Abstract: A fault diagnosis apparatus comprises a vibration sensor for detecting vibration waveforms being generating by machinery or equipment, a cumulative frequency computing device for obtaining a cumulative frequency distribution curve of an absolute value of the vibration waveforms detected by the vibration sensor, a maximum value detecting device for obtaining a maximum value xp of the vibration waveforms detected by the vibration sensor, a peak ratio computing device for obtaining the peak ratio &bgr;1 of an equivalent effective value &sgr;eq in the cumulative frequency distribution curve computed by the cumulative frequency computing device to the maximum value xp computed by the maximum value detecting device, and a fault diagnosing device for diagnosing the degree of fault of the machinery or equipment from the magnitude of the peak ratio &bgr;1 computed by the peak ratio computing device.

Abstract: In a film with metal foil of the present invention, a metal foil is stuck to the surface of a resin film via an adhesive layer. The adhesive is formed by crosslinking an acrylic polymer obtained by the copolymerization of a (meth)acrylic acid ester with a carboxyl group-containing radically polymerizable monomer, with a polyfunctional compound having a functional group reactive with the carboxyl group. The film with metal foil is very useful for producing a multi-layer wiring board by the so-called transfer method. By using this film, there can be produced a multi-layer wiring board having a fine and highly dense wiring/circuit layer and having a very excellently flat surface.

Abstract: In a film with metal foil of the present invention, a metal foil is stuck to the surface of a resin film via an adhesive layer. The adhesive is formed by crosslinking an acrylic polymer obtained by the copolymerization of a (meth)acrylic acid ester with a carboxyl group-containing radically polymerizable monomer, with a polyfunctional compound having a functional group reactive with the carboxyl group. The film with metal foil is very useful for producing a multi-layer wiring board by the so-called transfer method. By using this film, there can be produced a multi-layer wiring board having a fine and highly dense wiring/circuit layer and having a very excellently flat surface.

Abstract: A fault diagnosis apparatus comprises a vibration sensor for detecting vibration waveforms being generating by machinery or equipment, a cumulative frequency computing device for obtaining a cumulative frequency distribution curve of an absolute value of the vibration waveforms detected by the vibration sensor, a maximum value detecting device for obtaining a maximum value xp of the vibration waveforms detected by the vibration sensor, a peak ratio computing device for obtaining the peak ratio &bgr;1 of an equivalent effective value &sgr;eq in the cumulative frequency distribution curve computed by the cumulative frequency computing device to the maximum value xp computed by the maximum value detecting device, and a fault diagnosing device for diagnosing the degree of fault of the machinery or equipment from the magnitude of the peak ratio &bgr;1 computed by the peak ratio computing device.