Patents by Inventor Kazuhiro Umemoto

Kazuhiro Umemoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100302183
    Abstract: A touch sensor IC includes a switch for connecting, to an external terminal with its voltage to be sensed, a selected one of a plurality of external terminals to which a plurality of touch electrodes is connected. Only one set of two capacitors and a resistor element may therefore be provided for a plurality of touch electrodes. Thus, the number of required components is smaller as compared with a conventional sensor requiring two capacitors and a resistor element for each touch electrode.
    Type: Application
    Filed: March 25, 2010
    Publication date: December 2, 2010
    Inventors: Teruyuki KOGO, Kazuhiro Umemoto
  • Patent number: 7078629
    Abstract: To prevent, in a multilayer wiring board to which a semiconductor chip is flip-chip bonded, occurrence of cracks in the board at portions adjacent to electrode pads due to a difference in thermal expansion coefficient between the semiconductor chip and the board. A multilayer wiring board (20) of the present invention has features that electrode pads (22) corresponding to electrodes of a semiconductor chip (25) located near an outer periphery (29) of the semiconductor chip each have an oblong shape, openings (35) of a solder resist (23) are each smaller than the oblong shape, and the center (B) of the opening is located to be offset from the center (A) of the oblong shape by a distance (L4) in a direction (30) toward the center of the semiconductor chip. Therefore, in the multilayer wiring board of the present invention, thermal stresses applied to portions (L3) of the electrode pads (22) on the board near the outer periphery of the semiconductor chip are relaxed.
    Type: Grant
    Filed: September 29, 2004
    Date of Patent: July 18, 2006
    Assignee: International Business Machines Corporation
    Inventor: Kazuhiro Umemoto
  • Publication number: 20050087364
    Abstract: To prevent, in a multilayer wiring board to which a semiconductor chip is flip-chip bonded, occurrence of cracks in the board at portions adjacent to electrode pads due to a difference in thermal expansion coefficient between the semiconductor chip and the board. A multilayer wiring board (20) of the present invention has features that electrode pads (22) corresponding to electrodes of a semiconductor chip (25) located near an outer periphery (29) of the semiconductor chip each have an oblong shape, openings (35) of a solder resist (23) are each smaller than the oblong shape, and the center (B) of the opening is located to be offset from the center (A) of the oblong shape by a distance (L4) in a direction (30) toward the center of the semiconductor chip. Therefore, in the multilayer wiring board of the present invention, thermal stresses applied to portions (L3) of the electrode pads (22) on the board near the outer periphery of the semiconductor chip are relaxed.
    Type: Application
    Filed: September 29, 2004
    Publication date: April 28, 2005
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventor: Kazuhiro Umemoto
  • Patent number: 6818169
    Abstract: A molding device and method utilizes a cavity including fast and second parts for molding an article having one or more convex portions and a gate for injecting mold resin into the cavity. The gate in turn includes one or more gate sides for injecting resin into a concave portion of one part and a gate base for injecting resin into a second of the parts in which no concave portions are located, both resin injections occurring simultaneously and substantially encapsulating a semiconductor element to form a molded article having a convex lens.
    Type: Grant
    Filed: April 2, 2003
    Date of Patent: November 16, 2004
    Assignee: International Business Machines Corporation
    Inventor: Kazuhiro Umemoto
  • Publication number: 20040188852
    Abstract: A semiconductor device having two or more semiconductor chips stacked upon one another in a manner that makes them less susceptible to damage from warping of the semiconductor device.
    Type: Application
    Filed: March 26, 2004
    Publication date: September 30, 2004
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Kazuhiro Umemoto, Satsuo Kiyono
  • Publication number: 20030201569
    Abstract: A molding device and method utilizes a cavity including fast and second parts for molding an article having one or more convex portions and a gate for injecting mold resin into the cavity. The gate in turn includes one or more gate sides for injecting resin into a concave portion of one part and a gate base for injecting resin into a second of the parts in which no concave portions are located, both resin injections occurring simultaneously and substantially encapsulating a semiconductor element to form a molded article having a convex lens.
    Type: Application
    Filed: April 2, 2003
    Publication date: October 30, 2003
    Applicant: International Business Machines Corporation
    Inventor: Kazuhiro Umemoto
  • Patent number: 6561782
    Abstract: A molding device and method utilizes a cavity including first and second parts for molding an article having one or more convex portions and a gate for injecting mold resin into the cavity. The gate in turn includes one or more gate sides for injecting resin into a concave portion of one part and a gate base for injecting resin into a second of the parts in which no concave portions are located, both resin injections occurring simultaneously and substantially encapsulating a semiconductor element to form a molded article having a convex lens.
    Type: Grant
    Filed: September 27, 2000
    Date of Patent: May 13, 2003
    Assignee: International Business Machines Corporation
    Inventor: Kazuhiro Umemoto
  • Patent number: 5572346
    Abstract: In an LCD driver package using a TAB tape carrier an object of this invention is to prevent damage to the input leads from being caused under the influence of the twisting or wrinkling of TAB tape due to the difference in thermal expansion coefficient between the printed circuit board and the LCD glass board, and so forth. At least one pair of anchor hole 40are formed in the TAB tape carrier 10 of an LCD driver package having input leads 12 connected to a printed circuit board 24, output leads 14 connected to an LCD glass board 26, and a chip 22, the tape carrier 10 being fixed on the printed circuit board 24 with solder or an adhesive using anchor holes 40 after mounting of the LCD driver chip. Fixing through such anchor holes prevents the twisting or wrinkling of the tape from propagating to the input leads.
    Type: Grant
    Filed: November 28, 1994
    Date of Patent: November 5, 1996
    Assignee: International Business Machines Corporation
    Inventors: Kazunori Sakamoto, Kazuhiro Umemoto