Patents by Inventor Kazuki Negishi
Kazuki Negishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20180284155Abstract: Probe systems and methods including electric contact detection. The probe systems include a probe assembly and a chuck. The probe systems also include a translation structure configured to operatively translate the probe assembly and/or the chuck and an instrumentation package configured to detect contact between the probe system and a device under test (DUT) and to test operation of the DUT. The instrumentation package includes a continuity detection circuit, a test circuit, and a translation structure control circuit. The continuity detection circuit is configured to detect electrical continuity between a first probe electrical conductor and a second probe electrical conductor. The test circuit is configured to electrically test the DUT. The translation structure control circuit is configured to control the operation of the translation structure. The methods include monitoring continuity between a first probe and a second probe and controlling the operation of a probe system based upon the monitoring.Type: ApplicationFiled: March 23, 2018Publication date: October 4, 2018Inventors: Sia Choon Beng, Kazuki Negishi
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Patent number: 10060950Abstract: Shielded probe systems are disclosed herein. The probe systems are configured to test a device under test (DUT) and include a measurement chamber that at least partially bounds an enclosed volume, an aperture defined by the measurement chamber, a probing assembly, and a shielding structure. The probing assembly includes a probe, which is oriented within the enclosed volume, a probe arm, which is operatively attached to the probe, and a manipulator, which is operatively attached to the probe arm. At least a portion of the probing assembly extends through the aperture. The shielding structure extends between the measurement chamber and the probing assembly and is configured to restrict fluid flow through the aperture and shield the enclosed volume from an ambient environment that surrounds the measurement chamber while maintaining at least a threshold separation distance from the probe arm throughout a probe arm range-of-motion thereof.Type: GrantFiled: January 15, 2016Date of Patent: August 28, 2018Assignee: FormFactor Beaverton, Inc.Inventors: Michael E Simmons, Bryan Conrad Bolt, Christopher Anthony Storm, Kazuki Negishi, Joseph George Frankel, Robbie Ingram-Goble
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Patent number: 10062597Abstract: A chuck for testing an integrated circuit includes an upper conductive layer having a lower surface and an upper surface suitable to support a device under test. An upper insulating layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper conductive layer, and a lower surface. A middle conductive layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper insulating layer, and a lower surface.Type: GrantFiled: August 7, 2017Date of Patent: August 28, 2018Assignee: FormFactor Beaverton, Inc.Inventors: Michael E. Simmons, Kazuki Negishi, Ryan Garrison, Philip Wolf
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Publication number: 20170338142Abstract: A chuck for testing an integrated circuit includes an upper conductive layer having a lower surface and an upper surface suitable to support a device under test. An upper insulating layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper conductive layer, and a lower surface. A middle conductive layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper insulating layer, and a lower surface.Type: ApplicationFiled: August 7, 2017Publication date: November 23, 2017Inventors: Michael E. Simmons, Kazuki Negishi, Ryan Garrison, Philip Wolf
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Patent number: 9741599Abstract: A chuck for testing an integrated circuit includes an upper conductive layer having a lower surface and an upper surface suitable to support a device under test. An upper insulating layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper conductive layer, and a lower surface. A middle conductive layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper insulating layer, and a lower surface.Type: GrantFiled: March 16, 2016Date of Patent: August 22, 2017Assignee: Cascade Microtech, Inc.Inventors: Michael E. Simmons, Kazuki Negishi, Ryan Garrison, Philip Wolf
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Publication number: 20170205446Abstract: Shielded probe systems are disclosed herein. The probe systems are configured to test a device under test (DUT) and include a measurement chamber that at least partially bounds an enclosed volume, an aperture defined by the measurement chamber, a probing assembly, and a shielding structure. The probing assembly includes a probe, which is oriented within the enclosed volume, a probe arm, which is operatively attached to the probe, and a manipulator, which is operatively attached to the probe arm. At least a portion of the probing assembly extends through the aperture. The shielding structure extends between the measurement chamber and the probing assembly and is configured to restrict fluid flow through the aperture and shield the enclosed volume from an ambient environment that surrounds the measurement chamber while maintaining at least a threshold separation distance from the probe arm throughout a probe arm range-of-motion thereof.Type: ApplicationFiled: January 15, 2016Publication date: July 20, 2017Inventors: Michael E. Simmons, Bryan Conrad Bolt, Christopher Anthony Storm, Kazuki Negishi, Joseph George Frankel, Robbie Ingram-Goble
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Patent number: 9506973Abstract: A chuck for testing an integrated circuit includes an upper conductive layer having a lower surface and an upper surface suitable to support a device under test. An upper insulating layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper conductive layer, and a lower surface. A middle conductive layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper insulating layer, and a lower surface.Type: GrantFiled: April 11, 2011Date of Patent: November 29, 2016Assignee: Cascade Microtech, Inc.Inventors: Michael E. Simmons, Kazuki Negishi, Roy Jensen, Ryan Garrison, Philip Wolf
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Publication number: 20160195579Abstract: A chuck for testing an integrated circuit includes an upper conductive layer having a lower surface and an upper surface suitable to support a device under test. An upper insulating layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper conductive layer, and a lower surface. A middle conductive layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper insulating layer, and a lower surface.Type: ApplicationFiled: March 16, 2016Publication date: July 7, 2016Inventors: Michael E. Simmons, Kazuki Negishi, Ryan Garrison, Philip Wolf
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Publication number: 20150241472Abstract: Systems and methods for on-wafer dynamic testing of electronic devices. The systems include a probe head assembly, a probe-side contacting structure, a chuck, and a chuck-side contacting structure. The probe head assembly includes a probe configured to electrically contact a first side of a device under test (DUT). The probe-side contacting structure includes a probe-side contacting region. The chuck includes an electrically conductive support surface configured to support a substrate that includes the DUT and to electrically contact a second side of the DUT. The probe head assembly and the chuck are configured to translate relative to one another to selectively establish electrical contact between the probe and the DUT. The chuck-side contacting structure includes a chuck-side contacting region that is in electrical communication with the electrically conductive support surface and opposed to the probe-side contacting structure. The methods may include methods of operating the system or systems.Type: ApplicationFiled: February 18, 2015Publication date: August 27, 2015Inventors: Kazuki Negishi, Eric Hill
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Patent number: 8823406Abstract: Systems and methods for simultaneous optical testing of a plurality of devices under test. These systems and methods may include the use of an optical probe assembly that includes a power supply structure that is configured to provide an electric current to a plurality of devices under test (DUTs) and an optical collection structure that is configured to simultaneously collect electromagnetic radiation that may be produced by the plurality of DUTs and to provide the collected electromagnetic radiation to one or more optical detection devices. The systems and methods also may include the use of the optical probe assembly in an optical probe system to evaluate one or more performance parameters of each of the plurality of DUTs.Type: GrantFiled: October 17, 2011Date of Patent: September 2, 2014Assignee: Cascade Micotech, Inc.Inventors: Bryan Bolt, Eric W. Strid, Kazuki Negishi, Steve Harris
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Publication number: 20130075982Abstract: A chuck for testing an integrated circuit includes an upper conductive layer having a lower surface and an upper surface suitable to support a device under test. An upper insulating layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper conductive layer, and a lower surface. A middle conductive layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper insulating layer, and a lower surface.Type: ApplicationFiled: April 11, 2011Publication date: March 28, 2013Applicant: Cascade Microtech, IncInventors: Michael E. Simmons, Kazuki Negishi, Roy Jensen, Ryan Garrison, Philip Wolf
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Patent number: 8319503Abstract: A flicker noise test system includes a guarded signal path and an unguarded signal path selectively connectable to respective terminals of a device under test. The selected signal path is connectable a terminal without disconnecting cables or changing probes.Type: GrantFiled: November 16, 2009Date of Patent: November 27, 2012Assignee: Cascade Microtech, Inc.Inventors: Kazuki Negishi, Mark Hansen
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Patent number: 8167648Abstract: An adapter conductively interconnects a chuck of a probe station and an instrument. The adapter includes a signal conductor conductively connected to the chuck and selectively connectable to a respective one of a ground potential, a bayonet connector output and a signal connection for the instrument. A guard potential conductor conductively connected to the chuck and selectively connectable to a one of a ground potential and a guard connection for the instrument; and a shield conductor connected to a ground potential.Type: GrantFiled: February 18, 2011Date of Patent: May 1, 2012Assignee: Cascade Microtech, Inc.Inventors: Kazuki Negishi, Michael Simmons, Christopher Storm, ToeNaing Swe
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Publication number: 20120098559Abstract: Systems and methods for simultaneous optical testing of a plurality of devices under test. These systems and methods may include the use of an optical probe assembly that includes a power supply structure that is configured to provide an electric current to a plurality of devices under test (DUTs) and an optical collection structure that is configured to simultaneously collect electromagnetic radiation that may be produced by the plurality of DUTs and to provide the collected electromagnetic radiation to one or more optical detection devices. The systems and methods also may include the use of the optical probe assembly in an optical probe system to evaluate one or more performance parameters of each of the plurality of DUTs.Type: ApplicationFiled: October 17, 2011Publication date: April 26, 2012Applicant: Cascade Microtech, Inc.Inventors: Bryan Bolt, Eric W. Strid, Kazuki Negishi, Steve Harris
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Publication number: 20110207370Abstract: An adapter conductively interconnects a chuck of a probe station and an instrument. The adapter includes a signal conductor conductively connected to the chuck and selectively connectable to a respective one of a ground potential, a bayonet connector output and a signal connection for the instrument. A guard potential conductor conductively connected to the chuck and selectively connectable to a one of a ground potential and a guard connection for the instrument; and a shield conductor connected to a ground potential.Type: ApplicationFiled: February 18, 2011Publication date: August 25, 2011Inventors: Kazuki Negishi, Michael Simmons, Christopher Storm, ToeNaing Swe
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Publication number: 20100127714Abstract: A flicker noise test system includes a guarded signal path and an unguarded signal path selectively connectable to respective terminals of a device under test. The selected signal path is connectable a terminal without disconnecting cables or changing probes.Type: ApplicationFiled: November 16, 2009Publication date: May 27, 2010Inventors: Kazuki Negishi, Mark Hansen