloxane having at least two groups containing an aliphatic unsaturated carbon-carbon bond, and a degree of siloxane polymerization within a range of 80 to 3000; (C) an organohydrogenpolysiloxane; and (D) a hydrosilylation reaction catalyst activated by a high energy beam. The amount of component (A) is more than 55 mass % and less than 90 mass % of the sum of components (A) to (C).

Abstract: Provided is a curable polyorganosiloxane release coating composition comprising: A) a branched aliphatically unsaturated polyorganosiloxane, B) a crosslinker having at least 3 silicon bonded hydrogen atoms per molecule, C) a hydrosilylation reaction catalyst, D) a hydrosilylation reaction inhibitor, and E) an aryl-functional polydiorganosiloxane having a content of aliphatically unsaturated groups. Also provided are a release liner (100) with this coating (101) and the preparation method thereof.

Abstract: The present invention pertains to a curable organopolysiloxane composition comprising at least (A) an organopolysiloxane having at least two alkenyl groups per module, (B) an organopolysiloxane resin represented by average unit formula: (R13SiO1/2)a(R12SiO2/2)b(R2SiO3/2)c(SiO4/2)d. In the formula, R1's are the same or different from each other, and represent a hydrogen atom or a monovalent hydrocarbon group not having an aliphatic unsaturated carbon bond but at least two of the R1's per molecule represent hydrogen atoms, R2 represents a monovalent hydrocarbon group not having an aliphatic unsaturated bond, and a, b, and c are numbers satisfying 0<a<1, 0<b<1, and 0?c?0.2, and 0<d<1, respectively, but are also numbers satisfying 0.6?a/d 1.5, 1.5?b/d?3, and a+b+c+d=1, and (C) a catalyst for hydrosilylation reaction. This composition has excellent adhesiveness to a semiconductor element, and can form a cured product in which only a small number of bubbles are produced.

Abstract: A curable silicone composition comprises: (A) an organopolysiloxane having at least two alkenyl groups in a molecule; (B) an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms in a molecule and free of a polyether structure; (C) a polyether-modified silicone having a siloxane dendron structure and a polyether structure; and (D) a hydrosilylation reaction catalyst. The curable silicone composition can be used to form an optical semiconductor device having minimal contamination of a case during manufacturing of the optical semiconductor device, good efficiency of light extraction from a light emitting element, and minimal color unevenness or chromaticity deviation. The optical semiconductor device is notable in that a light emitting element is sealed or covered by a cured material of the composition, in addition to having minimal contamination of a case, good efficiency of light extraction, and minimal chromaticity deviation.

Abstract: A curable silicone composition is disclosed. The composition comprises: (A) an organopolysiloxane having at least two alkenyl groups in a molecule; (B) an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms in a molecule; (C) a polyether-modified silicone comprising repeating units represented by a general formula herein and having a number average molecular weight of 1,000 to 100,000; and (D) a hydrosilylation catalyst. The composition can be used to form an optical semiconductor device having minimal contamination of a case during manufacturing of the optical semiconductor device, good efficiency of light extraction from a light emitting element, and minimal color unevenness or chromaticity deviation. The optical semiconductor device notable in that a light emitting element is sealed or covered by a cured material of the composition, in addition to having minimal contamination of a case, good efficiency of light extraction, and minimal color unevenness or chromaticity deviation.

Abstract: A hydrosilylation curable polysiloxane comprising at least one of units of formula (I) and units of formula (II), wherein Ar is C6-C20 aryl, R1 is C2-C20 alkenyl, and R2, R3, R4 and R5 independently are C1-C20 hydrocarbyl.

Abstract: A curable silicone composition includes at least: (A) an organopolysiloxane represented by an average composition formula and having at least two alkenyl groups in the molecule thereof; (B) an organopolysiloxane having at least two silicon-atom-bonded hydrogen atoms in the molecule thereof, at least 5 mol % of silicon-atom-bonded groups other than hydrogen atoms being aryl groups; (C) an organopolysiloxane represented by an average unit formula and having an alkenyl group, an aryl group, and an epoxy-containing organic group; and (D) a hydrosilylation catalyst. The silicone composition can be cured to form an optical semiconductor device having good efficiency.

Abstract: A hydrosilylation curable polysiloxane comprising at least one of units of formula (I) and units of formula (II), wherein Ar is C6-C20 aryl, R1 is C2-C20 alkenyl, and R2, R3, R4 and R5 independently are C1-C20 hydrocarbyl.

Abstract: A release agent composition for a silicone pressure-sensitive adhesive is disclosed. The composition comprises: (A) an organopolysiloxane represented by a specific average unit formula; (B) an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms in a molecule; and (C) a hydrosilylation reaction catalyst. A release film having a small peeling force with respect to a silicone pressure-sensitive adhesive can be formed with the composition.

Abstract: An organic silicon compound is disclosed which is represented by a formula: (R13SiO)3SiR2—[SiR32O]y[SiR32]w—R4—R5, wherein each of R1 and R3 is a group independently selected from the group consisting of alkyl groups, alkenyl groups, aryl groups, aralkyl groups and alkoxy groups having 1 to 20 carbon atoms, R2 is a divalent hydrocarbon group or an oxygen atom, R4 is a divalent hydrocarbon group, or a direct bond to a silicon (Si) atom, R5 is a monovalent group represented by (R6O)qR7(3-q)Si or a monovalent hydrocarbon group having 1 to 20 carbon atoms, and each of R6 and R7 is a group independently selected from the group consisting of alkyl groups, alkenyl groups, aryl groups, aralkyl groups and alkoxy groups having 1 to 20 carbon atoms, and q is an integer between 1 and 3, y is an integer between 0 and 200, and w is 0 or 1.

Abstract: The present invention pertains to a curable organopolysiloxane composition comprising at least (A) an organopolysiloxane having at least two alkenyl groups per module, (B) an organopolysiloxane resin represented by average unit formula: (R13SiO1/2)a(R12SiO2/2)b(R2SiO3/2)c(SiO4/2)d. In the formula, R1's are the same or different from each other, and represent a hydrogen atom or a monovalent hydrocarbon group not having an aliphatic unsaturated carbon bond but at least two of the R1's per molecule represent hydrogen atoms, R2 represents a monovalent hydrocarbon group not having an aliphatic unsaturated bond, and a, b, and c are numbers satisfying 0<a<1, 0<b<1, and 0?c?0.2, and 0<d<1, respectively, but are also numbers satisfying 0.6?a/d 1.5, 1.5?b/d?3, and a+b+c+d=1, and (C) a catalyst for hydrosilylation reaction. This composition has excellent adhesiveness to a semiconductor element, and can form a cured product in which only a small number of bubbles are produced.

Abstract: The present invention relates to a curable silicone composition comprising: (A) a diorganopolysiloxane having at least two alkenyl groups in a molecule, (B) at least two types of resinous organopolysiloxanes having different mass average molecular weights, (C) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule, and (D) a hydrosilylation reaction catalyst. The curable silicone composition enables the production of an optical semiconductor device in which the marked viscosity elevation of the resulting composition can be inhibited, in which the fluidity and packing properties are outstanding and that has outstanding gas barrier properties when used as a sealant, and in which the device has outstanding initial optical output efficiency even when organopolysiloxane resin is blended in order to form cured product with moderate hardness and strength.

Abstract: An organic silicon compound is disclosed which is represented by a formula : (R13SiO)3SiR2-[SiR32O]y[SiR32]w-R4-R5, wherein each of R1 and R3 is a group independently selected from the group consisting of alkyl groups, alkenyl groups, aryl groups, aralkyl groups and alkoxy groups having 1 to 20 carbon atoms, R2 is a divalent hydrocarbon group or an oxygen atom, R4 is a divalent hydrocarbon group, or a direct bond to a silicon (Si) atom, R5 is a monovalent group represented by (R6O)qR7(3-q)Si or a monovalent hydrocarbon group having 1 to 20 carbon atoms, and each of R6 and R7 is a group independently selected from the group consisting of alkyl groups, alkenyl groups, aryl groups, aralkyl groups and alkoxy groups having 1 to 20 carbon atoms, and q is an integer between 1 and 3, y is an integer between 0 and 200, and w is 0 or 1.

Abstract: A curable silicone composition comprising: (A) an organopolysiloxane represented by the average unit formula: (R13SiO1/2)x(R22SiO2/2)y(R3SiO3/2)z (R1 are alkyl groups, alkenyl groups, aryl groups, or aralkyl groups; R2 are alkyl groups or alkenyl groups; R3 is an alkyl group, aryl group, or an aralkyl group, provided that, in a molecule, at least 0.5 mol % of R1 to R3 are the alkenyl groups, at least one of R3 is the aryl group or the aralkyl group; and x, y and z are numbers satisfying: 0.01?x?0.5, 0.01?y?0.4, 0.1?z?0.9, and x+y+z=1); (B) a straight-chain organopolysiloxane having at least two alkenyl groups in a molecule; (C) an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms in a molecule; and (D) a hydrosilylation reaction catalyst. A cured product exhibiting excellent dispersibility of phosphor and having crack resistance is formed.

Abstract: The present invention relates to a curable silicone composition comprising: (A) an organopolysiloxane resin having at least two alkenyl groups in a molecule; (B) an organopolysiloxane represented by a general formula; (C) an organosiloxane (C1) having silicon-bonded hydrogen atoms at both molecular terminals, an organopolysiloxane (C2) having at least two silicon-bonded hydrogen atoms in a molecule, or a mixture of components (C1) and (C2); and (D) a hydrosilylation reaction catalyst. The curable silicone composition has excellent handleability and can form a cured product with a high refractive index and low gas permeability when cured.

Abstract: The present invention relates to a curable silicone composition comprising: (A) an organopolysiloxane represented by a specific average unit formula, (B) an optional straight-chain organopolysiloxane having at least two alkenyl groups and not having any silicon-bonded hydrogen atoms in a molecule, (C) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule, and (D) a hydrosilylation reaction catalyst. The curable silicone composition has high reactivity and forms a cured product with low gas permeability.

Abstract: A curable silicone composition comprising: (A) an organopolysiloxane represented by the average unit formula: (R13SiO1/2)a(R22SiO2/2)b(R3SiO3/2)c (R1 are alkyl groups, alkenyl groups, aryl groups, or aralkyl groups; R2 are alkyl groups or alkenyl groups; R3 is an alkyl group, aryl group, or an aralkyl group, provided that, in a molecule, at least 0.5 mol % of R1 to R3 are the alkenyl groups, at least one of R3 is the aryl group or the aralkyl group; and a, b, and c are numbers satisfying: 0.01?a?0.5, 0.4?b?0.8, 0.01?c?0.5, and a+b+c=1); (B) an organopolysiloxane that is different from component (A); (C) an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms in a molecule; and (D) a hydrosilylation reaction catalyst. A cured product exhibiting excellent dispersibility of phosphor and having high strength and gas barrier properties is formed.

Abstract: A curable silicone composition comprising: (A) an organopolysiloxane represented by the average unit formula: (R13SiO1/2)x(R22SiO2/2)y(R3SiO3/2)z (R1 are alkyl groups, alkenyl groups, aryl groups, or aralkyl groups; R2 are alkyl groups or alkenyl groups; R3 is an alkyl group, aryl group, or an aralkyl group, provided that, in a molecule, at least 0.5 mol % of R1 to R3 are the alkenyl groups, at least one of R3 is the aryl group or the aralkyl group; and x, y and z are numbers satisfying: 0.01?x?0.5, 0.01?y?0.4, 0.1?z?0.9, and x+y+z=1); (B) a straight-chain organopolysiloxane having at least two alkenyl groups in a molecule; (C) an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms in a molecule; and (D) a hydrosilylation reaction catalyst. A cured product exhibiting excellent dispersibility of phosphor and having crack resistance is formed.