Patents by Inventor Kazuma Sekiya

Kazuma Sekiya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11276588
    Abstract: A method of processing a wafer includes a protective member affixing step of affixing a protective member whose area covers a face side or a reverse side of the wafer to the wafer, and after the protective member affixing step has been carried out, a ring-shaped stiffener removing step of removing a ring-shaped stiffener from the wafer. The ring-shaped stiffener removing step includes a ring-shaped stiffener separating step of dividing the wafer along an outer circumference of a device region to separate the device region and the ring-shaped stiffener from each other, and after the ring-shaped stiffener separating step has been carried out, a removing step of processing the ring-shaped stiffener with a grindstone to remove the ring-shaped stiffener from the wafer while a processing fluid is being supplied to the wafer.
    Type: Grant
    Filed: October 14, 2020
    Date of Patent: March 15, 2022
    Assignee: DISCO CORPORATION
    Inventor: Kazuma Sekiya
  • Publication number: 20220032404
    Abstract: A wafer manufacturing method for manufacturing a wafer from an ingot includes forming a peeling layer within the ingot by positioning a condensing point at a depth corresponding to the thickness of the wafer to be produced, and irradiating the ingot with a first laser beam, forming a character, a number, or a mark representing information regarding resistivity in or on the ingot by positioning a condensing point in a region in which devices are not to be formed and irradiating the ingot with a second laser beam, and dividing the ingot with the peeling layer as a starting point.
    Type: Application
    Filed: July 22, 2021
    Publication date: February 3, 2022
    Inventor: Kazuma SEKIYA
  • Publication number: 20220037160
    Abstract: There is provided a processing method of a wafer. The processing method includes a protective sheet preparation step of preparing a protective sheet including a first sheet that is thermocompression-bonded to a surface of the wafer by heating, a second sheet that is laid on the first sheet and has fluidity due to the heating, and a third sheet that is laid on the second sheet and keeps flatness even with the heating. The processing method also includes a protective sheet laying step of causing a side of the first sheet to face a front surface of the wafer and executing heating to execute thermocompression bonding to lay the protective sheet on the front surface of the wafer and a grinding step of causing a side of the protective sheet to be held by a holding surface of a chuck table and grinding a back surface of the wafer.
    Type: Application
    Filed: July 21, 2021
    Publication date: February 3, 2022
    Inventor: Kazuma SEKIYA
  • Patent number: 11222823
    Abstract: A wafer processing method for dividing a wafer into individual device chips. The wafer processing method includes a thermocompression bonding sheet providing step of positioning the wafer in an inside opening of a ring frame and providing a thermocompression bonding sheet on a back side of the wafer and on a back side of the ring frame, a uniting step of heating the thermocompression bonding sheet as applying a pressure to the thermocompression bonding sheet to thereby unite the wafer and the ring frame through the thermocompression bonding sheet by thermocompression bonding, a dividing step of cutting the wafer to thereby form a plurality of dividing grooves and dividing the wafer into the individual device chips, a flattening step of flattening the thermocompression bonding sheet, and a back side observing step of observing the back side of each device chip through the thermocompression bonding sheet.
    Type: Grant
    Filed: February 4, 2020
    Date of Patent: January 11, 2022
    Assignee: DISCO CORPORATION
    Inventor: Kazuma Sekiya
  • Patent number: 11188050
    Abstract: Disclosed herein is a management method of a processing tool mounted to a processing apparatus. The management method includes an information input step of inputting product type information that indicates a product type and a serial number displayed on the processing tool or a case of the processing tool to the processing apparatus when the processing tool is mounted to the processing apparatus, and a tallying step of counting the number of inputs of the serial number regarding each identical product type and tallying the number of uses regarding each product type from the input information. Order timing of each product type is determined from the number of uses.
    Type: Grant
    Filed: April 19, 2018
    Date of Patent: November 30, 2021
    Assignee: DISCO CORPORATION
    Inventor: Kazuma Sekiya
  • Publication number: 20210362295
    Abstract: A dressing member to be used for dressing of a cutting blade carried out by a cutting apparatus including a chuck table that holds a workpiece, a cutting unit that cuts the workpiece held by the chuck table by a cutting blade, a cassette mounting section on which a cassette accommodating the workpieces is mounted, and a conveying unit that conveys the workpiece between the cassette mounted on the cassette mounting section and the chuck table, includes a dressing board to be cut by the cutting blade and a rigid plate fixed to the dressing board.
    Type: Application
    Filed: April 26, 2021
    Publication date: November 25, 2021
    Inventor: Kazuma SEKIYA
  • Patent number: 11167393
    Abstract: A cutting blade is mounted on a fixed flange having a cylindrical blade mounting portion. The cutting blade includes an annular blade main body having an outer circumference serving as a cutting edge and a central through-hole that has a diameter greater than an outer diameter of the blade mounting portion and in which the blade mounting portion is to be fitted, and three or more flexible inner circumferential protrusions that project from an inner circumference of the central through-hole toward the center in a diametrical direction and contact at extremities thereof with the blade mounting portion fitted in the central through-hole to support the annular blade main body.
    Type: Grant
    Filed: August 9, 2018
    Date of Patent: November 9, 2021
    Assignee: DISCO CORPORATION
    Inventors: Kazuma Sekiya, Yuichiro Matsumi
  • Publication number: 20210339358
    Abstract: A management method of a machining system includes a chuck table, a machining unit, a transfer unit that transfers a wafer onto the chuck table, a camera unit that acquires an image containing a pattern formed on a side of a front surface of the wafer, and an information recording section. The management method is applied when the pattern is recorded in association with machining conditions in the information recording section; and records in the information recording section new machining conditions to be used when machining a new type of wafer, causes an automatic machining program, which automatically machines the new type of wafer, to start, forms an image, which contains a new pattern of the new type of wafer, by the camera unit, and records the new pattern in association with the new machining conditions in the information recording section.
    Type: Application
    Filed: April 7, 2021
    Publication date: November 4, 2021
    Inventor: Kazuma SEKIYA
  • Publication number: 20210335620
    Abstract: There is provided a wet etching method including an etchant supply step of supplying an etchant from an etchant supply nozzle to a to-be-etched surface of a workpiece, an etching step of etching the to-be-etched surface with the etchant remaining on the to-be-etched surface, and an etchant removal step of, after performing the etching step, removing the etchant, which still remains on the resulting etched surface, from the etched surface. The etchant supply step, the etching step, and the etchant removal step are repeated a plurality of times in this order.
    Type: Application
    Filed: April 2, 2021
    Publication date: October 28, 2021
    Inventors: Kazuma SEKIYA, Takashi ONO, Daigo SHITABO
  • Patent number: 11148243
    Abstract: A cutting blade supplying apparatus includes a cutting blade stocker that stocks a plurality of cutting blades; a carrying unit that carries out the cutting blade from the cutting blade stocker and carries the cutting blade to a cutting apparatus, a transferring unit that transfers the cutting blade carried by the carrying unit to a cutting blade replacing unit of the cutting apparatus, and a control unit. The cutting blade stocker includes a cutting blade case that accommodates the cutting blades each of which includes a mounting port formed in a center thereof to be mounted to a spindle and a cutting edge formed at an outer periphery of the mounting port, and a cutting blade case mounting unit on which to mount the cutting blade case.
    Type: Grant
    Filed: September 5, 2018
    Date of Patent: October 19, 2021
    Assignee: DISCO CORPORATION
    Inventor: Kazuma Sekiya
  • Publication number: 20210316411
    Abstract: A cutting apparatus includes a chuck table having a holding surface used for holding either a workpiece unit that includes a plate-shaped workpiece supported on an annular frame by a tape or a tray shaped similarly to the annular frame, a rest area used for placing a receptacle that houses the workpiece unit or the tray, a transport unit configured to transport the workpiece unit or the tray between the rest area and the chuck table, the transport unit having a holding pad that holds the workpiece unit or the tray, a sub-chuck table that is disposed sideways of the chuck table and has a holding surface used for holding a board for use in adjusting a cutting unit, and a board transport unit configured to transport the board between the tray held on the chuck table and the sub-chuck table.
    Type: Application
    Filed: March 31, 2021
    Publication date: October 14, 2021
    Inventor: Kazuma SEKIYA
  • Patent number: 11110549
    Abstract: A recess or through-hole forming method for forming a substrate with a recess or a through-hole along a thickness direction of the substrate, the method including: a modified region forming step of applying a laser beam of such a wavelength as to be transmitted through the substrate to the substrate, with a focal region of the laser beam positioned inside the substrate, to form a column-shaped modified region which is exposed to a surface of the substrate and extends along the thickness direction of the substrate; and an etching step of etching the modified region to form the substrate with the recess or the through-hole, after the modified region forming step is performed.
    Type: Grant
    Filed: December 11, 2018
    Date of Patent: September 7, 2021
    Assignee: DISCO CORPORATION
    Inventors: Kazuma Sekiya, Naoki Murazawa
  • Patent number: 11101162
    Abstract: A chuck table includes a main part having a holding surface for holding thereon a workpiece through a dicing tape, and a frame holder disposed around the main part for holding the annular frame. The main part has a flat surface that functions as the holding surface, an outer circumferential suction groove defined in a region of the holding surface that underlies an annular region of the adhesive tape between the workpiece and the frame of the frame unit, for holding the annular region of the adhesive tape under suction, and a suction channel held in fluid communication with the outer circumferential suction groove and a suction source. The frame holder pulls down the frame to a position lower than the holding surface to hold the dicing tape in close contact with the holding surface.
    Type: Grant
    Filed: March 5, 2019
    Date of Patent: August 24, 2021
    Assignee: DISCO CORPORATION
    Inventors: Setsuo Yamamoto, Kazuma Sekiya
  • Patent number: 11096287
    Abstract: A method of manufacturing a packaged board includes the steps of blanketing a wiring board with devices disposed thereon in a molding die and supplying the molding resin to the molding die, provisionally sintering the molding resin at a relatively low provisional sintering temperature below a final sintering temperature, detaching the wiring board from the molding die, and thereafter, placing the wiring board on a first base having a first flat surface, pressing the wiring board with a second base having a second flat surface parallel to the first flat surface, and heating the wiring board at the final sintering temperature to finally sinter the provisionally sintered molding resin while keeping its thickness uniform.
    Type: Grant
    Filed: January 7, 2019
    Date of Patent: August 17, 2021
    Assignee: DISCO CORPORATION
    Inventor: Kazuma Sekiya
  • Patent number: 11072042
    Abstract: A wafer producing method includes a peel-off layer forming step of applying a laser beam of a wavelength passing through a hexagonal single crystal ingot with a focal point of the laser beam positioned at a depth corresponding to a thickness of a wafer to be produced from an end face of the hexagonal single crystal ingot to form a peel-off layer, a production history forming step of applying a laser beam of a wavelength passing through the wafer with a focal point of the laser beam positioned inside the wafer at a position corresponding to each of a plurality of devices to be formed on a front surface of the wafer to form a production history, and a wafer peeling step of peeling off the wafer from the hexagonal single crystal ingot.
    Type: Grant
    Filed: January 10, 2020
    Date of Patent: July 27, 2021
    Assignee: DISCO CORPORATION
    Inventor: Kazuma Sekiya
  • Patent number: 11059673
    Abstract: A conveyance system for conveying a workpiece to each of a plurality of processing apparatuses includes a track extending over the plurality of processing apparatuses and fixed to the upper portions of the processing apparatuses; an automated conveying vehicle for traveling on the track, the automated conveying vehicle including a storage member having a housing space for housing the workpiece therein, a traveling member coupled from above to the storage member, a traveling mechanism mounted on the traveling member, a lifting and lowering mechanism mounted on the traveling member, for lifting and lowering the storage member while suspending the storage member from above, and a receiver for receiving control signals.
    Type: Grant
    Filed: July 17, 2020
    Date of Patent: July 13, 2021
    Assignee: DISCO CORPORATION
    Inventor: Kazuma Sekiya
  • Patent number: 11056374
    Abstract: A protective member forming method includes forming a water film on a flat holding surface of a support base, placing a wafer on the water film formed on the holding surface and next freezing the water film in a condition where the wafer floats on an upper surface of the water film owing to the surface tension of the water film, thereby forming an ice layer and fixing the wafer on the ice layer, supplying a liquid resin curable by the application of ultraviolet light to the upper surface of the wafer, opposing a transparent sheet to the wafer with the liquid resin interposed therebetween, and applying ultraviolet light to the liquid resin, thereby curing the liquid resin to form a protective member on a whole of the upper surface of the wafer.
    Type: Grant
    Filed: October 29, 2019
    Date of Patent: July 6, 2021
    Assignee: DISCO CORPORATION
    Inventor: Kazuma Sekiya
  • Publication number: 20210197537
    Abstract: A protective sheet application method for applying a protective sheet on a front surface of a substrate includes mounting the substrate on a support table in a vacuum chamber, mounting the protective sheet on the substrate to separate a space in the vacuum chamber into a first compartment and a second compartment, depressurizing the first compartment to a predetermined air pressure and also depressurizing the second compartment, opening the depressurized second compartment to the atmosphere to bring the protective sheet into close contact with the substrate by a predetermined force, and opening the depressurized first compartment to the atmosphere to separate the lower housing and the upper housing from each other. A protective sheet application apparatus for applying the protective sheet on the front surface of the substrate includes the vacuum chamber.
    Type: Application
    Filed: December 18, 2020
    Publication date: July 1, 2021
    Inventor: Kazuma SEKIYA
  • Patent number: 11036972
    Abstract: A management system for supervising an operator within an operation area with a processing apparatus installed therein has an imaging camera for capturing an image of the operator and a control unit. The control unit stores an area map that includes information about the processing apparatus and the positions of the processing apparatus, acquires identifying information regarding the operator on the basis of the image captured by the imaging camera, and extracts traffic lines of the operator. A management unit records the traffic lines of the operator and the identifying information of the operator, in relation to each other on the area map.
    Type: Grant
    Filed: August 2, 2019
    Date of Patent: June 15, 2021
    Assignee: DISCO CORPORATION
    Inventor: Kazuma Sekiya
  • Publication number: 20210172823
    Abstract: A self-powered water leakage detector includes a water cell having a positive electrode and a negative electrode and a transmitter for transmitting a reporting signal by using electric power generated by the water cell that is brought into contact with water that has leaked. The water cell and the transmitter are fixedly housed in a case, and the case is adapted to be placed in an installation site where a water leakage is to be detected. When the case is placed in the installation site, the positive electrode and the negative electrode have respective lower ends disposed in a position that is equal to or lower than a level of the water leakage to be detected.
    Type: Application
    Filed: December 3, 2020
    Publication date: June 10, 2021
    Inventor: Kazuma SEKIYA