Abstract: A UV-curable optical resin adhesive composition is provided, which is excellent in transparency, adhesive reliability and durability and suitable for rework (repair) without an adverse influence on the brightness, the contrast and the Quality of a display image. The UV-curable optical resin adhesive composition is used for filling a gap between an image display panel and a protective cover plate, and comprises: (A) an acryl polymer having a (meth)acryloyl group at its side chain; and (B) a photopolymerization initiator.

Abstract: A dye-sensitized solar cell is provided, which includes a seal member that is free from swelling and degradation during prolonged sealing use and highly excellent in sealability. The dye-sensitized solar cell includes: a pair of electrode substrates spaced a predetermined distance from each other with their electrically conductive electrode surfaces facing inward; a seal member disposed along peripheries of inner surfaces of the electrode substrates to seal a space between the electrode substrates; and an electrolyte solution filled in the sealed space. The seal member is composed of a material cured by photopolymerizing the following photopolymerizable composition (A), and the electrode substrates each have a portion coated with a (meth)acryloxyalkylsilane silane coupling agent in contact with the seal member. The photopolymerizable composition (A) contains a hydrogenated elastomer derivative having at least one (meth)acryloyl group at at least one of its opposite molecular terminals.

Abstract: A dye-sensitized solar cell is provided, which includes: a pair of electrode substrates (1,1?) bonded to each other with a seal member (7) with their electrically conductive electrode surfaces facing inward, one of the electrode substrates being opaque or translucent, the other electrode substrate being transparent; and an electrolyte solution contained therein. The seal member (7) is composed of a material cured by photopolymerizing a photopolymerizable composition essentially comprising a hydrogenated elastomer derivative having at least one (meth)acryloyl group at least one of its opposite molecular terminals, and the electrode substrates (1, 1?) each have a portion coated with a silane coupling agent of a (meth)acryloxyalkylsilane in contact with the seal member (7). Therefore, the dye-sensitized solar cell has higher adhesive sealability and excellent durability.

Abstract: A resin composition for semiconductor encapsulation having good moldability, of which the cured product has effective electromagnetic wave shieldability, is provided. A resin composition for semiconductor encapsulation, containing spherical sintered ferrite particles having the following properties (a) to (c) : (a) the soluble ion content of the particles is at most 5 ppm; (b) the mean particle size of the particles is from 10 to 50 ?m; (c) the crystal structure of the particles by X-ray diffractiometry is a spinel structure.

Abstract: A dye-sensitized solar cell is provided, which includes glass substrates (1, 1?) each formed with an electrically conductive transparent electrode film and bonded to each other in opposed relation with a seal member (7), and an electrolyte solution filled in a space between the glass substrates. The seal member (7) is composed of a material cured by photopolymerizing a photopolymerizable composition essentially containing a hydrogenated elastomer derivative having at least one (meth)acryloyl group at least one of its opposite molecular terminals, and the glass substrates (1, 1?) each have a portion coated with a silane coupling agent of a (meth)acryloxyalkylsilane in contact with the seal member (7). Therefore, the dye-sensitized solar cell has higher adhesive sealability and excellent durability.

Abstract: The present invention provides a low-modulus low-stress resin which has such heat resistance that cohesive force and reliability can be retained even at high temperatures and which is applicable as various functional materials. The resin is a thermoplastic resin having a modulus of elasticity at room temperature, 25° C., of 1 GPa or lower and a modulus of elasticity at 250° C. of 1 MPa or higher, or a precursor resin thereof.

Abstract: An object of the present invention is to provide an electronic part device which can be repaired even in the case of an electronic part device having a malfunction in electrical connection after carrying out underfill. The present invention is an electronic part device in which a semiconductor element (flip chip) (3) is mounted on a wiring circuit substrate (1) under such a state that an electrode part for connection (joint ball) disposed on the semiconductor element (flip chip) (3) and a circuit electrode (5) disposed on the wiring circuit substrate (1) are facing with each other. In addition, the gap between the wiring circuit substrate (1) and the semiconductor element (flip chip) (3) is filled by a filling resin layer (4) comprising a liquid epoxy resin composition which comprises the following component (D) and the following components (A) to (C). (A) A liquid epoxy resin. (B) A curing agent. (C) An N,N,N?,N?-tetra-substituted fluorine-containing aromatic diamine compound.

Abstract: The present invention provides a low-modulus low-stress resin which has such heat resistance that cohesive force and reliability can be retained even at high temperatures and which is applicable as various functional materials. The resin is a thermoplastic resin having a modulus of elasticity at room temperature, 25° C., of 1 GPa or lower and a modulus of elasticity at 250° C. of 1 MPa or higher, or a precursor resin thereof.

Abstract: There is provided a low viscosity liquid epoxy resin composition which has excellent repairability because of the capability to remove residues at around room temperature even in the case of an electronic part device having a deficiency in the electric connection after once carrying out underfill, and what is more, wherein an electric parts device having a connected mounted structure shows high reliability. The liquid epoxy resin composition is used for resin-filling the gap between a circuit substrate and a semiconductor part on an electronic part device, wherein said electronic part device comprises a circuit substrate having an electrode part for connection and a semiconductor part having an electrode part for connection and being mounted on the circuit substrate in such a way that the electrode part of the circuit substrate and the electrode part of the semiconductor part are facing each other.

Abstract: A high-dielectric material which is especially useful as a material for a high-capacitance capacitor and which has a high dielectric constant is provided. The high-dielectric material is composed of a sintered body of a rare-earth sulfide, the high-dielectric material having a crystal structure of tetragonal ? type, a chemical composition represented by Ln2S3 (where Ln represents a rare-earth metal), a frequency domain within the range of 0.5 kHz to 1,000 kHz, and a value of relative dielectric constant of more than 1,000 at room temperature.

Abstract: A cooling device for a heat-generating electronic component such as a semiconductor integrated circuit element is provided. In particular, a cooling device using a thermoelectric conversion material is provided. A cooling device for an electronic component includes a thermoelectric conversion material disposed between two electrodes that function as a cathode and an anode and are electrically short-circuited. The thermoelectric conversion material is either a p-type material or an n-type material or a combination of p-type and n-type materials arranged alternately in series. This cooling device is brought into contact with an electronic component requiring cooling so that one electrode side in contact with the thermoelectric conversion material becomes a low-temperature side and the other electrode side becomes a high-temperature side.

Abstract: An object of the present invention is to provide an electronic part device which can be repaired even in the case of an electronic part device having a malfunction in electrical connection after carrying out underfill. The present invention is an electronic part device in which a semiconductor element (flip chip) (3) is mounted on a wiring circuit substrate (1) under such a state that an electrode part for connection (joint ball) disposed on the semiconductor element (flip chip) (3) and a circuit electrode (5) disposed on the wiring circuit substrate (1) are facing with each other. In addition, the gap between the wiring circuit substrate (1) and the semiconductor element (flip chip) (3) is filled by a filling resin layer (4) comprising a liquid epoxy resin composition which comprises the following component (D) and the following components (A) to (C) (A) A liquid epoxy resin. (B) A curing agent. (C) An N,N,N?,N?-tetra-substituted fluorine-containing aromatic diamine compound.

Abstract: A resin component for encapsulating a semiconductor includes magnetic powder and silica powder whose average particle diameter is smaller than the average particle diameter of the magnetic powder. Thus, the curing body of the resin component for encapsulating a semiconductor has an electromagnetic wave shielding function by the magnetic powder. Since the spaces of the magnetic powder are filled with the silica powder whose average particle diameter is small, the moldability of the curing body is improved and the insulating characteristics thereof are enhanced. Such a resin component for encapsulating a semiconductor is employed, there can be produced a preferably formed and encapsulated semiconductor device having the electromagnetic wave shielding function and having no malfunction generated due to leakage current from a semiconductor element.

Abstract: A semiconductor element is mounted on a wiring circuit board in which a circuit has been formed. This semiconductor element is resin-encapsulated with a first encapsulating resin layer. Then, a second encapsulating resin layer is formed, on the outer circumference of the first encapsulating resin layer, from an epoxy resin composition containing the following components (A) to (D): (A) epoxy resin; (B) phenolic resin; (C) curing accelerator; and (D) at least one of the following particles (d1) and (d2): (d1) conductive particles whose surfaces are subjected to coating treatment with an insulating inorganic material; and (d2) magnetic particles whose surfaces are subjected to coating treatment with an insulating inorganic material.

Abstract: An electromagnetic wave suppressor sheet formed into a sheet-like shape out of a material made of synthetic resin in which powder of conjugated magnetic particles surface-treated with an insulating inorganic material has been dispersed.

Abstract: An electronic component is described, which contains a printed circuit board having electrodes for connection and a semiconductor chip having electrodes for connection which is mounted on said circuit board with their electrodes facing those of the circuit board, the gap between the circuit board and the semiconductor chip being filled with a sealing resin layer, wherein the sealing resin layer is formed of a liquid epoxy resin composition containing (A) a liquid epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) an N,N,N′,N′-tetrasubstituted fluorine-containing aromatic diamine derivative.

Abstract: An electronic component is described, which contains a printed circuit board having electrodes for connection and a semiconductor chip having electrodes for connection which is mounted on said circuit board with their electrodes facing those of the circuit board, the gap between the circuit board and the semiconductor chip being filled with a sealing resin layer, wherein the sealing resin layer is formed of a liquid epoxy resin composition containing (A) a liquid epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) an N,N,N′,N′-tetrasubstituted fluorine-containing aromatic diamine derivative.

Abstract: A resin component for encapsulating a semiconductor includes magnetic powder and silica powder whose average particle diameter is smaller than the average particle diameter of the magnetic powder. Thus, the curing body of the resin component for encapsulating a semiconductor has an electromagnetic wave shielding function by the magnetic powder. Since the spaces of the magnetic powder are filled with the silica powder whose average particle diameter is small, the moldability of the curing body is improved and the insulating characteristics thereof are enhanced. Such a resin component for encapsulating a semiconductor is employed, there can be produced a preferably formed and encapsulated semiconductor device having the electromagnetic wave shielding function and having no malfunction generated due to leakage current from a semiconductor element.

Abstract: A semiconductor element is mounted on a wiring circuit board in which a circuit has been formed. This semiconductor element is resin-encapsulated with a first encapsulating resin layer.

Abstract: An electromagnetic wave suppressor sheet formed into a sheet-like shape out of a material made of synthetic resin in which powder of conjugated magnetic particles surface-treated with an insulating inorganic material has been dispersed.