Patents by Inventor Kazumitsu Ishikawa

Kazumitsu Ishikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printed wiring board and process for producing the same
    Patent number: 5243142
    Abstract: A printed wiring board obtained by filling a non-electroconductive resin paste containing a metal powder in inner wall metallized through holes of double sided copper-clad insulating substrate, followed by curing by two steps, can mount leadless parts in high mounting density without losing a function of electroconnecting wiring layers.
    Type: Grant
    Filed: July 25, 1991
    Date of Patent: September 7, 1993
    Assignee: Hitachi Aic Inc.
    Inventors: Kazumitsu Ishikawa, Haruo Suzuki, Shoji Oikawa