Abstract: Provided is a heat conductive sheet obtained by dispersing an inorganic filler in a thermosetting resin, in which the inorganic filler contains secondary aggregation particles formed by isotropically aggregating scaly boron nitride primary particles having an average length of 15 ?m or less, and the inorganic filler contains more than 20 vol % of the secondary aggregation particles each having a particle diameter of 50 ?m or more. The heat conductive sheet is advantageous in terms of productivity and cost and excellent in heat conductivity and electrical insulating properties.

Abstract: A method and device for detecting insulation degradation of a power module, which detects, in advance, degradation of an insulating sheet based on a current change immediately before breakdown of an insulation characteristic from a current value of a current flowing through the insulating sheet, thereby detecting a failure of a power module caused by the degradation of insulation.

Abstract: Provided is a heat conductive sheet obtained by dispersing an inorganic filler in a thermosetting resin, in which the inorganic filler contains secondary aggregation particles formed by isotropically aggregating scaly boron nitride primary particles having an average length of 15 ?m or less, and the inorganic filler contains more than 20 vol % of the secondary aggregation particles each having a particle diameter of 50 ?m or more. The heat conductive sheet is advantageous in terms of productivity and cost and excellent in heat conductivity and electrical insulating properties.

Abstract: A semiconductor device in which chips are resin-molded, including: frames having front and back surfaces and die pads; power chips mounted on the surfaces of the die pads; an insulation resin sheet having a first and a second surfaces which are opposed against each other, the resin sheet being disposed such that the back surfaces of the die pads contact the first surface of the resin sheet; and a mold resin applied on the first surface of the resin sheet so as to seal up the power chips. The thermal conductivity of the resin sheet is larger than that of the mold resin.

Abstract: An insulating sheet consisting of a metal layer and an unhardened insulating resin layer is formed. The insulating resin layer contains a filler having grains of, e.g., scale-like shape and has thixotropy, and its outer size is larger than that of a bottom surface of a metal plate. The insulating sheet is disposed on a bottom surface of a cavity of a mold die and the metal plate is disposed on an upper surface of the insulating resin layer. On a main surface of the metal plate, a power semiconductor chip connected to a frame and another frame through a wire is mounted. The cavity is fully filled with a liquid mold resin in this state. After that, the insulating resin layer is hardened at the same timing as the hardening of the mold resin, and the insulating resin and the metal plate are fixed to each other. An interface between the insulating resin layer and the metal plate is included in the upper surface of the insulating resin layer.

Abstract: A lighted switch device includes one rotary knob (first operating knob); first to fourth push knobs (second operating knobs); a case; a switch element and a light-emitting diode (light source), which are accommodated in the case; and an annular light conductor for transmitting exiting light from the light-emitting diode to the outer peripheral portion of the rotary knob. Plate-shaped light-shielding members are disposed at the first and third push knobs, and recesses for inserting ends of the light-shielding members are formed in portions of the second and fourth push knobs opposing their respective light-shielding members.

Abstract: A semiconductor device in which chips are resin-molded, including: frames having front and back surfaces and die pads; power chips mounted on the surfaces of the die pads; an insulation resin sheet having a first and a second surfaces which are opposed against each other, the resin sheet being disposed such that the back surfaces of the die pads contact the first surface of the resin sheet; and a mold resin applied on the first surface of the resin sheet so as to seal up the power chips. The thermal conductivity of the resin sheet is larger than that of the mold resin.

Abstract: A lighted switch device includes one rotary knob (first operating knob); first to fourth push knobs (second operating knobs); a case; a switch element and a light-emitting diode (light source), which are accommodated in the case; and an annular light conductor for transmitting exiting light from the light-emitting diode to the outer peripheral portion of the rotary knob. Plate-shaped light-shielding members are disposed at the first and third push knobs, and recesses for inserting ends of the light-shielding members are formed in portions of the second and fourth push knobs opposing their respective light-shielding members.

Abstract: An insulating sheet consisting of a metal layer and an unhardened insulating resin layer is formed. The insulating resin layer contains a filler having grains of, e.g., scale-like shape and has thixotropy, and its outer size is larger than that of a bottom surface of a metal plate. The insulating sheet is disposed on a bottom surface of a cavity of a mold die and the metal plate is disposed on an upper surface of the insulating resin layer. On a main surface of the metal plate, a power semiconductor chip connected to a frame and another frame through a wire is mounted. The cavity is fully filled with a liquid mold resin in this state. After that, the insulating resin layer is hardened at the same timing as the hardening of the mold resin, and the insulating resin and the metal plate are fixed to each other. An interface between the insulating resin layer and the metal plate is included in the upper surface of the insulating resin layer.

Abstract: A process is disclosed for producing an amine by carrying out a reductive amination of a cyclic ketone or by carrying out a reduction of an imino derivative of a cyclic ketone to the corresponding amine which process is characterized in using a cobalt catalyst containing a carbonate of an alkaline earth metal and/or lanthanum oxide.

Abstract: A triazole compound of the formula: ##STR1## wherein X is a hydrogen atom or a chlorine atom, which can be produced by subjecting an aromatic aldehyde of the formula: ##STR2## wherein X is as defined above, an alpha-halopinacolone of the formula: ##STR3## wherein Hal is a chlorine atom or a bromine atom and 1,2,4-triazole to condensation in the presence of an alkali, is useful as an intermediate in the synthesis of anti-microbial triazole-alcohols with high purity and high yield.

Abstract: A novel process for preparing the E-isomer of triazolyl styryl ketone derivative of the formula (I): ##STR1## is disclosed. The process includes treating the Z-isomer of the derivative which may contain the E-isomer of the derivative with an acid and an isomerization catalyst in an organic solvent, precipitating and separating the resulting salt of E-isomer from the solution, and decomposing the resulting precipitate to obtain the E-isomer of the derivative free from the acid. The E-isomer is useful for preparing the E-isomer of triazolyl styryl carbinol of the formula (II): ##STR2## which is useful as an antimicrobial agent, a herbicide, a plant growth regulator, or the like.

Abstract: A novel process for preparing E-isomer of a triazolyl styryl ketone derivative of the formula (I): ##STR1## which includes treating Z-isomer of the derivative (which may contain E-isomer of the derivative) with sulfuric acid and an isomerization catalyst in an organic solvent, precipitating and separating the resulting sulfuric acid salt of E-isomer from the solution, and decomposing the resulting precipitate to obtain E-isomer of the derivative free from sulfuric acid. The E-isomer is useful for preparing E-isomer of triazolyl styryl carbinol of the formula (II): ##STR2## which is useful as an antimicrobial agent, a herbicide, a plant growth regulator, or the like.

Abstract: A semiconductor memory circuit which can operate with reduced value of peak currents.The memory circuit includes two or more memory cell arrays each having a plurality of memory cells and a peripheral circuit for achieving selective access operation is provided for each array. At least a timing signal and its delayed timing signals are generated in response to a control signal. Both of the timing signal and the delayed timing signal are used to enable the peripheral circuits at different timing.

Abstract: A process for producing aminophenyl-.beta.-hydroxyethylsulfone of the formula (I), ##STR1## which comprises the following steps: (1) condensing nitrohalobenzene with mercaptoethanol in the presence of an alkali hydroxide and at least one reaction medium selected from N-alkyl-substituted amides and sulfoxides to produce mononitrophenyl-.beta.-hydroxyethylsulfide of the formula (II): ##STR2## (2) oxidizing the mononitrophenyl-.beta.-hydroxyethylsulfide (II) to produce mononitrophenyl-.beta.-hydroxyethylsulfone of the formula (III): ##STR3## and (3) reducing the mononitrophenyl-.beta.-hydroxyethylsulfone to produce the aminophenyl-.beta.-hydroxyethylsulfone of the formula (I). This compound is useful as an intermediate for aminophenyl-.beta.-sulfatoethylsulfone represented by the following formula: ##STR4## which is an important intermediate for vinyl sulfone type reactive dyes largely used for dyeing cellulose fiber materials.