Patents by Inventor Kazuki Watanabe

Kazuki Watanabe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8126515
    Abstract: The semiconductor integrated circuit includes: a pair of antenna terminals; a rectifier; a source-voltage terminal; a shunt regulator; a series regulator. When the voltage of the inside source line rises to or above a first set voltage, the shunt regulator passes a pull-down current through a pull-down transistor. When the voltage of the inside source line drops to or below the second set voltage, the series regulator passes a pull-up current through a pull-up transistor. The first set voltage is set to be higher than the second set voltage in voltage level. With the semiconductor integrated circuit, the competition of actions of the two regulators is prevented. The semiconductor integrated circuit is arranged to work in contact and noncontact operation modes, and a stable source voltage can be supplied to an internal circuit thereof.
    Type: Grant
    Filed: December 3, 2009
    Date of Patent: February 28, 2012
    Assignee: Renesas Electronics Corporation
    Inventors: Kazuki Watanabe, Hisataka Tsunoda
  • Publication number: 20120006905
    Abstract: In an IC card, even in the case where an undershoot or an overshoot which occurs at the time of an amplitude change by communication data is large, the amplitude change is accurately detected. A semiconductor integrated circuit device B2 has antenna terminals LA and LB, a power supply circuit B3 for generating power supply voltage from an alternating-current (AC) signal supplied to the antenna terminals, and a receiver circuit B5 for demodulating an information signal which is superimposed on the AC signal. The receiver circuit B5 includes a rectifier circuit B9, a filter circuit B10, a capacitor C1, an amplifier A1, a feedback path B11, a switch circuit SW1, a binarizing circuit B12, and a control circuit B13. An output signal S3 of the amplifier A1 is transmitted to an inverting input terminal—of A1 via B11 and SW1, and the switch circuit SW1 is controlled by an output signal SC1 of the control circuit B13.
    Type: Application
    Filed: March 31, 2010
    Publication date: January 12, 2012
    Inventors: Kazuki Watanabe, Akihiro Toriyama
  • Publication number: 20120010353
    Abstract: A reflector of a lighting apparatus comprises a substrate and a coating layer located on a surface of the substrate. The coating layer is formed of a resin composition comprising an acrylic resin having at least one of a dimethylsiloxane group and a perfluoroalkyl group. Then, the coating layer is configured so that total surface free energy is less than or equal to 30 [mJ/m2], and when the total surface free energy is divided into two components of a polar force component and a dispersion force component, surface free energy of the dispersion force component is less than or equal to 25 [mJ/m2].
    Type: Application
    Filed: March 19, 2010
    Publication date: January 12, 2012
    Applicant: Panasonic Electric Works Co., Ltd.
    Inventors: Kazuki Watanabe, Shinjiro Noma, Satoru Yamauchi, Shigeharu Fukuzawa, Toshiharu Sako
  • Patent number: 8082012
    Abstract: The present invention provides a semiconductor integrated circuit device and a non-contact type IC card and a portable information terminal which uses the semiconductor integrated circuit device. The semiconductor integrated circuit device includes antenna terminals LA, LB which are connected to an antenna L1, a power source circuit B5 which has a rectifier/smoothing circuit B1 which obtains a DC voltage by rectifying and smoothing an AC signal which is supplied to the antenna terminal from the antenna and a shunt regulator B6 and a series regulator B7 which stabilize the DC voltage, and an internal circuit B8 which is operated upon the supply of the DC voltage from the power source circuit. The series regulator operates and the shunt regulator stops in a stage that a signal is transmitted to a reader/writer. The shunt regulator operates and the series regulator stops in a stage other than the stage that the signal is transmitted to the reader/writer.
    Type: Grant
    Filed: March 3, 2009
    Date of Patent: December 20, 2011
    Assignee: Renesas Electronics Corporation
    Inventors: Kazuki Watanabe, Kazuhiro Matsushita, Masaru Kubota
  • Patent number: 8033534
    Abstract: In a dummy head (a jig for processing a cylinder block) having a dummy head body deforming a cylinder bore by assembling into a mounting surface of the cylinder block by bolt fastening, during the finish processing of the cylinder bore, a boss having a contact surface contacting a peripheral portion of the cylinder bore on the head mounting surface is provided on a mounting surface side for the cylinder block of the dummy head body, and at least the dummy head body has a higher rigidity than the cylinder block.
    Type: Grant
    Filed: October 3, 2007
    Date of Patent: October 11, 2011
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventors: Tomoyuki Shinkai, Takahiro Harada, Kazuhiro Asayama, Kazuki Watanabe
  • Patent number: 7994923
    Abstract: A contactless electronic device comprises a semiconductor integrated circuit device, a plurality of antennas (or antenna coils) for receiving high-frequency signals supplied by radio waves or electromagnetic waves having different frequencies. An interface judgment circuit judges which antenna the high-frequency signals are inputted through, and according to a result of the judgment, the operation of the semiconductor integrated circuit device is changed. In this manner, the contactless electronic device becomes possible to respond to a plurality of communication protocols using high-frequency signals having different frequencies, while contactless electronic devices have been impossible to respond to communication protocols using various high-frequency signals.
    Type: Grant
    Filed: March 21, 2008
    Date of Patent: August 9, 2011
    Assignee: Hitachi, Ltd.
    Inventors: Kazuki Watanabe, Takanori Yamazoe
  • Publication number: 20110132988
    Abstract: A non-contact electronic device wherein variation in resonance frequency due to mutual interference between coils provided in individual IC cards can be suppressed and the housing thereof can be easily reduced in thickness is provided. The non-contact electronic device include: a substrate; a first coil for antenna arranged in the substrate; a semiconductor integrated circuit device that is arranged in the substrate and carries out non-contact interface between it and an external source utilizing the first coil; and a second coil comprising a resonance circuit together with the first coil and shielded from electromagnetic waves. Even when multiple non-contact electronic devices are simultaneously used, it is possible to suppress variation in resonance frequency due to mutual interference between the coils provided in individual non-contact electronic devices.
    Type: Application
    Filed: July 24, 2009
    Publication date: June 9, 2011
    Inventor: Kazuki Watanabe
  • Patent number: 7954969
    Abstract: Light which tries to enter a diffuser plate 3 at an angle which exceeds an angle at which a percentage of reflected light increases rapidly (that is, the incidence angle ?=70 degrees) is all reflected by a reflecting surface 21 and then enters the diffuser plate 3. Therefore, a pseudo light source is formed by light which was collected near a connection point between adjacent reflecting surfaces 21 out of the emitted light of the discharge lamps 1. So, the brightness between the adjacent discharge lamps 1 is increased, and it is possible to reduce unevenness in brightness. Furthermore, since the discharge lamp 1 is housed inside the reflecting surface 21 whose cross-sectional shape is a parabola, it is possible to reduce the distance between a reflecting plate 2 and the diffuser plate 3, as compared with the prior art, and to reduce the thickness dimension in the anteroposterior direction.
    Type: Grant
    Filed: July 5, 2006
    Date of Patent: June 7, 2011
    Assignee: Panasonic Electric Works Co., Ltd.
    Inventors: Kazuyuki Matsukawa, Masao Kamada, Wataru Tanaka, Kazuki Watanabe, Isao Nara, Yasuo Uemoto
  • Patent number: 7944338
    Abstract: In an RFID system including RFID tags each incorporating a sensor, accuracy of measurement by the sensor can be improved. For example, when measurements are performed several times by using RFID tags each incorporating a sensor unit, generation of a carrier directed from an RFID reader/writer to the RFID tags is stopped for a predetermined period every time when a measurement ends. By this means, the chip temperature of the RFID tag increased due to power consumption in each measurement can be reduced to, for example, ambient temperature every time when a measurement ends. Therefore, an error in measurement by the sensor unit can be reduced, thereby achieving accurate measurement.
    Type: Grant
    Filed: July 25, 2006
    Date of Patent: May 17, 2011
    Assignee: Hitachi, Ltd.
    Inventors: Ryo Nemoto, Hiroshi Yoshigi, Yoshiaki Yazawa, Kazuki Watanabe
  • Patent number: 7918403
    Abstract: There are provided an operational amplifier (A1), a capacitor (C1) capable of transmitting an input signal to an inverting input terminal of the operational amplifier, and a feedback path (B11) disposed between an output terminal and the inverting input terminal in the operational amplifier, and a reference voltage is supplied to a non-inverting input terminal. There is provided an input/output stabilizing circuit (B13) for changing a threshold voltage of the operational amplifier, and adding a micro signal input to the inverting input terminal of the operational amplifier, thereby carrying out an input/output stabilizing control in response to a signal output from the operational amplifier. In response to the signal output from the operational amplifier, the threshold voltage of the operational amplifier is changed and the micro signal is added to the signal input to the inverting input terminal of the operational amplifiers so that the input/output stabilizing control is carried out.
    Type: Grant
    Filed: December 18, 2007
    Date of Patent: April 5, 2011
    Assignee: Renesas Electronics Corporation
    Inventors: Kazuki Watanabe, Ryouji Kanekawa
  • Patent number: 7888708
    Abstract: A wireless sensor chip suitable for the compact, high-sensitive, and low-cost examination apparatus for easily examining a biological material such as gene at low cost is provided. A sensor chip is formed on an SOI substrate, and an n type semiconductor layer on which a pMOS transistor is formed and a p type semiconductor layer on which an nMOS transistor is formed are isolated by a pn junction. Therefore, the p type semiconductor layer at the outermost portion (chip edge portion to be in contact with solution) is set to floating, and the maximum potential and the minimum potential of the chip are supplied to an n type semiconductor layer and a p type semiconductor layer inside the outermost portion, respectively. Also, the chip is covered with an ion impermeable insulating film for reducing the penetration of positive ions through the oxide layer.
    Type: Grant
    Filed: October 29, 2007
    Date of Patent: February 15, 2011
    Assignee: Hitachi, Ltd.
    Inventors: Yoshiaki Yazawa, Kazuki Watanabe, Masao Kamahori, Yukinori Kunimoto
  • Patent number: 7761561
    Abstract: A sensor node may be used for another purpose for a moment and may also be replaced. By configuring, for a sensor node, a logic node which is provided with the physical node use information indicating whether or not the sensor node is in use and the logical node use information indicating whether or not the sensor node is provided as a logic node, a sensor node to be replaced may be specified based on the replacement request of the sensor node, a sensor node is selected which is configured as logic node providing the physical node use information indicating that the sensor node is not used and the logic node use information indicating that the sensor node is provided as the logic node, thus selected sensor node is identified as the replacing sensor node to achieve the replacement from the replaced sensor node to the replacing sensor node.
    Type: Grant
    Filed: July 13, 2007
    Date of Patent: July 20, 2010
    Inventors: Keiro Muro, Toshiyuki Odaka, Minoru Ogushi, Kei Suzuki, Shoji Suzuki, Kazuki Watanabe
  • Publication number: 20100144402
    Abstract: The semiconductor integrated circuit includes: a pair of antenna terminals; a rectifier; a source-voltage terminal; a shunt regulator; a series regulator. When the voltage of the inside source line rises to or above a first set voltage, the shunt regulator passes a pull-down current through a pull-down transistor. When the voltage of the inside source line drops to or below the second set voltage, the series regulator passes a pull-up current through a pull-up transistor. The first set voltage is set to be higher than the second set voltage in voltage level. With the semiconductor integrated circuit, the competition of actions of the two regulators is prevented. The semiconductor integrated circuit is arranged to work in contact and noncontact operation modes, and a stable source voltage can be supplied to an internal circuit thereof.
    Type: Application
    Filed: December 3, 2009
    Publication date: June 10, 2010
    Inventors: Kazuki WATANABE, Hisataka Tsunoda
  • Publication number: 20100088534
    Abstract: The present invention enables a power-supply voltage terminal and an internal circuit to be isolated from each other in a noncontact operation without largely increasing a chip area in a semiconductor integrated circuit device for an IC card.
    Type: Application
    Filed: October 2, 2009
    Publication date: April 8, 2010
    Inventors: Kazuki WATANABE, Nobuaki Yonea
  • Publication number: 20100072687
    Abstract: In a dummy head (a jig for processing a cylinder block) having a dummy head body deforming a cylinder bore by assembling into a mounting surface of the cylinder block by bolt fastening, during the finish processing of the cylinder bore, a boss having a contact surface contacting a peripheral portion of the cylinder bore on the head mounting surface is provided on a mounting surface side for the cylinder block of the dummy head body, and at least the dummy head body has a higher rigidity than the cylinder block.
    Type: Application
    Filed: October 3, 2007
    Publication date: March 25, 2010
    Inventors: Tomoyuki Shinkai, Takahiro Harada, Kazuhiro Asayama, Kazuki Watanabe
  • Patent number: 7681060
    Abstract: There is a need for turning off a transistor in a power supply switch circuit irrespective of relative potential relationship between a contact power supply terminal and an internal power supply line and making it possible to decrease an on-resistance of an MOS transistor without increasing the size of the MOS transistor constituting the power supply switch circuit. The power supply switch circuit is comprised of two PMOS transistors whose gate terminals connect with two pull-up circuits. A charge pump circuit generates a negative voltage and is connected to a pull-down circuit. The pull-down circuit is connected to the gate terminals in common. During a contactless operation, the pull-up circuit short-circuits one gate terminal to a contact power supply terminal VDD and the other gate terminal to an internal power supply line VDDA. During a contact operation, the pull-up circuit supplies both gate terminals with a negative voltage from the charge pump circuit.
    Type: Grant
    Filed: November 30, 2006
    Date of Patent: March 16, 2010
    Assignee: Renesas Technology Corp.
    Inventor: Kazuki Watanabe
  • Publication number: 20090322484
    Abstract: A semiconductor integrated circuit and an IC card mounted with the same are provided, in which a signal of any one of at least three kinds of reception signals can be received for a short time. An RF signal from an antenna is supplied in parallel to a first and a second demodulator circuit included in a demodulator circuit. The first demodulator circuit demodulates a first reception signal of a first degree of modulation. The second demodulator circuit demodulates a second reception signal having a first communication start signal (SOF), and a third reception signal having a second communication start signal (Preamble). The demodulated output signals of the first and the second demodulator circuit are supplied to a determination circuit. When the demodulation output by the first demodulator circuit is determined, it is determined that the first reception signal is currently received.
    Type: Application
    Filed: May 22, 2009
    Publication date: December 31, 2009
    Inventors: Akihiro TORIYAMA, Kazuki Watanabe
  • Publication number: 20090267736
    Abstract: A contactless electronic device comprises a semiconductor integrated circuit device, a plurality of antennas (or antenna coils) for receiving high-frequency signals supplied by radio waves or electromagnetic waves having different frequencies. An interface judgment circuit judges which antenna the high-frequency signals are inputted through, and according to a result of the judgment, the operation of the semiconductor integrated circuit device is changed. In this manner, the contactless electronic device becomes possible to respond to a plurality of communication protocols using high-frequency signals having different frequencies, while contactless electronic devices have been impossible to respond to communication protocols using various high-frequency signals.
    Type: Application
    Filed: March 21, 2008
    Publication date: October 29, 2009
    Inventors: Kazuki WATANABE, Takanori Yamazoe
  • Publication number: 20090264163
    Abstract: The present invention provides a semiconductor integrated circuit device and a non-contact type IC card and a portable information terminal which uses the semiconductor integrated circuit device. The semiconductor integrated circuit device includes antenna terminals LA, LB which are connected to an antenna L1, a power source circuit B5 which has a rectifier/smoothing circuit B1 which obtains a DC voltage by rectifying and smoothing an AC signal which is supplied to the antenna terminal from the antenna and a shunt regulator B6 and a series regulator B7 which stabilize the DC voltage, and an internal circuit B8 which is operated upon the supply of the DC voltage from the power source circuit. The series regulator operates and the shunt regulator stops in a stage that a signal is transmitted to a reader/writer. The shunt regulator operates and the series regulator stops in a stage other than the stage that the signal is transmitted to the reader/writer.
    Type: Application
    Filed: March 3, 2009
    Publication date: October 22, 2009
    Inventors: Kazuki WATANABE, Kazuhiro Matsushita, Masaru Kubota
  • Publication number: 20090168404
    Abstract: Light which tries to enter a diffuser plate 3 at an angle which exceeds an angle at which a percentage of reflected light increases rapidly (that is, the incidence angle ?=70 degrees) is all reflected by a reflecting surface 21 and then enters the diffuser plate 3. Therefore, a pseudo light source is formed by light which was collected near a connection point between adjacent reflecting surfaces 21 out of the emitted light of the discharge lamps 1. So, the brightness between the adjacent discharge lamps 1 is increased, and it is possible to reduce unevenness in brightness. Furthermore, since the discharge lamp 1 is housed inside the reflecting surface 21 whose cross-sectional shape is a parabola, it is possible to reduce the distance between a reflecting plate 2 and the diffuser plate 3, as compared with the prior art, and to reduce the thickness dimension in the anteroposterior direction.
    Type: Application
    Filed: July 5, 2006
    Publication date: July 2, 2009
    Inventors: Kazuyuki Matsukawa, Masao Kamada, Wataru Tanaka, Kazuki Watanabe, Isao Nara, Yasuo Uemoto