Abstract: A radiation detector includes a sensor panel having a light receiving surface, a first scintillator panel and a second scintillator panel disposed on the light receiving surface in a state of being adjacent to each other along the light receiving surface, and an adhesive layer. The first scintillator panel has a first substrate and a first scintillator layer including a plurality of columnar crystals. The second scintillator panel has a second substrate and a second scintillator layer including a plurality of columnar crystals. The first scintillator layer reaches at least a first portion of the first substrate. The second scintillator layer reaches at least a second portion of the second substrate. The adhesive layer is provided continuous over the first scintillator panel and the second scintillator panel.

Abstract: A scintillator panel includes a substrate made of an organic material, a barrier layer formed on the substrate and including thallium iodide as a main component, and a scintillator layer formed on the barrier layer and including cesium iodide as a main component. According to this scintillator panel, moisture resistance can be improved by providing the barrier layer between the substrate and the scintillator layer.

Abstract: A scintillator panel includes: a first flexible support body having a first surface and a second surface on a side opposite to the first surface; a scintillator layer formed on the first surface and containing a plurality of columnar crystals; a second flexible support body provided on the second surface; an inorganic layer provided on the second flexible support body so as to be interposed between the second surface and the second flexible support body; and a first adhesive layer bonding the second surface and the inorganic layer to each other. A radiation detector includes: the scintillator panel; and a sensor panel including a photoelectric conversion element, in which the scintillator panel is provided on the sensor panel such that the first surface is on the sensor panel side with respect to the second surface.

Abstract: A radiation detector includes: a sensor panel; a scintillator panel; and a resin frame provided across the sensor panel and the scintillator panel, in which the sensor panel has a mounting surface where the scintillator panel is mounted, the scintillator panel includes a support body having a first surface, a second surface on a side opposite to the first surface, and a first side surface connecting the first surface and the second surface to each other, and a scintillator layer formed on the first surface and containing a plurality of columnar crystals, the scintillator panel is mounted on the mounting surface such that the scintillator layer and the first surface face the mounting surface, and the scintillator layer has a second side surface extending so as to be positioned on the same plane as the first side surface.

Abstract: A transmission line board includes an insulating substrate including a first principal surface, first and second signal lines, first and second signal electrodes, which are provided at the insulating substrate. The first signal electrode is connected to the first signal line, and is connected by capacitive coupling to a different circuit board. The second signal electrode is connected to the second signal line, and is connected to the different circuit board via a conductive binder. The first signal line is provided to transmit a signal in a first frequency band, and the second signal line is provided to transmit a signal in a second frequency band lower than the first frequency band.

Abstract: A multilayer substrate includes a laminate, first and second signal lines, first and second ground conductors, and interlayer connection conductors. The first and second signal lines extend along a transmission direction and include parallel extending portions that extend in parallel or substantially in parallel with each other. The first and second ground conductors sandwich the first and second signal lines in a laminating direction. The first and second ground conductors respectively include a first opening and a third opening between the signal lines when viewed from the laminating direction, and respectively include second openings and fourth openings disposed outside in a width direction orthogonal or substantially orthogonal to the transmission direction in the parallel extending portions when viewed from the laminating direction. The interlayer connection conductors are disposed in the transmission direction and at least between the signal lines.

Abstract: A manufacturing method for an optical semiconductor device includes: forming a first semiconductor layer; forming a first mask pattern on the first semiconductor layer in a first area where an electro absorption type modulator is formed; forming an unevenness along the first direction on the first semiconductor layer; forming a second semiconductor layer on the unevenness; and forming an optical waveguide layer on the second semiconductor layer. The first mask pattern includes a first pattern in the first area and a second pattern in a second area where a DFB laser is formed, the first pattern including a first opening pattern and a first cover pattern, and the second pattern including a second opening pattern and a second cover pattern, and a ratio of the first opening pattern to the first cover pattern is different from that of the second opening pattern to the second cover pattern.

Abstract: A transmission line board includes an insulating substrate including a first principal surface, first and second signal lines, first and second signal electrodes, which are provided at the insulating substrate. The first signal electrode is connected to the first signal line, and is connected by capacitive coupling to a different circuit board. The second signal electrode is connected to the second signal line, and is connected to the different circuit board via a conductive binder. The first signal line is provided to transmit a signal in a first frequency band, and the second signal line is provided to transmit a signal in a second frequency band lower than the first frequency band.

Abstract: A multilayer substrate includes a laminate, first and second signal lines, first and second ground conductors, and interlayer connection conductors. The first and second signal lines extend along a transmission direction and include parallel extending portions that extend in parallel or substantially in parallel with each other. The first and second ground conductors sandwich the first and second signal lines in a laminating direction. The first and second ground conductors respectively include a first opening and a third opening between the signal lines when viewed from the laminating direction, and respectively include second openings and fourth openings disposed outside in a width direction orthogonal or substantially orthogonal to the transmission direction in the parallel extending portions when viewed from the laminating direction. The interlayer connection conductors are disposed in the transmission direction and at least between the signal lines.

Abstract: An optical module including a source assembly is disclosed. The source assembly provides a semiconductor optical device, a wiring substrate, and a bridge substrate. The semiconductor optical device includes an electrode and a pad that receives a driving signal therethrough. The wiring substrate, which is arranged side by side with respect to the semiconductor optical device, provides a signal line and a ground line surrounding the signal line. The bridge substrate includes a signal line and a ground line surrounding the signal line. A feature of the optical module is that the bridge substrate is placed on the semiconductor optical device and the wiring substrate such that a transmission line thereof faces the semiconductor optical device and the wiring substrate, and one end of the signal line thereof is connected with the pad of the semiconductor optical device through a post, and another end of the signal line thereof is connected with an end of the signal line in the wiring substrate through another post.

Abstract: A manufacturing method for an optical semiconductor device includes: forming a first semiconductor layer; forming a first mask pattern on the first semiconductor layer in a first area where an electro absorption type modulator is formed; forming an evenness along the first direction on the first semiconductor layer; forming a second semiconductor layer on the unevenness; and forming an optical waveguide layer on the second semiconductor layer. The first mask pattern includes a first pattern in the first area and a second pattern in a second area where a DFB laser is formed, the first pattern including a first opening pattern and a first cover pattern, and the second pattern including a second opening pattern and a second cover pattern, and a ratio of the first opening pattern to the first cover pattern is different from that of the second opening pattern to the second cover pattern.

Abstract: An optical module and a method of assembling the optical module are disclosed. The optical module comprises a laser unit, a modulator unit, and a detector unit mounted on respective thermo-electric coolers (TECs). The modulator unit, which is arranged on an optical axis of the first output port from which a modulated beam is output, modulates the continuous wave (CW) beam output from the laser unit. On the other hand, the laser unit and the detector unit are arranged on another optical axis of the second output port from which another CW beam is output. The method of assembling the optical module first aligns one of the first combination of the laser unit and the modulator unit with the first output port and the second combination of the laser unit and the detector unit, and then aligns another of the first combination and the second combination.

Abstract: An optical module including a source assembly is disclosed. The source assembly provides a semiconductor optical device, a wiring substrate, and a bridge substrate. The semiconductor optical device includes an electrode and a pad that receives a driving signal therethrough. The wiring substrate, which is arranged side by side with respect to the semiconductor optical device, provides a signal line and a ground line surrounding the signal line. The bridge substrate includes a signal line and a ground line surrounding the signal line. A feature of the optical module is that the bridge substrate is placed on the semiconductor optical device and the wiring substrate such that a transmission line thereof faces the semiconductor optical device and the wiring substrate, and one end of the signal line thereof is connected with the pad of the semiconductor optical device through a post, and another end of the signal line thereof is connected with an end of the signal line in the wiring substrate through another post.

Abstract: An optical module and a method of assembling the optical module are disclosed. The optical module comprises a laser unit, a modulator unit, and a detector unit mounted on respective thermo-electric coolers (TECs). The modulator unit, which is arranged on an optical axis of the first output port from which a modulated beam is output, modulates the continuous wave (CW) beam output from the laser unit. On the other hand, the laser unit and the detector unit are arranged on another optical axis of the second output port from which another CW beam is output. The method of assembling the optical module first aligns one of the first combination of the laser unit and the modulator unit with the first output port and the second combination of the laser unit and the detector unit, and then aligns another of the first combination and the second combination.

Abstract: An optical module and a method of assembling the optical module are disclosed. The optical module comprises a laser unit, a modulator unit, and a detector unit mounted on respective thermo-electric coolers (TECs). The modulator unit, which is arranged on an optical axis of the first output port from which a modulated beam is output, modulates the continuous wave (CW) beam output from the laser unit. On the other hand, the laser unit and the detector unit are arranged on another optical axis of the second output port from which another CW beam is output. The method of assembling the optical module first aligns one of the first combination of the laser unit and the modulator unit with the first output port and the second combination of the laser unit and the detector unit, and then aligns another of the first combination and the second combination.

Abstract: An optical module and a method of assembling the optical module are disclosed. The optical module comprises a laser unit, a modulator unit, and a detector unit mounted on respective thermo-electric coolers (TECs). The modulator unit, which is arranged on an optical axis of the first output port from which a modulated beam is output, modulates the continuous wave (CW) beam output from the laser unit. On the other hand, the laser unit and the detector unit are arranged on another optical axis of the second output port from which another CW beam is output. The method of assembling the optical module first aligns one of the first combination of the laser unit and the modulator unit with the first output port and the second combination of the laser unit and the detector unit, and then aligns another of the first combination and the second combination.

Abstract: A biological information measurement apparatus capable of improving the SN ratio of a photoplethysmographic signal by reducing stray light in detection light that reaches a light-receiving unit from a light-emitting unit is provided. A biological information measurement apparatus includes a light-emitting unit that irradiates a finger, a light-receiving unit that receives and photoelectrically converts light transmitted through or reflected by the finger and outputs a photoplethysmographic signal, and a processing unit that obtains biological information on the basis of the photoplethysmographic signal. The light-emitting and light-receiving units are disposed, in plan view in a plane perpendicular to the direction of the emitted light or the received light, such that a line passing through the centers of the light-emitting unit and the light-receiving unit is slanted relative to a lengthwise direction of the finger.

Abstract: An optical coupling system to couple a collimated beam with a waveguide made of semiconductor materials is disclosed. The waveguide is implemented in an optical modulator and/or an optical hybrid, and has a core with a restricted cross section because of the enhanced refractive index of the semiconductor materials. The collimated beam is focused on the core by the two-lens system including first and second lenses. The first lens, having a focal length shorter than a focal length of the second lens, is first aligned with the core, then, the second lens is aligned with the core as compensating deviations of the first lens induced during the fixation thereof.

Abstract: An optical module and a method of assembling the optical module are disclosed. The optical module comprises a laser unit, a modulator unit, and a detector unit mounted on respective thermo-electric coolers (TECs). The modulator unit, which is arranged on an optical axis of the first output port from which a modulated beam is output, modulates the continuous wave (CW) beam output from the laser unit. On the other hand, the laser unit and the detector unit are arranged on another optical axis of the second output port from which another CW beam is output. The method of assembling the optical module first aligns one of the first combination of the laser unit and the modulator unit with the first output port and the second combination of the laser unit and the detector unit, and then aligns another of the first combination and the second combination.

Abstract: An optical coupling system to couple a collimated beam with a waveguide made of semiconductor materials is disclosed. The waveguide is implemented in an optical modulator and/or an optical hybrid, and has a core with a restricted cross section because of the enhanced refractive index of the semiconductor materials. The collimated beam is focused on the core by the two-lens system including first and second lenses. The first lens, having a focal length shorter than a focal length of the second lens, is first aligned with the core, then, the second lens is aligned with the core as compensating deviations of the first lens induced during the fixation thereof.