Kazuma Sekiya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
Abstract: A wafer processing method includes: a holding step of holding a wafer on a chuck table through a dicing tape; and a dividing step of cutting the wafer along division lines by a cutting blade. In the dividing step, cleaning water including pure water mixed with carbon dioxide is supplied to the front surface of the wafer, and cutting water including pure water alone or pure water mixed with carbon dioxide in a concentration lower than that of the cleaning water is supplied to the cutting blade. During cutting, therefore, the cleaning water and the cutting water are always shielded by each other. Consequently, the cutting blade can be prevented from being corroded or excessively worn due to the cleaning water, and the cutting water can be prevented from contacting the front surface of the wafer to cause electrostatic discharge damage to the devices.
Abstract: An automated workpiece conveying vehicle included in a conveyance system that conveys a workpiece to each of a plurality of processing apparatuses is provided. The automated workpiece conveying vehicle includes: a workpiece support part that supports the workpiece; a traveling mechanism provided on the workpiece support part; a vibration detection unit that detects vibration of the workpiece support part and records the vibration as vibration data; and a receiver that receives a control signal transmitted from a control unit included in the conveyance system, the control signal instructing conveyance of the workpiece to the processing apparatus.
Abstract: A processing apparatus includes a chuck table that holds a workpiece by a holding face, a processing unit that processes the workpiece with a grinding whetstone or a polishing pad, a movement unit for moving the chuck table and the processing unit parallel to the holding face, a processing feeding unit for moving the chuck table and the processing unit in a direction orthogonal to the holding face, an inspection unit to inspect a process mark of the workpiece during processing, a dressing unit to dress the grinding whetstone or the polishing pad of the processing unit, and a control unit. When a process mark of a size exceeding a threshold value is detected on the process face of the workpiece, the control unit stops processing of the workpiece, and after the grinding whetstone or the polishing pad is dressed, restarts processing.
Abstract: A stacked wafer assembly is made by forming a grid of grooves corresponding to projected dicing lines in a face side of each of two wafers, thereby forming demarcated areas on the face side of each of the two wafers. One of the wafers is installed with demarcated areas face upwardly, and thereafter liquid is supplied to the demarcated areas in a quantity just enough to stay on upper surfaces of the demarcated areas without overflowing. The other wafer is placed over the one wafer with demarcated areas of the other wafer facing the respective demarcated areas of the one wafer, thereby bringing respective central positions of the facing demarcated areas of the wafers into self-alignment with each other under the surface tension of the liquid sandwiched between the facing demarcated areas. The liquid is removed to bring the wafers into intimate contact with each other.
Abstract: A human resources management system includes an account information storage unit that stores balance information in multiple accounts in which money is pooled and a deposit and withdrawal history of each account. A deposit and withdrawal controlling part updates, on the basis of a reward amount of money to an operation determined between an ordering party and an order receiving party of the operation, information on the balances in an account of the ordering party and an account of the order receiving party and their deposit and withdrawal histories. Information on the balances and the deposit and withdrawal histories of the account is stored in the account information storage unit. An operational performance evaluation unit evaluates an operational performance of an owner of each account in a period on the basis of the deposit and withdrawal history.
Abstract: A management system for supervising an operator within an operation area with a processing apparatus installed therein has an imaging camera for capturing an image of the operator and a control unit. The control unit stores an area map that includes information about the processing apparatus and the positions of the processing apparatus, acquires identifying information regarding the operator on the basis of the image captured by the imaging camera, and extracts traffic lines of the operator. A management unit records the traffic lines of the operator and the identifying information of the operator, in relation to each other on the area map.
Abstract: There is provided a conveyance system that conveys a workpiece to each of plural processing apparatuses, The conveyance system includes a conveyance passage, an automated workpiece conveying vehicle that travels on the conveyance passage, a stock unit, and a control unit. The conveyance passage is set in a space directly above the processing apparatus across the plural processing apparatuses. The stock unit includes a workpiece conveying part that conveys the workpiece between a workpiece stocker that houses the workpiece supplied to the processing apparatus and the automated workpiece conveying vehicle.
Abstract: A chip accommodation tray for accommodating a plurality of chips includes a holding sheet for holding the chips on a face side thereof, the holding sheet having a tack force and a plurality of first pores formed therethrough, and a frame including a bottom wall supporting a reverse side of the holding sheet, the bottom wall having a plurality of second pores formed therethrough, and side walls erected from the bottom wall in surrounding relation to the holding sheet. Air is supplied from below the bottom wall of the frame through the second pores and the first pores and ejected toward lower surfaces of the chips held on the holding sheet, thereby peeling the chips off the holding sheet.
Abstract: A liquid container includes an inner bag that is made from a film-shaped member and reserves a liquid therein, and an outer container that accommodates the inner bag therein and has a first opening communicating with a mouth of the inner bag and a second opening for supplying a fluid into a space between the inner bag and an inner wall of the outer container.
Abstract: Disclosed is a wafer processing method for dividing a wafer into individual chips by applying to the wafer a laser beam having such a wavelength as to be absorbed in the wafer. The wafer processing method includes: an adhesive tape attaching step of attaching to the wafer an adhesive tape that emits plasma light different from plasma light emitted by the wafer upon application of a laser light thereto; a holding step of holding the adhesive tape side on the chuck table so as to expose the wafer; a dividing step of dividing the wafer while relatively moving the chuck table and the laser beam; and a plasma light detection step of detecting the plasma light generated at the time of the dividing step.
Abstract: A processing apparatus includes a cassette mounting section mounting a cassette storing a plurality of workpieces, a reading section reading an identification code provided on the cassette mounted on the cassette mounting section, and an information transmitting section transmitting information on the progress of process steps in processing each workpiece stored in the cassette, to a customer that has ordered the processing of each workpiece stored in the cassette.
Abstract: A wafer processing method for processing a wafer having, on a face side, a device formed in each of areas demarcated by a plurality of crossing projected cutting lines includes a holding step of holding the wafer on a chuck table with the face side exposed and a cutting step of cutting the wafer held on the chuck table along the projected cutting lines with a cutting blade. In the cutting step, cutting is carried out while cutting water with a low resistivity is supplied to the face side of the wafer and cutting water with a high resistivity is supplied to the cutting blade.
Abstract: A chuck table having a holding portion for holding a workpiece and a frame for supporting the holding portion. The holding portion includes a substrate having a plurality of fine holes arranged like a matrix at given intervals and a plurality of acoustic emission sensors arranged like a matrix on the substrate and spaced from each other so that each fine hole of the substrate is located between any adjacent ones of the acoustic emission sensors. The plurality of fine holes are connected through the frame to a vacuum source, thereby holding the workpiece on the acoustic emission sensors under suction. An elastic wave generated from the workpiece in processing the workpiece is collected at a plurality of positions by the plurality of acoustic emission sensors.
Abstract: A chuck table includes a main part having a holding surface for holding thereon a workpiece through a dicing tape, and a frame holder disposed around the main part for holding the annular frame. The main part has a flat surface that functions as the holding surface, an outer circumferential suction groove defined in a region of the holding surface that underlies an annular region of the adhesive tape between the workpiece and the frame of the frame unit, for holding the annular region of the adhesive tape under suction, and a suction channel held in fluid communication with the outer circumferential suction groove and a suction source. The frame holder pulls down the frame to a position lower than the holding surface to hold the dicing tape in close contact with the holding surface.
Abstract: A wafer processing method includes a close contact making step of pressing a protective film against the front side of a wafer in a radially outward direction starting from the center of the wafer to thereby bring the protective film into close contact with the front side of the wafer, a protective member fixing step of covering the protective film with a protective member formed by curing a liquid resin to thereby fix the protective member through the protective film to the front side of the wafer, a grinding step of grinding the back side of the wafer to reduce the thickness of the wafer, and a peeling step of peeling the protective film and the protective member from the wafer thinned by the grinding step.
Abstract: A tape attaching method for mounting an adhesive tape to an annular frame having an inside opening to thereby support a plate-shaped workpiece through the adhesive tape to the frame in the inside opening thereof. The tape attaching method includes an adhesive tape attaching step of attaching the adhesive tape to the workpiece, the adhesive tape being larger in size than the frame, a frame positioning step of positioning the frame with a spacing defined between the frame and the adhesive tape in the condition where the inside opening of the frame is opposed to the workpiece attached to the adhesive tape, and a tape attaching and cutting step of partially pressing the adhesive tape against the frame by using a roller rotating along the inner circumference of the frame defining the inside opening.
Abstract: Disclosed herein is a human transporting drone including a drone core, a human receptacle for accommodating a human, the human receptacle being detachably housed in the drone core, ropes connected to the human receptacle, and rope winding mechanisms mounted on the drone core, for winding the ropes to house the human receptacle into the drone core and unwinding the ropes to release the human receptacle from the drone core.
Abstract: A method of manufacturing a packaged board includes the steps of blanketing a wiring board with devices disposed thereon in a molding die and supplying the molding resin to the molding die, provisionally sintering the molding resin at a relatively low provisional sintering temperature below a final sintering temperature, detaching the wiring board from the molding die, and thereafter, placing the wiring board on a first base having a first flat surface, pressing the wiring board with a second base having a second flat surface parallel to the first flat surface, and heating the wiring board at the final sintering temperature to finally sinter the provisionally sintered molding resin while keeping its thickness uniform.
Abstract: A method of processing a wafer having a face side where devices are formed in respective areas demarcated by a grid of projected dicing lines includes a groove forming step, a protective film sticking step, a protective-member-combined wafer forming step, a grinding step, a tape bonding step, a holding step, a peeling step, and a die-attach film dividing step.
Abstract: A recess or through-hole forming method for forming a substrate with a recess or a through-hole along a thickness direction of the substrate, the method including: a modified region forming step of applying a laser beam of such a wavelength as to be transmitted through the substrate to the substrate, with a focal region of the laser beam positioned inside the substrate, to form a column-shaped modified region which is exposed to a surface of the substrate and extends along the thickness direction of the substrate; and an etching step of etching the modified region to form the substrate with the recess or the through-hole, after the modified region forming step is performed.