Patents by Inventor Kazuhiro Takeshita

Kazuhiro Takeshita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11536275
    Abstract: An axial fan includes a housing, an upper motor, and a lower motor. The housing includes an upper housing and a lower housing. A lower peripheral wall of the lower housing includes first engaging portions and lower protruding pieces. The lower protruding pieces oppose the first engaging portions in an axial direction and protrude axially upward from an axially upper surface. An upper peripheral wall of the upper housing includes upper engaging claws and upper notch grooves. The upper engaging claws extend axially downward from an axially lower surface, and include a second engaging portion that engages with the first engaging portion in a lower end portion. The upper notch grooves are notched axially upward from the axially lower surface radially inward of the upper engaging claw. At least a portion of the lower protruding pieces is located in the upper notch grooves.
    Type: Grant
    Filed: July 29, 2021
    Date of Patent: December 27, 2022
    Assignee: NIDEC CORPORATION
    Inventors: Kazuhiro Inouchi, Yuta Yamasaki, Hidefumi Kawakami, Hidenobu Takeshita
  • Patent number: 11476136
    Abstract: A substrate processing apparatus includes plural heating modules each including a table on which a substrate is placed to be heated, the substrate having plural heated zones. The table has plural heaters each assigned to heat respective ones of the heated zones. Heat generation of the heaters is controlled independently. A control unit controls the heaters such that integrated quantities of heat of the respective heated zones given by the corresponding heaters from first to second time point are substantially identical to each other in each of the heating modules, and are substantially identical to each other among the heating modules. The first time point is set when a temperature transition profile of the substrate is rising toward a process temperature after placing the substrate on the table under a condition where heat generation of the heaters is stable. The second time point is set after the temperature transition profile reaches the process temperature.
    Type: Grant
    Filed: October 31, 2019
    Date of Patent: October 18, 2022
    Assignee: Tokyo Electron Limited
    Inventors: Kenichi Shigetomi, Takeshi Saikusa, Eiichi Sekimoto, Takayuki Fukudome, Kousuke Yoshihara, Suguru Enokida, Kazuhiro Takeshita, Kazuto Umeki
  • Publication number: 20220262811
    Abstract: According to one embodiment, a semiconductor storage device includes a stacked section in which a plurality of conductor layers are stacked along a first direction and a stepped section in which the plurality of conductor layers are in a stepped shape. The stepped section includes a lower stepped section and an upper stepped section. In the upper stepped section, the conductor layers closer to the lower stepped section side along the first direction extend longer toward one side along a second direction orthogonal to the first direction. The lower stepped section is located at a position toward an opposite side to the one side along the second direction with respect to the upper stepped section.
    Type: Application
    Filed: August 5, 2021
    Publication date: August 18, 2022
    Inventors: Hiromitsu Iino, Shunpei Takeshita, Naoki Yamamoto, Kazuhiro Nojima
  • Publication number: 20220262779
    Abstract: A semiconductor device includes a light-emitting element, a light-receiving element, an input-side terminal, a first switching element, a first lead and a resin package. The first lead includes a first mount bed and a first output-side terminal, the first switching element being mounted on the first mount bed. The resin package seals the light-emitting element, the light-receiving element, and the first switching element. The resin package includes first and second side surfaces opposite to each other. The input-side terminal protrudes from the first side surface. The first output-side terminal protrudes from the second side surface. The first switching element is sealed at a center between the first and second side surfaces. The first mount bed is arranged in a direction along the second side surface so that a side surface of the first mount bed is positioned between a center of the resin package and the first output-side terminal.
    Type: Application
    Filed: September 7, 2021
    Publication date: August 18, 2022
    Inventors: Kazuhiro Inoue, Yoshio Noguchi, Atsushi Takeshita, Toshihide Osanai
  • Patent number: 10877376
    Abstract: A light irradiating device includes a substrate holder configured to hold a substrate; a light irradiating unit; and a power feed unit. The light irradiating unit comprises a light source configured to irradiate light to a surface of the substrate; and a first connector electrically connected with the light source. The power feed unit comprises a power supply module configured to supply a power to the light source; and a second connector electrically connected with the power supply module and configured to be connected to or disconnected from the first connector. The light irradiating unit and the power feed unit are coupled as one body as the first connector and the second connector are connected, and are separated from each other as the first connector and the second connector are disconnected from each other.
    Type: Grant
    Filed: November 12, 2019
    Date of Patent: December 29, 2020
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Ryo Shimada, Kazuhiro Takeshita, Teruhiko Moriya
  • Patent number: 10795265
    Abstract: There is provided a substrate processing apparatus including: a light radiator configured to radiate a light for processing into an irradiation area which is smaller than a processing target area of a surface of a substrate; a driver configured to move the irradiation area in two directions that cross each other in a plane along the surface of the substrate; and a controller configured to control the driver to move an irradiation position in two directions according to a movement pattern which has been set to radiate the light to an entire area of the processing target area.
    Type: Grant
    Filed: July 24, 2019
    Date of Patent: October 6, 2020
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Norihisa Koga, Yoshitaka Konishi, Naruaki Iida, Yuzo Ohishi, Kazuhiro Takeshita
  • Publication number: 20200150537
    Abstract: A light irradiating device includes a substrate holder configured to hold a substrate; a light irradiating unit; and a power feed unit. The light irradiating unit comprises a light source configured to irradiate light to a surface of the substrate; and a first connector electrically connected with the light source. The power feed unit comprises a power supply module configured to supply a power to the light source; and a second connector electrically connected with the power supply module and configured to be connected to or disconnected from the first connector. The light irradiating unit and the power feed unit are coupled as one body as the first connector and the second connector are connected, and are separated from each other as the first connector and the second connector are disconnected from each other.
    Type: Application
    Filed: November 12, 2019
    Publication date: May 14, 2020
    Inventors: Ryo Shimada, Kazuhiro Takeshita, Teruhiko Moriya
  • Patent number: 10638650
    Abstract: Provided is a component loading apparatus which includes: a work table comprising a working plane; a component recognizer configured to recognize components placed on the working plane of the work table; a head configured to suck the components; and a tray support for supporting a tray on which the components sucked by the head are loaded. The component loading apparatus further includes: an impurity remover configured to remove impurities attached onto the components in at least one of a first state of being placed on the working plane of the work table and a second state of being sucked by the head; and a tray analyzer configured to inspect loading positions of the components on the tray.
    Type: Grant
    Filed: September 25, 2014
    Date of Patent: April 28, 2020
    Assignee: Hanwha Precision Machinery Co., Ltd.
    Inventors: Toshiro Hirakawa, Yoichiro Sugimoto, Kazuhiro Takeshita, Kenji Ishiyama
  • Publication number: 20200066559
    Abstract: A substrate processing apparatus includes plural heating modules each including a table on which a substrate is placed to be heated, the substrate having plural heated zones. The table has plural heaters each assigned to heat respective ones of the heated zones. Heat generation of the heaters is controlled independently. A control unit controls the heaters such that integrated quantities of heat of the respective heated zones given by the corresponding heaters from first to second time point are substantially identical to each other in each of the heating modules, and are substantially identical to each other among the heating modules. The first time point is set when a temperature transition profile of the substrate is rising toward a process temperature after placing the substrate on the table under a condition where heat generation of the heaters is stable. The second time point is set after the temperature transition profile reaches the process temperature.
    Type: Application
    Filed: October 31, 2019
    Publication date: February 27, 2020
    Applicant: Tokyo Electron Limited
    Inventors: Kenichi Shigetomi, Takeshi Saikusa, Eiichi Sekimoto, Takayuki Fukudome, Kousuke Yoshihara, Suguru Enokida, Kazuhiro Takeshita, Kazuto Umeki
  • Publication number: 20200041913
    Abstract: There is provided a substrate processing apparatus including: a light radiator configured to radiate a light for processing into an irradiation area which is smaller than a processing target area of a surface of a substrate; a driver configured to move the irradiation area in two directions that cross each other in a plane along the surface of the substrate; and a controller configured to control the driver to move an irradiation position in two directions according to a movement pattern which has been set to radiate the light to an entire area of the processing target area.
    Type: Application
    Filed: July 24, 2019
    Publication date: February 6, 2020
    Inventors: Norihisa KOGA, Yoshitaka KONISHI, Naruaki IIDA, Yuzo OHISHI, Kazuhiro TAKESHITA
  • Patent number: 10504757
    Abstract: A substrate processing apparatus includes plural heating modules each including a table on which a substrate is placed to be heated, the substrate having plural heated zones. The table has plural heaters each assigned to heat respective ones of the heated zones. Heat generation of the heaters is controlled independently. A control unit controls the heaters such that integrated quantities of heat of the respective heated zones given by the corresponding heaters from first to second time point are substantially identical to each other in each of the heating modules, and are substantially identical to each other among the heating modules. The first time point is set when a temperature transition profile of the substrate is rising toward a process temperature after placing the substrate on the table under a condition where heat generation of the heaters is stable. The second time point is set after the temperature transition profile reaches the process temperature.
    Type: Grant
    Filed: December 14, 2016
    Date of Patent: December 10, 2019
    Assignee: Tokyo Electron Limited
    Inventors: Kenichi Shigetomi, Takeshi Saikusa, Eiichi Sekimoto, Takayuki Fukudome, Kousuke Yoshihara, Suguru Enokida, Kazuhiro Takeshita, Kazuto Umeki
  • Patent number: 9913417
    Abstract: Provided is a component loading apparatus which includes: a work table comprising a working plane; a component recognizer configured to recognize components placed on the working plane of the work table; a head configured to suck the components; and a tray support for supporting a tray on which the components sucked by the head are loaded. The component loading apparatus further includes: an impurity remover configured to remove impurities attached onto the components in at least one of a first state of being placed on the working plane of the work table and a second state of being sucked by the head; and a tray analyzer configured to inspect loading positions of the components on the tray.
    Type: Grant
    Filed: September 25, 2014
    Date of Patent: March 6, 2018
    Assignee: HANWHA TECHWIN CO., LTD.
    Inventors: Toshiro Hirakawa, Yoichiro Sugimoto, Kazuhiro Takeshita, Kenji Ishiyama
  • Publication number: 20170170040
    Abstract: A substrate processing apparatus includes plural heating modules each including a table on which a substrate is placed to be heated, the substrate having plural heated zones. The table has plural heaters each assigned to heat respective ones of the heated zones. Heat generation of the heaters is controlled independently. A control unit controls the heaters such that integrated quantities of heat of the respective heated zones given by the corresponding heaters from first to second time point are substantially identical to each other in each of the heating modules, and are substantially identical to each other among the heating modules. The first time point is set when a temperature transition profile of the substrate is rising toward a process temperature after placing the substrate on the table under a condition where heat generation of the heaters is stable. The second time point is set after the temperature transition profile reaches the process temperature.
    Type: Application
    Filed: December 14, 2016
    Publication date: June 15, 2017
    Applicant: Tokyo Electron Limited
    Inventors: Kenichi SHIGETOMI, Takeshi SAIKUSA, Eiichi SEKIMOTO, Takayuki FUKUDOME, Kousuke YOSHIHARA, Suguru ENOKIDA, Kazuhiro TAKESHITA, Kazuto UMEKI
  • Publication number: 20170032983
    Abstract: A thermal catalytic layer is formed on the inner surface of a processing container and heated. Thus, when a sublimate sublimated from a coating film on a wafer W and received within the processing container reaches the vicinity of the thermal catalytic layer, the sublimate is decomposed and removed by the thermal activation of the thermal catalytic layer. In removing a sublimate attached to a light transmission window, a cleaning substrate formed with the thermal catalytic layer on the surface thereof is carried into the processing container and caused to approach the light transmission window. Thereafter, the cleaning substrate is heated so that the sublimate attached to the surface of the light transmission window is removed.
    Type: Application
    Filed: July 27, 2016
    Publication date: February 2, 2017
    Inventors: Koshi MUTA, Tsuyoshi MORIYA, Takuya MORI, Kazuhiro TAKESHITA, Tomonori ESAKI, Kouichi MIZUNAGA, Masataka TANAKA, Kouzou KANAGAWA, Keigo NAKANO
  • Patent number: 9305767
    Abstract: There is provided a liquid processing apparatus including a rotation unit configured to hold the target substrate and rotate the target substrate around a vertical axis; a processing solution supply nozzle configured to supply the processing solution to the surface of the target substrate being rotated; a first gas supply unit configured to form a downward flow of a first gas that flows over the entire surface of the target substrate and is introduced into a cup in order to form a processing atmosphere suitable for a liquid process to be performed; and a second gas supply unit configured to form a downward flow of a second gas different from the first gas in a region outside the downward flow of the first gas. The first gas supply unit and the second gas supply unit are provided at a ceiling portion of the housing serving as the processing space.
    Type: Grant
    Filed: March 12, 2012
    Date of Patent: April 5, 2016
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Kenji Nishi, Kazuhiro Takeshita, Nobuhiro Ogata, Satoru Tanaka, Shogo Mizota
  • Publication number: 20150093228
    Abstract: Provided is a component loading apparatus which includes: a work table comprising a working plane; a component recognizer configured to recognize components placed on the working plane of the work table; a head configured to suck the components; and a tray support for supporting a tray on which the components sucked by the head are loaded.
    Type: Application
    Filed: September 25, 2014
    Publication date: April 2, 2015
    Applicant: Samsung Techwin Co., Ltd.
    Inventors: Toshiro HIRAKAWA, Yoichiro SUGIMOTO, Kazuhiro TAKESHITA, Kenji ISHIYAMA
  • Publication number: 20120234356
    Abstract: There is provided a liquid processing apparatus including a rotation unit configured to hold the target substrate and rotate the target substrate around a vertical axis; a processing solution supply nozzle configured to supply the processing solution to the surface of the target substrate being rotated; a first gas supply unit configured to form a downward flow of a first gas that flows over the entire surface of the target substrate and is introduced into a cup in order to form a processing atmosphere suitable for a liquid process to be performed; and a second gas supply unit configured to form a downward flow of a second gas different from the first gas in a region outside the downward flow of the first gas. The first gas supply unit and the second gas supply unit are provided at a ceiling portion of the housing serving as the processing space.
    Type: Application
    Filed: March 12, 2012
    Publication date: September 20, 2012
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Kenji Nishi, Kazuhiro Takeshita, Nobuhiro Ogata, Satoru Tanaka, Shogo Mizota
  • Patent number: 7998306
    Abstract: The present invention provides a substrate processing apparatus for processing substrates by immersing the substrates in a processing liquid. This substrate processing apparatus includes a processing tank having a pair of side walls arranged to be opposed to each other; and a pair of processing-liquid supply mechanisms provided respectively corresponding to the pair of side walls. The pair of processing-liquid supply mechanisms are respectively configured for supplying the processing liquid toward a central portion of the processing tank in the width direction connecting the pair of side walls, thereby to create a rising flow of the processing liquid in a central area in the width direction of the processing tank. Each inner wall face of the pair of side walls includes a main body, a projecting portion located above the main body, and a discharge guide portion located uppermost and providing a discharge port configured for allowing the processing liquid to overflow.
    Type: Grant
    Filed: December 1, 2008
    Date of Patent: August 16, 2011
    Assignee: Tokyo Electron Limited
    Inventors: Koukichi Hiroshiro, Hideyuki Yamamoto, Kazuhiro Takeshita, Takayuki Toshima
  • Publication number: 20090139656
    Abstract: The present invention provides a substrate processing apparatus for processing substrates by immersing the substrates in a processing liquid. This substrate processing apparatus includes a processing tank having a pair of side walls arranged to be opposed to each other; and a pair of processing-liquid supply mechanisms provided respectively corresponding to the pair of side walls. The pair of processing-liquid supply mechanisms are respectively configured for supplying the processing liquid toward a central portion of the processing tank in the width direction connecting the pair of side walls, thereby to create a rising flow of the processing liquid in a central area in the width direction of the processing tank. Each inner wall face of the pair of side walls includes a main body, a projecting portion located above the main body, and a discharge guide portion located uppermost and providing a discharge port configured for allowing the processing liquid to overflow.
    Type: Application
    Filed: December 1, 2008
    Publication date: June 4, 2009
    Inventors: Koukichi Hiroshiro, Hideyuki Yamamoto, Kazuhiro Takeshita, Takayuki Toshima
  • Patent number: 7205024
    Abstract: Prior to transfer of an wafer W, a mixed gas is being generated and exhausted, thereby fluctuation of concentration and temperature of a solvent component at the beginning of gas introduction into a chamber 3 is suppressed. A step of gelling after the wafer W is carried into an aging unit is divided into several steps. Until a temperature of the wafer W reaches a predetermined treatment temperature, an average concentration of the solvent component in a mixed gas is gradually raised relative to the temperature of the wafer W. Thereby, immediately after the wafer W is transferred into a sealed chamber, the gas of the solvent component is prevented from condensing.
    Type: Grant
    Filed: February 5, 2004
    Date of Patent: April 17, 2007
    Assignee: Tokyo Electron Limited
    Inventors: Kazuhiro Takeshita, Shinji Nagashima, Makoto Muramatsu, Yoji Mizutani, Kazutoshi Yano, Kyoshige Katayama