Abstract: A packaged semiconductor device having an LOC structure, a thin body, and good electrical characteristics employs a TAB tape. A semiconductor chip carries ground pads arranged in a row, power pads arranged in another row, and signal pads arranged in two rows on both sides of the rows of ground and power pads. A shared ground lead and a shared power lead extend along and are connected to ground pads and power pads, respectively.

Abstract: A semiconductor device includes an insulating substrate; a semiconductor chip on which plural electrodes including at least one ground electrode and at least one power source electrode are disposed; plural leads supported by an obverse surface of the insulating substrate, the plural leads being connected to corresponding electrodes on the semiconductor chip; at least one grounding conductor plate on a reverse surface of the insulating substrate; and at least one power source conductor plate on the reverse surface of the insulating substrate.

Abstract: A carrier tape includes an insulating film supporting a plurality of leads. The film has a center device hole for receiving a semiconductor chip therein, a plurality of outer lead holes formed at the periphery of the center device hole, a lead supporting portion positioned between the center device hole and the outer lead holes, and a link portion positioned between a pair of adjacent outer lead holes and connected to the lead supporting portion for directing the flow of molten resin during encapsulation of the semiconductor chip. The link portion includes an opening or recess. The plurality of leads of the carrier tape are supported on the lead supporting of the film, with one end portion of each lead projecting into the center device hole of the film. During manufacture, a semiconductor chip having a plurality of electrodes is positioned within the center device hole, and the leads are electrically connected to respective electrodes of the semiconductor chip.

Abstract: A packaged semiconductor device includes trapezoidal power leads and an earth lead in a resin package. The power and earth leads have a large area, radiate heat, and reduce inductance, improving the electrical characteristics of the packaged semiconductor device.

Abstract: A semiconductor device having a heat radiating member and a laminated structure for improvements in electrical and heat radiating characteristics. The heat radiating member is partially exposed outside a resin package of the semiconductor device to radiate heat generated by a semiconductor element to the outside of the device. In the laminated structure, a capacitor having a small capacity is formed by two electrically conductive plates one of which is connected to power supply leads and the other of which is connected to a grounded portion of the semiconductor element and to a grounding lead.

Abstract: A semiconductor device comprises a die pad having first and second surfaces; a semiconductor chip having a plurality of electrodes and mounted on the first surface of the die pad; a radiator attached by caulking to the second surface of the die pad; a plurality of leads each of which has one end electrically connected to a corresponding electrode of the chip; and a resin package in which the die pad, the semiconductor chip, the radiator and the ends of the leads are molded. This semiconductor device exhibits excellent thermal radiator properties.