Abstract: An X-ray tube includes a radiopaque substrate including a window portion, an X-ray transmission window closing the window portion, an X-ray target provided at the window portion from an inner surface side of the substrate, a highly-evacuated container portion attached to the inner surface of the substrate, a cathode, a first control electrode and a second control electrode provided inside the container portion. A shielding electrode is provided at the inner surface of the substrate so as to surround the window portion. Electrons collide with the X-ray target to generate X-rays. Electrons reflected on the X-ray target between the shielding electrodes are absorbed by the shielding electrodes, so an inner surface of the container portion is not charged. The electron emission from the cathode is not affected by the reflected electrons, so a change in target current is small, and thus X-rays of substantially constant intensity can be radiated.

Abstract: The invention provides a new ultraviolet light-emitting material and ultraviolet light source in which bacteriocidal performance, operating life, and luminescence efficiency are enhanced without any risk of adversely affecting human bodies. An ultraviolet light-emitting material has a composition as represented by Formula (A): (Al1?xScx)2O3??(A) where a dopant, Sc is added to a matrix, Al2O3, and x satisfies 0<x<1.

Abstract: An X-ray tube is disclosed. The X-ray tube includes a substrate, a box-shaped case attached to the substrate and being in a high-vacuum state, an X-ray target arranged in the opening of the first substrate in the inside of the case, and a cathode arranged in the case and supplying an electron to the X-ray target. The substrate includes first and second substrates made of 426 alloy and respectively having an opening of honeycomb structure, and an X-ray transmissive window sandwiched between the first and second substrates which is made of a titanium foil and close the opening. The X-ray transmissive window is reinforced by a honeycomb structure of the substrate from both surfaces. Thus, the substrate and the X-ray transmissive window are not deformed, and strength of the package is improved.

Abstract: An indirect matrix converter includes a converter (2) connected through a positive polarity bus (4p) and a negative polarity bus (4n) to an inverter (6). A clamp diode (28u) has its anode connected to the positive polarity bus (4p) and has its cathode connected to one end of a capacitor (30). The other end of the capacitor (30) is connected to the anode of a clamp diode (28d) of which cathode is connected to the negative polarity bus (4n). Upper discharge preventing snubber circuits (20u) are provided for switch devices (16uu through 16uw) of the inverter (6), and lower discharge preventing snubber circuits (20d) are provided for switch devices (16du through 16dw) of the inverter (6). Discharge resistors (26u) of the upper discharge preventing snubber circuits (20u) are connected to the anode of the diode (28d), and discharge resistors (26d) of the lower discharge preventing snubber circuits (20d) are connected to the cathode of the diode (28u).

Abstract: A generator connected to an engine generates AC power. A converter is connected to the generator, and an inverter for controlling the electric power to a rotation electric motor is connected to the converter. The converter and the inverter are formed of IGBTs connected between power supply lines and the rotation electric motor. The AC power from the generator is converted directly to AC power which can be supplied to the rotation electric motor.

Abstract: [Object] When total power required by a hybrid construction machine increases above output power available from a driving source, power supplied to a rotation motor is restricted. [Means to Realize Object] Driving power from an engine 2 is distributed to a hydraulic pump 6 and a generator 4. Electric power generated by the generator 4 is used to drive a rotation motor 12, and pressurized oil provided by the hydraulic pump 6 is used to drive a hydraulic machine 14. When both of the hydraulic machine 14 and the rotation motor 12 are simultaneously manipulated, the output power outputted by the engine 2 and the required power required by the hydraulic machine 14 and the rotation motor 12 are detected. When the required power exceeds the output power, the torque or acceleration of the rotation motor 12 is restricted to preferentially provide output power to the hydraulic machine 14.

Abstract: An imaging apparatus includes an electron emission array having electron sources arranged in matrix form, a photoelectric conversion film opposed to the electron emission array, and a control and drive circuit configured to select one or more horizontal scan lines in a given video signal output period and to cause the electron sources included in the selected one or more horizontal scan lines to emit electrons toward the photoelectric conversion film, wherein the control and drive circuit is further configured to cause the electron sources included in the selected one or more horizontal scan lines to emit electrons toward the photoelectric conversion film in any one or more blanking periods excluding both a blanking period immediately following the given video signal output period and a blanking period immediately preceding a next video signal output period in which the one or more horizontal scan lines will be selected next time.

Abstract: Electron-emissive drive units of electron-emissive elements capable of being arranged with a smaller pitch. FET and emitter array units exist in matrix element areas partitioned by a control wiring and data wiring. An exemplary unit is composed of four emitter arrays. The control wiring and data wiring are driven by first and second drive circuits, respectively. Corresponding arrays between units are connected by selection wiring and driven by a third drive circuit. The third drive circuit drives each unit of data wiring every time the drive circuit sequentially drives the four units of control wiring, and the emitter array drive circuit drives each emitter array selection wiring every time the drive circuit sequentially drives the three units of data wiring. Electrons can be emitted in units of arrays smaller than the unit.

Abstract: An imaging apparatus includes an electron emission array having electron sources arranged in matrix form and having a plurality of horizontal scan lines, a photoelectric conversion film opposed to the electron emission array, and a control and drive circuit configured to select one or more of the horizontal scan lines in a given video signal output period and to cause the electron sources included in the selected one or more horizontal scan lines to emit electrons toward the photoelectric conversion film to produce a video signal, wherein the control and drive circuit is configured to cause the electron sources included in unselected one or more horizontal scan lines not selected in the given video signal output period to emit electrons toward the photoelectric conversion film in a blanking period immediately preceding the given video signal output period.

Abstract: An imaging apparatus includes an electron emission array having electron sources arranged in matrix form and having a plurality of horizontal scan lines, a photoelectric conversion film opposed to the electron emission array, and a control and drive circuit configured to select one or more of the horizontal scan lines in a given video signal output period and to cause the electron sources included in the selected one or more horizontal scan lines to emit electrons toward the photoelectric conversion film to produce a video signal, wherein the control and drive circuit is configured to control electron emission of the electron emission array in a blanking period in response to a signal level of the video signal produced in the given video signal output period.

Abstract: A substrate is disposed in a processing chamber. An organic Ta compound gas having Ta?N bond, a Si-containing gas and a N-containing gas are introduced into the processing chamber to form a TaSiN film on the substrate by CVD. In this film formation, at least one of a partial pressure of the Si-containing gas in the processing chamber, a total pressure in the processing chamber, a film forming temperature and a partial pressure of the N-containing gas in the processing chamber is controlled to thereby regulate Si concentration in the film. Particularly, when SiH4 gas is used as the Si-containing gas, the SiH4 gas partial pressure is determined based on the fact that the serried Si concentration in the film under giving process conditions can be expressed as a linear function involving the logarithm of the partial pressure of the SiH4 gas.

Abstract: The present invention is a method of film deposition that comprises a first gas-supplying step of supplying a high-melting-point organometallic material gas to a processing vessel that can be evacuated, and a second gas-supplying step of supplying, to the processing vessel, a gas consisting of one, or two or more gases selected from a nitrogen-containing gas, a silicon-containing gas, and a carbon-containing gas, wherein a thin metallic compound film composed of one, or two or more compounds selected from a high-melting-point metallic nitride, a high-melting-point metallic silicate, and a high-melting-point metallic carbide is deposited on the surface of an object to be processed, placed in the processing vessel. The first and second gas-supplying steps are alternately carried out, and in these steps, the object to be processed is held at a temperature equal to or higher than the decomposition-starting temperature of the high-melting-point organometallic material.

Abstract: A method for processing a substrate includes a film forming step of supplying a film forming gas into the processing chamber to form a film on the substrate, a cleaning step of supplying a plasma-exited cleaning gas into the processing chamber after the film forming step to clean the inside of the processing chamber, and a coating step of forming a coating within the processing chamber after the cleaning step. The cleaning step includes a high pressure cleaning of regulating the pressure in the processing chamber so that cleaning is mainly performed by molecules formed by recombining radicals in the cleaning gas, and the coating step includes a low temperature film forming step of forming the coating film under the condition that the temperature of a substrate supporting table is set lower than that in the film formation on the substrate during the film formation step.

Abstract: Electron-emissive drive units of electron-emissive elements capable of being arranged with a smaller pitch. FET and emitter array units exist in matrix element areas partitioned by a control wiring and data wiring. An exemplary unit is composed of four emitter arrays. The control wiring and data wiring are driven by first and second drive circuits, respectively. Corresponding arrays between units are connected by selection wiring and driven by a third drive circuit. The third drive circuit drives each unit of data wiring every time the drive circuit sequentially drives the four units of control wiring, and the emitter array drive circuit drives each emitter array selection wiring every time the drive circuit sequentially drives the three units of data wiring. Electrons can be emitted in units of arrays smaller than the unit.

Abstract: An imaging apparatus includes an electron emission array having electron sources arranged in matrix form and having a plurality of horizontal scan lines, a photoelectric conversion film opposed to the electron emission array, and a control and drive circuit configured to select one or more of the horizontal scan lines in a given video signal output period and to cause the electron sources included in the selected one or more horizontal scan lines to emit electrons toward the photoelectric conversion film to produce a video signal, wherein the control and drive circuit is configured to control electron emission of the electron emission array in a blanking period in response to a signal level of the video signal produced in the given video signal output period.

Abstract: An imaging apparatus includes an electron emission array having electron sources arranged in matrix form and having a plurality of horizontal scan lines, a photoelectric conversion film opposed to the electron emission array, and a control and drive circuit configured to select one or more of the horizontal scan lines in a given video signal output period and to cause the electron sources included in the selected one or more horizontal scan lines to emit electrons toward the photoelectric conversion film to produce a video signal, wherein the control and drive circuit is configured to cause the electron sources included in unselected one or more horizontal scan lines not selected in the given video signal output period to emit electrons toward the photoelectric conversion film in a blanking period immediately preceding the given video signal output period.

Abstract: An imaging apparatus includes an electron emission array having electron sources arranged in matrix form, a photoelectric conversion film opposed to the electron emission array, and a control and drive circuit configured to select one or more horizontal scan lines in a given video signal output period and to cause the electron sources included in the selected one or more horizontal scan lines to emit electrons toward the photoelectric conversion film, wherein the control and drive circuit is further configured to cause the electron sources included in the selected one or more horizontal scan lines to emit electrons toward the photoelectric conversion film in any one or more blanking periods excluding both a blanking period immediately following the given video signal output period and a blanking period immediately preceding a next video signal output period in which the one or more horizontal scan lines will be selected next time.

Abstract: A cleaning method of a substrate processor that reduces damage to a member in a substrate processing container. The method of cleaning the substrate processing container of the substrate processor that processes a target substrate according to the present invention includes: introducing gas into a remote plasma generating unit of the substrate processor; exciting the gas by the remote plasma generating unit, and generating reactive species; and supplying the reactive species to the processing container from the remote plasma generating unit, and pressurizing the processing container at 1333 Pa or greater.

Abstract: A method for processing a substrate on a ceramic substrate heater in a process chamber. The method includes forming a protective coating on the ceramic substrate heater in the process chamber and processing a substrate on the coated substrate heater. The processing can include providing a substrate to be processed on the coated ceramic substrate heater, performing a process on the substrate by exposing the substrate to a process gas, and removing the processed substrate from the process chamber.

Abstract: A method for forming a passivated metal layer that preserves the properties and morphology of an underlying metal layer during subsequent exposure to oxygen-containing ambients. The method includes providing a substrate in a process chamber, exposing the substrate to a process gas containing a rhenium-carbonyl precursor to deposit a rhenium metal layer on the substrate in a chemical vapor deposition process, and forming a passivation layer on the rhenium metal layer to thereby inhibit oxygen-induced growth of rhenium-containing nodules on the rhenium metal surface.