Abstract: The invention relates to compositions and methods of treating a sleep-wake disorder or neurodegenerative diseases using modified resistant maltodextrin.

Abstract: The invention relates to compositions and methods of treating a sleep-wake disorder or neurodegenerative diseases using modified resistant maltodextrin.

Abstract: A composition includes at least one of a modified glucal or galactal molecule. The molecules are useful for the treatment of cancer, particularly in a human patient, more particularly in a human patient exhibiting cell-specific increases in glucose uptake without a corresponding lactate production. The compounds are also useful for treating a human that has hypoxic cells expressing elevated levels of HIT activity, a plurality of cells displaying a lower amplitude of circadian oscillation or an increase in reactive oxygen species in mitochondria of the cells of the human.

Abstract: The invention relates to compositions and methods of treating a sleep-wake disorder or neurodegenerative diseases using modified resistant maltodextrin.

Abstract: A multiplexer for voltage measurement includes: a first switch disposed on a first channel extending between at least one high-voltage input terminal and an output terminal; a plurality of second switches respectively disposed on second channels each extending between each of input terminals other than the high-voltage input terminal and the output terminal; and a third switch disposed between a group of the plurality of second switches and an output terminal side end of the first switch. Each of the first switch and the third switch is configured to operate even by a voltage higher than a power supply voltage.

Abstract: A signal processor includes: a plurality of first capacitors provided for respective output terminals of a plurality of multiplexers, the first capacitors having their one ends connected to the respective output terminals of the multiplexers, the first capacitors being charged in accordance with voltages outputted from the respective output terminals; a differential amplifier including an input terminal connected to the other ends of the first capacitors; a second capacitor connected between the input terminal and an output terminal of the differential amplifier; and a second switch connected parallel to the second capacitor. First switches included in at least one of the plurality of multiplexers are configured as high-voltage switches that allow operation at a voltage higher than an operating voltage of first switches included in the other multiplexer or multiplexers.

Abstract: A multiplexer for voltage measurement includes: a first switch disposed on a first channel extending between at least one high-voltage input terminal and an output terminal; a plurality of second switches respectively disposed on second channels each extending between each of input terminals other than the high-voltage input terminal and the output terminal; and a third switch disposed between a group of the plurality of second switches and an output terminal side end of the first switch. Each of the first switch and the third switch is configured to operate even by a voltage higher than a power supply voltage.

Abstract: A signal processor includes: a plurality of first capacitors provided for respective output terminals of a plurality of multiplexers, the first capacitors having their one ends connected to the respective output terminals of the multiplexers, the first capacitors being charged in accordance with voltages outputted from the respective output terminals; a differential amplifier including an input terminal connected to the other ends of the first capacitors; a second capacitor connected between the input terminal and an output terminal of the differential amplifier; and a second switch connected parallel to the second capacitor. First switches included in at least one of the plurality of multiplexers are configured as high-voltage switches that allow operation at a voltage higher than an operating voltage of first switches included in the other multiplexer or multiplexers.

Abstract: An amplification circuit amplifies an input signal. A signal detecting circuit detects whether the input signal is in a signal present state or in a signal absent state. A period detecting circuit detects a signal present duration for which the signal detecting circuit detects that the input signal is in the signal present state. A time setting circuit sets a control waiting time, depending on the signal present duration detected by the period detecting circuit. A control circuit limits outputting of the amplification circuit after the control waiting time set by the time setting circuit has elapsed since the signal detecting circuit detected the signal absent state of the input signal.

Abstract: An NchMOS transistor (1) is provided for muting of an output terminal (10) to which positive and negative output signals are outputted, and a mute switch circuit (3) is provided for controlling on/off of the transistor (1) by switching a voltage applied to the gate of the transistor (1). When muting is turned off, the back gate of the transistor (1) is biased by resistance division between resistors (R1 and R2) connected in series between the output terminal (10) and a predetermined negative potential (VSS).

Abstract: It is an object of the invention to provide a method for producing an IC chip capable of producing an IC chip with a thickness as extremely thin as 50 ?m or thinner, for example, about 25 to 30 ?m at a high productivity.

Abstract: AnNchMOS transistor (1) is provided for muting of an output terminal (10) to which positive and negative output signals are outputted, and a mute switch circuit (3) is provided for controlling on/off of the transistor (1) by switching a voltage applied to the gate of the transistor (1). When muting is turned off, the back gate of the transistor (1) is biased by resistance division between resistors (R1 and R2) connected in series between the output terminal (10) and a predetermined negative potential (VSS).

Abstract: An NchMOS transistor (1) is provided for muting of an output terminal (10) to which positive and negative output signals are outputted, and a mute switch circuit (3) is provided for controlling on/off of the transistor (1) by switching a voltage applied to the gate of the transistor (1). When muting is turned off, the back gate of the transistor (1) is biased by resistance division between resistors (R1 and R2) connected in series between the output terminal (10) and a predetermined negative potential (VSS).

Abstract: An NchMOS transistor (1) is provided for muting of an output terminal (10) to which positive and negative output signals are outputted, and a mute switch circuit (3) is provided for controlling on/off of the transistor (1) by switching a voltage applied to the gate of the transistor (1). When muting is turned off, the back gate of the transistor (1) is biased by resistance division between resistors (R1 and R2) connected in series between the output terminal (10) and a predetermined negative potential (VSS).

Abstract: It is the object of the invention to provide a method for manufacturing a semiconductor chip capable of obtaining a semiconductor chip at a high manufacturing efficiency without damages. The invention is a method for manufacturing a semiconductor chip, which comprises a tape adhesion step of sticking a pressure sensitive adhesive tape for dicing having a pressure sensitive adhesive layer containing a gas generating agent for generating a gas by radiating light to a semiconductor wafer with a circuit formed; a dicing step for dicing the wafer with the pressure sensitive adhesive tape for dicing stuck and dividing the semiconductor wafer into each semiconductor chip; a separation step of separating at least a portion of the pressure sensitive adhesive tape for dicing from the semiconductor chip by radiating light to the divided each semiconductor chip; and a pickup step of picking the semiconductor chip up by a needle-less pickup method.

Abstract: An object of the present invention is to provide an adhesive substance capable of being easily peeled off without damaging an adherend by giving stimulation thereto, a tape employing this adhesive substance, and a method for peeling off the adhesive substance. An adhesive substance, which contains a gas-generating agent for generating gas by stimulation, gas generated from said gas-generating agent being discharged to the outside of said adhesive substance so as not to foam said adhesive substance, and gas generated from said gas-generating agent peeling at least part of an adhesive surface of said adhesive substance off an adherend so as to decrease adhesive strength.

Abstract: An object of the present invention is to provide an adhesive substance capable of being easily peeled off without damaging an adherend by giving stimulation thereto, a tape employing this adhesive substance, and a method for peeling off the adhesive substance. An adhesive substance, which contains a gas-generating agent for generating gas by stimulation, gas generated from said gas-generating agent being discharged to the outside of said adhesive substance so as not to foam said adhesive substance, and gas generated from said gas-generating agent peeling at least part of an adhesive surface of said adhesive substance off an adherend so as to decrease adhesive strength.

Abstract: In a film with metal foil of the present invention, a metal foil is stuck to the surface of a resin film via an adhesive layer. The adhesive is formed by crosslinking an acrylic polymer obtained by the copolymerization of a (meth)acrylic acid ester with a carboxyl group-containing radically polymerizable monomer, with a polyfunctional compound having a functional group reactive with the carboxyl group. The film with metal foil is very useful for producing a multi-layer wiring board by the so-called transfer method. By using this film, there can be produced a multi-layer wiring board having a fine and highly dense wiring/circuit layer and having a very excellently flat surface.

Abstract: An object of the present invention is to provide an adhesive substance capable of being easily peeled off without using light and damaging an adherend, a method for peeling off the adhesive substance, and a connected structure.

Abstract: The purpose of the invention is to provide a double-sided adhesive tape which prevents a wafer from damaging even when the wafer has a considerably thin thickness of about 50 &mgr;m, which has improved handlability, which is favorably used for processing of an IC chip and which facilitates its peeling, and a method for manufacturing an IC chip using it.