Abstract: An exhaust purification system of an internal combustion engine comprising an NOX holding material arranged in an engine exhaust passage, having a catalyst metal containing silver, holding NOX contained in the exhaust gas in the form of silver nitrate by the catalyst metal when an air-fuel ratio of inflowing exhaust gas is lean, and releasing the held NOX if the air-fuel ratio of the inflowing exhaust gas becomes a stoichiometric air-fuel ratio or rich. The NOX holding material has a scatter temperature at which catalyst metal scatters in the form of silver nitrate if the temperature rises. When it is time to perform control raising the temperature of the NO holding material to the scatter temperature or above, the NOX held in the NOX holding material is released by making the air-fuel ratio of the exhaust gas flowing into the NO holding material the stoichiometric air-fuel ratio or rich.

Abstract: A touch sensor IC includes a switch for connecting, to an external terminal with its voltage to be sensed, a selected one of a plurality of external terminals to which a plurality of touch electrodes is connected. Only one set of two capacitors and a resistor element may therefore be provided for a plurality of touch electrodes. Thus, the number of required components is smaller as compared with a conventional sensor requiring two capacitors and a resistor element for each touch electrode.

Abstract: To prevent, in a multilayer wiring board to which a semiconductor chip is flip-chip bonded, occurrence of cracks in the board at portions adjacent to electrode pads due to a difference in thermal expansion coefficient between the semiconductor chip and the board. A multilayer wiring board (20) of the present invention has features that electrode pads (22) corresponding to electrodes of a semiconductor chip (25) located near an outer periphery (29) of the semiconductor chip each have an oblong shape, openings (35) of a solder resist (23) are each smaller than the oblong shape, and the center (B) of the opening is located to be offset from the center (A) of the oblong shape by a distance (L4) in a direction (30) toward the center of the semiconductor chip. Therefore, in the multilayer wiring board of the present invention, thermal stresses applied to portions (L3) of the electrode pads (22) on the board near the outer periphery of the semiconductor chip are relaxed.

Abstract: To prevent, in a multilayer wiring board to which a semiconductor chip is flip-chip bonded, occurrence of cracks in the board at portions adjacent to electrode pads due to a difference in thermal expansion coefficient between the semiconductor chip and the board. A multilayer wiring board (20) of the present invention has features that electrode pads (22) corresponding to electrodes of a semiconductor chip (25) located near an outer periphery (29) of the semiconductor chip each have an oblong shape, openings (35) of a solder resist (23) are each smaller than the oblong shape, and the center (B) of the opening is located to be offset from the center (A) of the oblong shape by a distance (L4) in a direction (30) toward the center of the semiconductor chip. Therefore, in the multilayer wiring board of the present invention, thermal stresses applied to portions (L3) of the electrode pads (22) on the board near the outer periphery of the semiconductor chip are relaxed.

Abstract: A molding device and method utilizes a cavity including fast and second parts for molding an article having one or more convex portions and a gate for injecting mold resin into the cavity. The gate in turn includes one or more gate sides for injecting resin into a concave portion of one part and a gate base for injecting resin into a second of the parts in which no concave portions are located, both resin injections occurring simultaneously and substantially encapsulating a semiconductor element to form a molded article having a convex lens.

Abstract: A semiconductor device having two or more semiconductor chips stacked upon one another in a manner that makes them less susceptible to damage from warping of the semiconductor device.

Abstract: A molding device and method utilizes a cavity including fast and second parts for molding an article having one or more convex portions and a gate for injecting mold resin into the cavity. The gate in turn includes one or more gate sides for injecting resin into a concave portion of one part and a gate base for injecting resin into a second of the parts in which no concave portions are located, both resin injections occurring simultaneously and substantially encapsulating a semiconductor element to form a molded article having a convex lens.

Abstract: A molding device and method utilizes a cavity including first and second parts for molding an article having one or more convex portions and a gate for injecting mold resin into the cavity. The gate in turn includes one or more gate sides for injecting resin into a concave portion of one part and a gate base for injecting resin into a second of the parts in which no concave portions are located, both resin injections occurring simultaneously and substantially encapsulating a semiconductor element to form a molded article having a convex lens.

Abstract: In an LCD driver package using a TAB tape carrier an object of this invention is to prevent damage to the input leads from being caused under the influence of the twisting or wrinkling of TAB tape due to the difference in thermal expansion coefficient between the printed circuit board and the LCD glass board, and so forth. At least one pair of anchor hole 40are formed in the TAB tape carrier 10 of an LCD driver package having input leads 12 connected to a printed circuit board 24, output leads 14 connected to an LCD glass board 26, and a chip 22, the tape carrier 10 being fixed on the printed circuit board 24 with solder or an adhesive using anchor holes 40 after mounting of the LCD driver chip. Fixing through such anchor holes prevents the twisting or wrinkling of the tape from propagating to the input leads.