Abstract: An MFP system includes a master device and a slave device. The slave device includes an operation acceptor, and an image reader, and is capable of communicating among a plurality of MFPs. The slave device includes an other-MFP transmission requester that makes a request to another MFP such that image data is transmitted by FAX transmission to a transmission destination. The master device includes an associator that, when an other-MFP transmission request is accepted from the slave device, associates and stores transmission destination information and the slave device, and when image data is received from the outside, the master device determines whether or not information of a transmission destination to which the image data was transmitted is stored in the associator, and if the information of the transmission destination is stored in the associator, transmits the image data received from the outside to the associated slave device.

Abstract: An output system includes a terminal device, an image-forming apparatus, and a server device. The terminal device includes an acquirer that acquires content from the server device, a generator that generates job data including a setting for outputting the content based on the acquired content, a transmitter that transmits the job data to the image-forming apparatus, and a reception slip outputter that outputs a reception slip including a reception number corresponding to the generated job data. The image-forming apparatus includes a receiver that receives the job data from the terminal device, and an outputter that outputs the content after executing a job based on the job data corresponding to the reception number when the reception number is input.

Abstract: A printing control system comprising: a plurality of image forming apparatuses set as parent units; and a plurality of image forming apparatuses set as child units, all of which are connected together through a network, wherein a child of the child units unit obtains a job list response from any one of the parent units either storing a print data item to be identified with a job name of a print data item included in a job list information item requested by a job list request, or not storing the print data item.

Abstract: A printing control system includes: parent units and child units connected together through a network, the parent units including a first memory, and the child units including: a second memory; a job list request provider that transmits a job list request to connectable parent units and a job list response obtainer that obtains a job list response sent back. If a first child unit detects a parent unit not sending back the job list response within a predetermined time period, the first child unit stores, in a non-response parent unit information item, the parent unit not sending back the job list response, and when the first child unit transmits the job list request at a next time, the first child unit transmits the job list request to a parent unit other than the parent unit stored in the non-response parent unit information item.

Abstract: A printing system includes a plurality of image forming apparatuses capable of mutually communicating with a portable terminal device and a client terminal device. The client terminal device generates a print job that includes print data and job information. The portable terminal device stores job information transmitted from the client terminal device. The image forming apparatus acquires the job information from the portable terminal device, acquires the print data corresponding to the job information from the client terminal device, and execute image output the print data.

Abstract: A printing system includes a plurality of image forming apparatuses capable of mutually communicating with a portable terminal device and a client terminal device. The client terminal device generates a print job that includes print data and job information. The portable terminal device stores job information transmitted from the client terminal device. The image forming apparatus acquires the job information from the portable terminal device, acquires the print data corresponding to the job information from the client terminal device, and execute image output the print data.

Abstract: A printing control system comprising: a plurality of image forming apparatuses set as parent units; and a plurality of image forming apparatuses set as child units, all of which are connected together through a network, wherein a child of the child units unit obtains a job list response from any one of the parent units either storing a print data item to be identified with a job name of a print data item included in a job list information item requested by a job list request, or not storing the print data item.

Abstract: A printing control system includes: parent units and child units connected together through a network, the parent units including a first memory, and the child units including: a second memory; a job list request provider that transmits a job list request to connectable parent units and a job list response obtainer that obtains a job list response sent back. If a first child unit detects a parent unit not sending back the job list response within a predetermined time period, the first child unit stores, in a non-response parent unit information item, the parent unit not sending back the job list response, and when the first child unit transmits the job list request at a next time, the first child unit transmits the job list request to a parent unit other than the parent unit stored in the non-response parent unit information item.

Abstract: To provide a bonding apparatus capable of increasing product quality by realizing high-precision control of a pressing force applied upon mounting of an electronic component on a substrate by bonding, and to a bonding method capable of providing high-quality products stably. The bonding apparatus includes: at least a bonding head 100 for pressing an electronic component 6 against a substrate 1 to bond it to the substrate 1; a plurality of load detection mechanisms (e.g., load sensors 5) substantially equally spaced so as to face one another under a substrate stage S supporting the substrate 1 provided with the electronic component 6; and a pressure detection unit 20 for detecting pressing force at the bonding surface between the electronic component 6 and substrate 1 on the basis of the pressure values detected by the individual load detection mechanisms 5.

Abstract: To provide a bonding apparatus capable of increasing product quality by realizing high-precision control of a pressing force applied upon mounting of an electronic component on a substrate by bonding, and to a bonding method capable of providing high-quality products stably. The bonding apparatus includes: at least a bonding head 100 for pressing an electronic component 6 against a substrate 1 to bond it to the substrate 1; a plurality of load detection mechanisms (e.g., load sensors 5) substantially equally spaced so as to face one another under a substrate stage S supporting the substrate 1 provided with the electronic component 6; and a pressure detection unit 20 for detecting pressing force at the bonding surface between the electronic component 6 and substrate 1 on the basis of the pressure values detected by the individual load detection mechanisms 5.

Abstract: A catalyst for purification of exhaust gas, in which a noble metal is supported on a metal oxide support, has a basic site content of 1 mmol/L-cat or less, as determined on the basis of an amount of CO2 desorbed per liter of the catalyst as measured by a CO2 temperature-programmed desorption method.

Abstract: A method for manufacturing a semiconductor device includes adhering an adhesive layer of a surface protective tape including a base material film, an intermediate layer disposed on the base material film, and the adhesive layer disposed on the intermediate layer to one surface of a semiconductor substrate; curing the intermediate layer while a flat plate is pressed against the base material film of the surface protective tape; grinding the other surface of the semiconductor substrate; curing the adhesive layer; and separating the surface protective tape from the semiconductor substrate.

Abstract: A method of manufacturing a semiconductor device includes spraying fluid onto a surface of a treatment target substrate including a semiconductor substrate; forming a protection layer on the surface of the treatment target substrate after spraying the fluid; selectively removing the protection layer and a part of the treatment target substrate by an energy beam; and conducting removal processing on an area of the treatment target substrate from which the protection layer and the part of the treatment target substrate are selectively removed.

Abstract: An image processing apparatus has a function of printing pieces of image data to be printed arranging them on one printing paper sheet. In a preview display screen of the image processing apparatus, when a specific piece of image data is selected by a user's operation from a plural piece of image data, the specific piece of image data is displayed being distinguished. Pieces of image data in the same shooting orientation as that of the specific piece of image data are searched for and their display is similarly varied. At this time, when rotation of the images is selected using a dialogue, the orientation of the pieces of image data is rotated at once by 180°. Thereby, the orientations of pieces of image data shot in a portrait-like posture may easily be adjusted to be the same and their images may be printed according to the preview display.

Abstract: A film bonding method of bonding a die bond film without causing any breakage. The die bond film is pressed against a wafer having a surface protective tape bonded thereto using a film-setting roller and a film-bonding roller, and a laser beam having a predetermined shape is irradiated to an area between the rollers. While rotationally moving the film-setting roller and the film-bonding roller, the laser beam is scanned on the wafer in accordance with their motion, and a portion of the die bond film, melted by the laser beam, is pressed against the wafer by the film-bonding roller following the film-setting roller to bond the die bond film to the wafer. Since the die bond film is bonded to the wafer by melting the same by the laser beam, even if the wafer is thin and reduced in its strength, it is possible to avoid the wafer from being damaged e.g. by thermal contraction of the surface protective tape.

Abstract: A method for manufacturing a semiconductor device includes adhering an adhesive layer of a surface protective tape including a base material film, an intermediate layer disposed on the base material film, and the adhesive layer disposed on the intermediate layer to one surface of a semiconductor substrate; curing the intermediate layer while a flat plate is pressed against the base material film of the surface protective tape; grinding the other surface of the semiconductor substrate; curing the adhesive layer; and separating the surface protective tape from the semiconductor substrate.

Abstract: A catalyst for purification of exhaust gas, in which a noble metal is supported on a metal oxide support, has a basic site content of 1 mmol/L-cat or less, as determined on the basis of an amount of CO2 desorbed per liter of the catalyst as measured by a CO2 temperature-programmed desorption method.

Abstract: To provide a bonding apparatus capable of increasing product quality by realizing high-precision control of a pressing force applied upon mounting of an electronic component on a substrate by bonding, and to a bonding method capable of providing high-quality products stably. The bonding apparatus includes: at least a bonding head 100 for pressing an electronic component 6 against a substrate 1 to bond it to the substrate 1; a plurality of load detection mechanisms (e.g., load sensors 5) substantially equally spaced so as to face one another under a substrate stage S supporting the substrate 1 provided with the electronic component 6; and a pressure detection unit 20 for detecting pressing force at the bonding surface between the electronic component 6 and substrate 1 on the basis of the pressure values detected by the individual load detection mechanisms 5.

Abstract: A semiconductor wafer storage case is disclosed that includes plural support members that are spaced at predetermined intervals with respect to each other and are each configured to come into contact with a peripheral edge region of a first face of a semiconductor wafer, and an elastic member that elastically supports the support members with respect to each other and is configured to elastically deform to come into contact with a second face of the semiconductor wafer and press the semiconductor wafer onto a corresponding support member.

Abstract: A manufacturing method of a semiconductor device includes providing an adhesive on a supporting board, the supporting board being where a semiconductor element is to be mounted; providing a member configured to block flow of the adhesive on a first main surface of the semiconductor element, the semiconductor element having a second main surface where an outside connection terminal is provided; mounting the semiconductor element on a part of the supporting board where the adhesive is provided by pressing the semiconductor element via the member.