Patents by Inventor Kazuhiro Tada

Kazuhiro Tada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11279828
    Abstract: A silicone rubber composite material includes silicone rubber, first carbon nanotubes having an average diameter of not more than 30 nm, and second carbon nanotubes having an average diameter of more than 30 nm and not more than 1000 nm. Per 100 parts by weight of the silicone rubber, 2.5 to 10 parts by weight of the first carbon nanotubes and 5 to 15 parts by weight of the second carbon nanotubes are included.
    Type: Grant
    Filed: July 12, 2018
    Date of Patent: March 22, 2022
    Assignees: DENSO CORPORATION, SHINSHU UNIVERSITY
    Inventors: Kazuhiro Tada, Haruhisa Shibata, Ryo Miyahara, Hisayoshi Oshima, Toru Noguchi
  • Publication number: 20220009312
    Abstract: A vibration-isolating device includes: a vibration source, which generates vibrations; and at least one vibration-isolating rubber which is fixed to the vibration source. The vibration source is supported by at least one support member that is fixed to a transmission-receiving member through the at least one vibration-isolating rubber. The vibration source and the at least one vibration-isolating rubber are configured such that a difference between a maximum value and a minimum value of resonant frequencies of a structure, which includes the vibration source, the at least one vibration-isolating rubber and the at least one support member, is equal to or smaller than 10 Hz when the vibration source is vibrated in six degrees of freedom. The at least one vibration-isolating rubber includes: 100 parts by mass of silicone rubber; and larger than 0 parts by mass and equal to or smaller than 3 parts by mass of carbon nanotubes.
    Type: Application
    Filed: September 24, 2021
    Publication date: January 13, 2022
    Applicant: DENSO CORPORATION
    Inventors: Kazuhiro HAYASHI, Ryo MIYAHARA, Haruhisa SHIBATA, Yasutane HIJIKATA, Kazuhiro TADA
  • Publication number: 20210190389
    Abstract: The refrigeration cycle device includes a compressor, an outside heat exchanger, a cooling pressure reducing unit, an evaporator, a branch portion, a cool down pressure reducing unit, a temperature adjusting unit, a merging portion, a bypass passage, and a first on-off valve. The temperature adjusting unit includes a temperature adjusting heat exchange unit and adjusts a temperature of a temperature adjustment target object. During a cooling and cool down mode, the outside heat exchanger functions as a radiator, and the evaporator and the temperature adjusting heat exchange unit function as heat absorbers. During a target object warm up mode, the refrigerant discharged from the compressor is guided to the temperature adjusting heat exchange unit via the bypass passage, and the heat of the discharged refrigerant is used as a heat source for heating the temperature adjustment target object.
    Type: Application
    Filed: March 3, 2021
    Publication date: June 24, 2021
    Inventors: Kazuhiro TADA, Kengo SUGIMURA, Hiroyuki KOBAYASHI, Yuichi KAMI, Satoshi ITO
  • Patent number: 10909908
    Abstract: An image display device includes: a display unit that displays an image; a right side support and a left side support that support the display unit in an upright state, and are at least partially light-transmissive; a right side first light source and a left side first light source that are disposed in the display unit, and emit light to at least a part of the right side support and the left side support.
    Type: Grant
    Filed: March 8, 2017
    Date of Patent: February 2, 2021
    Assignee: PANASONIC AVC NETWORKS KUALA LUMPUR MALAYSIA SDN. BHD.
    Inventors: Masahiro Yamamoto, Naoki Noguchi, Osamu Nakazawa, Toshiharu Tsutsui, Naoki Matsumura, Kazuhiro Tada
  • Patent number: 10889163
    Abstract: A heat pump system includes a heat pump cycle, a heat medium circulation circuit, and a refrigeration cycle device. The refrigeration cycle device is configured to perform a defrosting operation when a frost formation determiner determines that frost is formed. A throttle opening degree controller is configured to increase an opening degree in the defrosting operation. A pumping capacity controller is configured to increase a pumping capacity in the defrosting operation with increase of a required heating capacity required for heating a heating target fluid, the pumping capacity controller increasing the pumping capacity such that heat of refrigerant discharged from a compressor is transferred to heat medium in a first heat exchanger within a range in which a temperature of the refrigerant flowing into an outside heat exchanger is capable of melting the frost formed on the outside heat exchanger.
    Type: Grant
    Filed: January 20, 2017
    Date of Patent: January 12, 2021
    Assignee: DENSO CORPORATION
    Inventor: Kazuhiro Tada
  • Patent number: 10843933
    Abstract: Provided is a friction material composition that can increase the coefficient of friction and the wear resistance, reduce the compressive deformation rate, and improve the yield upon hot forming, even when being free of copper component or having a small content of copper component. The friction material composition contains: titanate compound powder made of non-fibrous titanate compound particles; barium sulfate powder; and a thermosetting resin, wherein the titanate compound powder has an alkali metal ion dissolution rate of 15.0% by mass or less, the barium sulfate powder has a volume-based 50% cumulative particle diameter (D50) of 0.1 ?m to 20.0 ?m, and a content of copper component is 0.5% by mass or less in terms of copper element in a total amount of 100% by mass of the friction material composition.
    Type: Grant
    Filed: March 5, 2018
    Date of Patent: November 24, 2020
    Assignee: OTSUKA CHEMICAL CO., LTD.
    Inventors: Shogo Kamada, Kazuhiro Tada, Emiko Daimon, Toshiaki Yagi
  • Publication number: 20200354573
    Abstract: A silicone rubber composite material includes silicone rubber, first carbon nanotubes having an average diameter of not more than 30 nm, and second carbon nanotubes having an average diameter of more than 30 nm and not more than 1000 nm. Per 100 parts by weight of the silicone rubber, 2.5 to 10 parts by weight of the first carbon nanotubes and 5 to 15 parts by weight of the second carbon nanotubes are included.
    Type: Application
    Filed: July 12, 2018
    Publication date: November 12, 2020
    Inventors: Kazuhiro TADA, Haruhisa SHIBATA, Ryo MIYAHARA, Hisayoshi OSHIMA, Toru NOGUCHI
  • Patent number: 10533786
    Abstract: A refrigerating cycle apparatus includes: a compressor that compresses and discharges refrigerant; a radiator that makes the refrigerant discharged out of the compressor to radiate heat; a pressure reducing device that decompresses the refrigerant flowing out of the radiator; an evaporator that evaporates the refrigerant decompressed by the pressure reducing device; and a decompression control part that controls operation of the pressure reducing device. The decompression control part controls the operation of the pressure reducing device in a manner that a physical quantity which has correlation with a pressure of the refrigerant in the evaporator approaches a predetermined defrosting standard value when a time-priority defrosting mode is set.
    Type: Grant
    Filed: November 28, 2017
    Date of Patent: January 14, 2020
    Assignee: DENSO CORPORATION
    Inventor: Kazuhiro Tada
  • Publication number: 20200002184
    Abstract: Provided is a friction material composition that can increase the coefficient of friction and the wear resistance, reduce the compressive deformation rate, and improve the yield upon hot forming, even when being free of copper component or having a small content of copper component. The friction material composition contains: titanate compound powder made of non-fibrous titanate compound particles; barium sulfate powder; and a thermosetting resin, wherein the titanate compound powder has an alkali metal ion dissolution rate of 15.0% by mass or less, the barium sulfate powder has a volume-based 50% cumulative particle diameter (D50) of 0.1 ?m to 20.0 ?m, and a content of copper component is 0.5% by mass or less in terms of copper element in a total amount of 100% by mass of the friction material composition.
    Type: Application
    Filed: March 5, 2018
    Publication date: January 2, 2020
    Applicant: OTSUKA CHEMICAL CO., LTD.
    Inventors: Shogo Kamada, Kazuhiro Tada, Emiko Daimon, Toshiaki Yagi
  • Patent number: 10490491
    Abstract: A lead frame extends from inside a sealing resin to outside the sealing resin, and is placed to make contact with a main surface of an insulating sheet opposite to a heat dissipation plate. A semiconductor element is jointed to at least a portion of a main surface of the lead frame opposite to the insulating sheet within the sealing resin. The surface of the insulating sheet in contact with the lead frame is inclined and lowered to move away from the lead frame in an end region including at least a portion of an outermost end in plan view of the insulating sheet. The sealing resin enters a region between the lead frame and the insulating sheet in the end region. The lead frame is flat at least within the sealing resin.
    Type: Grant
    Filed: December 25, 2015
    Date of Patent: November 26, 2019
    Assignee: Mitsubishi Electric Corporation
    Inventors: Kazuhiro Tada, Kei Yamamoto, Mariko Takahara
  • Publication number: 20190316822
    Abstract: A refrigeration cycle apparatus includes: an electric compressor that compresses and discharges refrigerant; a heating heat exchanger that heats a fluid by high pressure refrigerant discharged from the electric compressor as a heat source; a decompressor that decompresses the refrigerant flowing from the heating heat exchanger; an evaporator that evaporates the refrigerant decompressed by the decompressor; and a rotational speed controller that controls a rotational speed of the electric compressor. The rotational speed controller is configured to reduce an upper limit value of the rotational speed of the electric compressor in accordance with an increase in a pressure ratio of a high-pressure side refrigerant pressure of refrigerant within a range from a discharge port of the compressor to an inlet side of the decompressor to a low-pressure side refrigerant pressure of refrigerant within a range from an outlet side of the decompressor to a suction port of the compressor.
    Type: Application
    Filed: May 31, 2019
    Publication date: October 17, 2019
    Inventors: Kazuhiro TADA, Kenichi MARUYAMA, Fujio NOMURA
  • Publication number: 20190128569
    Abstract: An ejector refrigeration circuit includes a compressor, a heating heat exchanger, a first decompressor, an exterior heat exchanger, a second decompressor, a cooling heat exchanger, a heating ejector, a heating-side gas-liquid separator, and a refrigerant circuit switch. The refrigerant circuit switch switches between a refrigerant circuit in a first dehumidifying-heating mode and a refrigerant circuit in a second dehumidifying-heating mode. A flow direction of the refrigerant through the exterior heat exchanger in the first dehumidifying-heating mode is the same as a flow direction of the refrigerant through the exterior heat exchanger in the second dehumidifying-heating mode. The flow direction of the refrigerant through the exterior heat exchanger in the first dehumidifying-heating mode is different from a flow direction of the refrigerant through the exterior heat exchanger in the heating mode.
    Type: Application
    Filed: December 19, 2018
    Publication date: May 2, 2019
    Inventors: Kazuhiro TADA, Hiroya HASEGAWA, Satoshi ITO, Mikiharu KUWAHARA
  • Publication number: 20190103051
    Abstract: An image display device includes: a display unit that displays an image; a right side support and a left side support that support the display unit in an upright state, and are at least partially light-transmissive; a right side first light source and a left side first light source that are disposed in the display unit, and emit light to at least a part of the right side support and the left side support.
    Type: Application
    Filed: March 8, 2017
    Publication date: April 4, 2019
    Inventors: Masahiro YAMAMOTO, Naoki NOGUCHI, Osamu NAKAZAWA, Toshiharu TSUTSUI, Naoki MATSUMURA, Kazuhiro TADA
  • Publication number: 20190030992
    Abstract: A heat pump system includes a heat pump cycle, a heat medium circulation circuit, and a refrigeration cycle device. The refrigeration cycle device is configured to perform a defrosting operation when a frost formation determiner determines that frost is formed. A throttle opening degree controller is configured to increase an opening degree in the defrosting operation. A pumping capacity controller is configured to increase a pumping capacity in the defrosting operation with increase of a required heating capacity required for heating a heating target fluid, the pumping capacity controller increasing the pumping capacity such that heat of refrigerant discharged from a compressor is transferred to heat medium in a first heat exchanger within a range in which a temperature of the refrigerant flowing into an outside heat exchanger is capable of melting the frost formed on the outside heat exchanger.
    Type: Application
    Filed: January 20, 2017
    Publication date: January 31, 2019
    Inventor: Kazuhiro TADA
  • Patent number: 10177068
    Abstract: A method for manufacturing, by a transfer mold method, a power module equipped with a heat conductive insulating sheet in which an inorganic filler including secondary aggregated particles formed by aggregation of primary particles of scaly boron nitride is dispersed in a thermosetting resin, where curing of an uncured or semi-cured heat conductive insulating sheet during transfer molding is advanced under specific conditions. The method for manufacturing a power module equipped with a heat conductive insulating sheet has excellent thermal conductivity and electric insulation ability.
    Type: Grant
    Filed: March 11, 2014
    Date of Patent: January 8, 2019
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Kenji Mimura, Yurie Nakamura, Xiaohong Yin, Kazuhiro Tada
  • Publication number: 20180269140
    Abstract: A lead frame extends from inside a sealing resin to outside the sealing resin, and is placed to make contact with a main surface of an insulating sheet opposite to a heat dissipation plate. A semiconductor element is jointed to at least a portion of a main surface of the lead frame opposite to the insulating sheet within the sealing resin. The surface of the insulating sheet in contact with the lead frame is inclined and lowered to move away from the lead frame in an end region including at least a portion of an outermost end in plan view of the insulating sheet. The sealing resin enters a region between the lead frame and the insulating sheet in the end region. The lead frame is flat at least within the sealing resin.
    Type: Application
    Filed: December 25, 2015
    Publication date: September 20, 2018
    Applicant: Mitsubishi Electric Corporation
    Inventors: Kazuhiro TADA, Kei YAMAMOTO, Mariko TAKAHARA
  • Publication number: 20180156509
    Abstract: A refrigerating cycle apparatus includes: a compressor that compresses and discharges refrigerant; a radiator that makes the refrigerant discharged out of the compressor to radiate heat; a pressure reducing device that decompresses the refrigerant flowing out of the radiator; an evaporator that evaporates the refrigerant decompressed by the pressure reducing device; and a decompression control part that controls operation of the pressure reducing device. The decompression control part controls the operation of the pressure reducing device in a manner that a physical quantity which has correlation with a pressure of the refrigerant in the evaporator approaches a predetermined defrosting standard value when a time-priority defrosting mode is set.
    Type: Application
    Filed: November 28, 2017
    Publication date: June 7, 2018
    Inventor: Kazuhiro TADA
  • Patent number: 9390995
    Abstract: An object is to provide a fin integrated type semiconductor device and a method of manufacturing the same, which are provided with a simple structure and good heat dissipation characteristics. The semiconductor device includes: a base plate on which fins arranged in a standing condition are formed on a first main face; an insulating layer formed on a second main face of the base plate, the second main face being opposite to the first main face of the base plate; a circuit pattern fixed to the insulating layer; and a semiconductor element joined to the circuit pattern. The fins are formed with slits that pass through in the thickness direction of the fins.
    Type: Grant
    Filed: July 25, 2012
    Date of Patent: July 12, 2016
    Assignee: Mitsubishi Electric Corporation
    Inventors: Kei Yamamoto, Kazuhiro Tada, Hideki Komori, Toru Kimura, Masaki Goto, Hiroyuki Yoshihara
  • Patent number: 9320173
    Abstract: A semiconductor device includes a base plate having a first major plane and a second major plane opposite to each other, and having a plurality of fins held upright on the first major plane and a bulge portion formed on the first major plane to encircle the plurality of fins, an insulation layer formed on the second major plane of the base plate, a circuit pattern fixed to the insulation layer, a semiconductor element connected to the circuit pattern, and a sealing resin sealing the insulation layer, the circuit pattern, and the semiconductor element. The bulge portion formed on the first major plane continuously encircles the plurality of fins, the bulge portion has a widthwise margin on an outer peripheral edge of the base plate, and the sealing resin covers an outer peripheral side face of the bulge portion and the widthwise margin.
    Type: Grant
    Filed: February 18, 2013
    Date of Patent: April 19, 2016
    Assignee: Mitsubishi Electric Corporation
    Inventors: Kei Yamamoto, Kazuhiro Tada
  • Patent number: 9299628
    Abstract: A power semiconductor module is provided which is capable of keeping low the degrees of increases in temperatures of wide bandgap semiconductor elements, reducing the degree of increase in chip's total surface area of the wide bandgap semiconductor elements, and being fabricated at low costs, when Si semiconductor elements and the wide bandgap semiconductor elements are placed within one and the same power semiconductor module. The Si semiconductor elements are placed in a central region of the power semiconductor module, and the wide bandgap semiconductor elements are placed on opposite sides relative to the central region or in edge regions surrounding the central region.
    Type: Grant
    Filed: July 5, 2012
    Date of Patent: March 29, 2016
    Assignee: Mitsubishi Electric Corporation
    Inventors: Takayoshi Miki, Yasushi Nakayama, Takeshi Oi, Kazuhiro Tada, Shiori Idaka, Shigeru Hasegawa, Tomohiro Kobayashi, Yukio Nakashima