Patents by Inventor Kazuhisa Okada

Kazuhisa Okada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer prober
    Patent number: 5010296
    Abstract: A wafer prober includes a supporting device for supporting a wafer on which a plurality of electrode pads are disposed, a plurality of probes for contacting respective electrode pads, a spraying device for spraying a gas onto the electrode pads contacted by the plurality of probes, and an aspirating device for aspirating waste generated by the contact of the probes with the electrode pads and carried by the gas.
    Type: Grant
    Filed: March 12, 1990
    Date of Patent: April 23, 1991
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Kazuhisa Okada, Ichirou Kusumoto