Patents by Inventor Kazuma Sekiya

Kazuma Sekiya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SiC SUBSTRATE PROCESSING METHOD
    Publication number: 20200075415
    Abstract: An SiC substrate processing method includes a separation layer forming step of setting a focal point of a laser beam having a transmission wavelength to SiC inside an SiC substrate and next applying the laser beam to the SiC substrate to thereby form a separation layer inside the SiC substrate, the SiC substrate having a first surface and a second surface opposite to the first surface; a first plate attaching step of attaching a first plate to the first surface of the SiC substrate; a second plate attaching step of attaching a second plate to the second surface of the SiC substrate; and a separating step of applying an external force to the separation layer after performing the first plate attaching step and the second plate attaching step, thereby separating the SiC substrate into a first SiC substrate and a second SiC substrate along the separation layer.
    Type: Application
    Filed: August 21, 2019
    Publication date: March 5, 2020
    Inventor: Kazuma SEKIYA
  • SiC SUBSTRATE PROCESSING METHOD
    Publication number: 20200075414
    Abstract: An SiC substrate processing method for producing an SiC substrate from an SiC ingot. The SiC substrate processing method includes a separation layer forming step of setting a focal point of a laser beam having a transmission wavelength to SiC inside the SiC ingot at a predetermined depth from the upper surface of the SiC ingot and next applying the laser beam LB to the SiC ingot to thereby form a separation layer for separating the SiC substrate from the SiC ingot, a substrate attaching step of attaching a substrate to the upper surface of the SiC ingot, and a separating step of applying an external force to the separation layer to thereby separate the SiC substrate with the substrate from the SiC ingot along the separation layer.
    Type: Application
    Filed: August 20, 2019
    Publication date: March 5, 2020
    Inventor: Kazuma SEKIYA
  • REMOTE CONTROL SWITCH FOR ELECTRICAL EQUIPMENT
    Publication number: 20200074845
    Abstract: A remote control switch which can eliminate the need for replacement of dry batteries and can be used regardless of the lightness of a use environment is provided. The remote control switch includes a push member adapted to be pushed, thereby moving to perform a push operation, a power generating portion for generating electric power in response to the push operation by the push member, and a communication signal transmitting portion for transmitting a specific communication signal by using the electric power generated from the power generating portion.
    Type: Application
    Filed: August 21, 2019
    Publication date: March 5, 2020
    Inventor: Kazuma SEKIYA
  • Dressing board, cutting blade dressing method, and cutting apparatus
    Patent number: 10576608
    Abstract: Disclosed herein is a dressing board for dressing a cutting blade. The dressing board is held on a chuck table in dressing the cutting blade. The dressing board includes a bar code formed on the front side of the dressing board for indicating kind information on the dressing board, and a groove code formed on the front side of the dressing board at an edge portion thereof, the groove code being composed of grooves having pattern corresponding to that of the bar code. Even when the bar code is cut off by the cutting blade in dressing the cutting blade, the kind information on the dressing board is indicated by the groove code left on the front side of the dressing board.
    Type: Grant
    Filed: January 17, 2018
    Date of Patent: March 3, 2020
    Assignee: DISCO CORPORATION
    Inventor: Kazuma Sekiya
  • Cutting blade mounting mechanism
    Patent number: 10569442
    Abstract: A cutting blade mounting mechanism includes: a blade mount mounted to a spindle; and an air supply unit supplying air to the blade mount. The blade mount includes: a columnar boss section inserted into a through-hole provided in an annular base of the cutting blade; a flange section projecting in a radial direction from a side of a base end of the boss section; and an ejector type blade suction section having a first air passage connecting a supply port supplied with air from the air supply unit and a discharge port discharging the air, and a second air passage connecting a suction port opening to a side of a support surface of the flange section and the first air passage. A plurality of the discharge ports are formed in an outer peripheral face of the boss section.
    Type: Grant
    Filed: September 18, 2018
    Date of Patent: February 25, 2020
    Assignee: DISCO CORPORATION
    Inventor: Kazuma Sekiya
  • WAFER UNITING METHOD
    Publication number: 20200058537
    Abstract: A wafer uniting method includes a thermocompression bonding step of causing a thermocompression bonding sheet having a size comparable to or greater than a size and a shape of a wafer and a front surface of the wafer to face each other, and pressing them against each other while applying heat to thermocompression bond the thermocompression bonding sheet to the front surface of the wafer. The thermocompression bonding sheet thermocompression bonded to the wafer in the thermocompression bonding step includes at least a first thermocompression bonding sheet and a second thermocompression bonding sheet.
    Type: Application
    Filed: August 13, 2019
    Publication date: February 20, 2020
    Inventor: Kazuma SEKIYA
  • CUTTING APPARATUS
    Publication number: 20200058524
    Abstract: A cutting apparatus includes a processing feed direction determining mechanism. The processing feed direction determining mechanism includes an imaging unit 28 that images a region including a cut groove and a recording unit that records chipping data of the imaged cut groove. The recording unit records first chipping data of a cut groove formed by cutting a workpiece from a first direction, second chipping data of a cut groove formed by cutting the workpiece from a direction opposite from the first direction, third chipping data of a cut groove formed by cutting the workpiece from a second direction orthogonal to the first direction, and fourth chipping data of a cut groove formed by cutting the workpiece from a direction opposite from the second direction.
    Type: Application
    Filed: August 13, 2019
    Publication date: February 20, 2020
    Inventor: Kazuma SEKIYA
  • Wafer processing method
    Patent number: 10562207
    Abstract: A wafer processing method includes: a holding step of holding a wafer on a chuck table through a dicing tape; and a dividing step of cutting the wafer along division lines by a cutting blade. In the dividing step, cleaning water including pure water mixed with carbon dioxide is supplied to the front surface of the wafer, and cutting water including pure water alone or pure water mixed with carbon dioxide in a concentration lower than that of the cleaning water is supplied to the cutting blade. During cutting, therefore, the cleaning water and the cutting water are always shielded by each other. Consequently, the cutting blade can be prevented from being corroded or excessively worn due to the cleaning water, and the cutting water can be prevented from contacting the front surface of the wafer to cause electrostatic discharge damage to the devices.
    Type: Grant
    Filed: February 9, 2018
    Date of Patent: February 18, 2020
    Assignee: DISCO CORPORATION
    Inventors: Kazuma Sekiya, Shigenori Harada, Motoki Ishikawa, Takaaki Inoue
  • AUTOMATED WORKPIECE CONVEYING VEHICLE
    Publication number: 20200023484
    Abstract: An automated workpiece conveying vehicle included in a conveyance system that conveys a workpiece to each of a plurality of processing apparatuses is provided. The automated workpiece conveying vehicle includes: a workpiece support part that supports the workpiece; a traveling mechanism provided on the workpiece support part; a vibration detection unit that detects vibration of the workpiece support part and records the vibration as vibration data; and a receiver that receives a control signal transmitted from a control unit included in the conveyance system, the control signal instructing conveyance of the workpiece to the processing apparatus.
    Type: Application
    Filed: July 12, 2019
    Publication date: January 23, 2020
    Inventor: Kazuma SEKIYA
  • Processing apparatus and processing method for workpiece
    Patent number: 10532445
    Abstract: A processing apparatus includes a chuck table that holds a workpiece by a holding face, a processing unit that processes the workpiece with a grinding whetstone or a polishing pad, a movement unit for moving the chuck table and the processing unit parallel to the holding face, a processing feeding unit for moving the chuck table and the processing unit in a direction orthogonal to the holding face, an inspection unit to inspect a process mark of the workpiece during processing, a dressing unit to dress the grinding whetstone or the polishing pad of the processing unit, and a control unit. When a process mark of a size exceeding a threshold value is detected on the process face of the workpiece, the control unit stops processing of the workpiece, and after the grinding whetstone or the polishing pad is dressed, restarts processing.
    Type: Grant
    Filed: October 11, 2017
    Date of Patent: January 14, 2020
    Assignee: DISCO CORPORATION
    Inventor: Kazuma Sekiya
  • Method of manufacturing stacked wafer assembly
    Patent number: 10522503
    Abstract: A stacked wafer assembly is made by forming a grid of grooves corresponding to projected dicing lines in a face side of each of two wafers, thereby forming demarcated areas on the face side of each of the two wafers. One of the wafers is installed with demarcated areas face upwardly, and thereafter liquid is supplied to the demarcated areas in a quantity just enough to stay on upper surfaces of the demarcated areas without overflowing. The other wafer is placed over the one wafer with demarcated areas of the other wafer facing the respective demarcated areas of the one wafer, thereby bringing respective central positions of the facing demarcated areas of the wafers into self-alignment with each other under the surface tension of the liquid sandwiched between the facing demarcated areas. The liquid is removed to bring the wafers into intimate contact with each other.
    Type: Grant
    Filed: September 7, 2018
    Date of Patent: December 31, 2019
    Assignee: DISCO CORPORATION
    Inventor: Kazuma Sekiya
  • Human resources management system
    Patent number: 10515421
    Abstract: A human resources management system includes an account information storage unit that stores balance information in multiple accounts in which money is pooled and a deposit and withdrawal history of each account. A deposit and withdrawal controlling part updates, on the basis of a reward amount of money to an operation determined between an ordering party and an order receiving party of the operation, information on the balances in an account of the ordering party and an account of the order receiving party and their deposit and withdrawal histories. Information on the balances and the deposit and withdrawal histories of the account is stored in the account information storage unit. An operational performance evaluation unit evaluates an operational performance of an owner of each account in a period on the basis of the deposit and withdrawal history.
    Type: Grant
    Filed: December 18, 2015
    Date of Patent: December 24, 2019
    Assignee: DISCO CORPORATION
    Inventor: Kazuma Sekiya
  • MANAGEMENT SYSTEM FOR SUPERVISING OPERATOR
    Publication number: 20190354751
    Abstract: A management system for supervising an operator within an operation area with a processing apparatus installed therein has an imaging camera for capturing an image of the operator and a control unit. The control unit stores an area map that includes information about the processing apparatus and the positions of the processing apparatus, acquires identifying information regarding the operator on the basis of the image captured by the imaging camera, and extracts traffic lines of the operator. A management unit records the traffic lines of the operator and the identifying information of the operator, in relation to each other on the area map.
    Type: Application
    Filed: August 2, 2019
    Publication date: November 21, 2019
    Inventor: Kazuma SEKIYA
  • CONVEYANCE SYSTEM
    Publication number: 20190352099
    Abstract: There is provided a conveyance system that conveys a workpiece to each of plural processing apparatuses, The conveyance system includes a conveyance passage, an automated workpiece conveying vehicle that travels on the conveyance passage, a stock unit, and a control unit. The conveyance passage is set in a space directly above the processing apparatus across the plural processing apparatuses. The stock unit includes a workpiece conveying part that conveys the workpiece between a workpiece stocker that houses the workpiece supplied to the processing apparatus and the automated workpiece conveying vehicle.
    Type: Application
    Filed: May 3, 2019
    Publication date: November 21, 2019
    Inventor: Kazuma SEKIYA
  • Chip accommodation tray
    Patent number: 10475681
    Abstract: A chip accommodation tray for accommodating a plurality of chips includes a holding sheet for holding the chips on a face side thereof, the holding sheet having a tack force and a plurality of first pores formed therethrough, and a frame including a bottom wall supporting a reverse side of the holding sheet, the bottom wall having a plurality of second pores formed therethrough, and side walls erected from the bottom wall in surrounding relation to the holding sheet. Air is supplied from below the bottom wall of the frame through the second pores and the first pores and ejected toward lower surfaces of the chips held on the holding sheet, thereby peeling the chips off the holding sheet.
    Type: Grant
    Filed: December 9, 2016
    Date of Patent: November 12, 2019
    Assignee: DISCO CORPORATION
    Inventor: Kazuma Sekiya
  • Liquid container and liquid supply apparatus
    Patent number: 10464329
    Abstract: A liquid container includes an inner bag that is made from a film-shaped member and reserves a liquid therein, and an outer container that accommodates the inner bag therein and has a first opening communicating with a mouth of the inner bag and a second opening for supplying a fluid into a space between the inner bag and an inner wall of the outer container.
    Type: Grant
    Filed: June 18, 2018
    Date of Patent: November 5, 2019
    Assignee: DISCO CORPORATION
    Inventor: Kazuma Sekiya
  • Wafer processing method and adhesive tape
    Patent number: 10460974
    Abstract: Disclosed is a wafer processing method for dividing a wafer into individual chips by applying to the wafer a laser beam having such a wavelength as to be absorbed in the wafer. The wafer processing method includes: an adhesive tape attaching step of attaching to the wafer an adhesive tape that emits plasma light different from plasma light emitted by the wafer upon application of a laser light thereto; a holding step of holding the adhesive tape side on the chuck table so as to expose the wafer; a dividing step of dividing the wafer while relatively moving the chuck table and the laser beam; and a plasma light detection step of detecting the plasma light generated at the time of the dividing step.
    Type: Grant
    Filed: January 10, 2018
    Date of Patent: October 29, 2019
    Assignee: Disco Corporation
    Inventor: Kazuma Sekiya
  • PROCESSING APPARATUS
    Publication number: 20190318953
    Abstract: A processing apparatus includes a cassette mounting section mounting a cassette storing a plurality of workpieces, a reading section reading an identification code provided on the cassette mounted on the cassette mounting section, and an information transmitting section transmitting information on the progress of process steps in processing each workpiece stored in the cassette, to a customer that has ordered the processing of each workpiece stored in the cassette.
    Type: Application
    Filed: April 4, 2019
    Publication date: October 17, 2019
    Inventor: Kazuma SEKIYA
  • Wafer processing method and cutting apparatus
    Patent number: 10446403
    Abstract: A wafer processing method for processing a wafer having, on a face side, a device formed in each of areas demarcated by a plurality of crossing projected cutting lines includes a holding step of holding the wafer on a chuck table with the face side exposed and a cutting step of cutting the wafer held on the chuck table along the projected cutting lines with a cutting blade. In the cutting step, cutting is carried out while cutting water with a low resistivity is supplied to the face side of the wafer and cutting water with a high resistivity is supplied to the cutting blade.
    Type: Grant
    Filed: October 23, 2017
    Date of Patent: October 15, 2019
    Assignee: DISCO CORPORATION
    Inventor: Kazuma Sekiya
  • CHUCK TABLE AND PROCESSING APPARATUS INCLUDING THE SAME
    Publication number: 20190275700
    Abstract: A chuck table having a holding portion for holding a workpiece and a frame for supporting the holding portion. The holding portion includes a substrate having a plurality of fine holes arranged like a matrix at given intervals and a plurality of acoustic emission sensors arranged like a matrix on the substrate and spaced from each other so that each fine hole of the substrate is located between any adjacent ones of the acoustic emission sensors. The plurality of fine holes are connected through the frame to a vacuum source, thereby holding the workpiece on the acoustic emission sensors under suction. An elastic wave generated from the workpiece in processing the workpiece is collected at a plurality of positions by the plurality of acoustic emission sensors.
    Type: Application
    Filed: March 7, 2019
    Publication date: September 12, 2019
    Inventor: Kazuma SEKIYA