Abstract: A plasma processing apparatus includes a balun having a first unbalanced terminal, a second unbalanced terminal, a first balanced terminal, and a second balanced terminal, a grounded vacuum container, a first electrode electrically connected to the first balanced terminal, a second electrode electrically connected to the second balanced terminal, an impedance matching circuit, a first power supply connected to the balun via the impedance matching circuit, and configured to supply a high frequency to the first electrode via the impedance matching circuit and the balun, a low-pass filter, and a second power supply configured to supply a voltage to the first electrode via the low-pass filter.

Abstract: [OBJECT] To provide a resin-made oil pan without breakage even when the oil pan strikes against an obstruction. [MEANS TO SOLVE] A bottom wall 2 of an oil pan 1 made of resin material has a front side wall section 5 that is located at a vehicle front side and a rear side wall section 6 that is located at a vehicle rear side with respect to the front side wall section 5 and continues to the front side wall section 5 at a predetermined angle. The front side wall section 5 is set so as to have an inclination so that as a position on the front side wall section 5 gets closer to the vehicle rear side, the position on the front side wall section 5 is located in a lower position in a vehicle up-and-down direction in a state in which the oil pan 1 is secured to a cylinder block mounted on a vehicle.

Abstract: [OBJECT] To provide a resin-made oil pan without breakage even when the oil pan strikes against an obstruction. [MEANS TO SOLVE] A bottom wall 2 of an oil pan 1 made of resin material has a front side wall section 5 that is located at a vehicle front side and a rear side wall section 6 that is located at a vehicle rear side with respect to the front side wall section 5 and continues to the front side wall section 5 at a predetermined angle. The front side wall section 5 is set so as to have an inclination so that as a position on the front side wall section 5 gets closer to the vehicle rear side, the position on the front side wall section 5 is located in a lower position in a vehicle up-and-down direction in a state in which the oil pan 1 is secured to a cylinder block mounted on a vehicle.

Abstract: A light emitting device includes a light source and a light guide body having a light guiding surface from which light emitted from the light source is received and having a light emitting surface from which the received light is emitted. A plurality of rows of light source arrays each formed by a plurality of the light sources are provided on the light guiding surface.

Abstract: A diode such as a cell string bypass diode or a reverse-current preventive diode exhibiting excellent heat dissipativity and preferably sealed integrally in a solar cell module. An N terminal (11) consists thickness part of 0.8 mm or above, i.e. an N substrate part (12), one thin part, i.e. an N thin part (13), and a P connecting wire receiving part (24). In a state where a diode chip (31) is connected, the thicknesses of the entire lead terminals are substantially the same, the total value of the plane area of the N substrate part and the P substrate part is 200 (mm)2 or above, and the diode with a lead terminal is sealed together with the solar cell between the front surface material and the rear surface material for sealing the solar cell.

Abstract: A light emitting device includes a light source and a light guide body having a light guiding surface from which light emitted from the light source is received and having a light emitting surface from which the received light is emitted. A plurality of rows of light source allays each formed by a plurality of the light sources are provided on the light guiding surface.

Abstract: The object of the present invention is to provide a diode that acts as a cell string bypass diode or a reverse-current preventive diode, has excellent heat dissipativity, and are preferably sealed integrally in a solar cell module. An N terminal 11 has an N substrate part 12 having an even thickness of 0.8 mm or more, an N thin part 13, which is one thin part, and an N connecting wire receiving part 14, which is the other thin part. A P terminal 21 has a P substrate part 22, a P thin part 23, and a P connecting wire receiving part 24. In a state where said diode chip 31 is connected, the thickness of the entire lead terminal is almost the same as that of the substrate part, i.e. the terminal, and the total of plane area of the N substrate part and that of the P substrate part is 200 mm2 or more. Said diode, together with the solar cell, is sealed between a front surface material and a rear surface material where the solar cell is to be sealed.

Abstract: An optical component of the present invention is compensated its optical dispersion, including third order dispersion, at low loss using optical dispersion compensating element comprising multi-layer film. In the optical component, an optical dispersion compensating element and a functional element are connected in series along an optical path.

Abstract: Methods and kits for determining prostate cancer prognosis in a subject are described. The hybridization pattern of a set of chromosomal probes is correlated with prostate cancer prognosis in the subject.

Abstract: An optical component of the present invention is compensated its optical dispersion, including third order dispersion, at low loss using optical dispersion compensating element comprising multi-layer film. In the optical component, an optical dispersion compensating element and a functional element are connected in series along an optical path.

Abstract: Methods and kits for determining prostate cancer prognosis in a subject are described. The hybridization pattern of a set of chromosomal probes is correlated with prostate cancer prognosis in the subject.

Abstract: A semiconductor device having lead terminals bent in a J-shape is disclosed. A radiating plate having a recess formed on an outer peripheral portion thereof is exposed to a lower face of a resin member and free ends of outer portions of the lead terminals are positioned in the recess of the radiating plate. The free ends of the outer portions of the lead terminals and the recess of the radiating plate are isolated from each other by projections of the resin member. Since the radiating plate is exposed to the lower face of the resin member, the heat radiating property is high whereas the radiating plate and the lead terminals are not short-circuited to each other at all.

Abstract: A semiconductor device having a pellet mounted on a radiating plate thereof is disclosed. The radiating plate is formed in such a shape that a central portion thereof is positioned higher than both end portions thereof. A pellet is mounted on a lower face of the central portion of the radiating plate, and an upper face of the central portion of the radiating plate is exposed to the top of a resin member. Since the upper face of the central portion of the radiating plate which has the pellet mounted on the lower face thereof is exposed from the resin member, heat generated by the pellet can be radiated efficiently.

Abstract: A semiconductor device is disclosed wherein a pair of radiating terminals and a plurality of lead terminals are formed from a single lead frame. A hole or holes in each radiating terminal are formed with an equal width and in an equal pitch to those of gaps between the lead terminals, and the opposite sides of each hole of the radiating terminal are connected to each other by a support element. The support elements of the radiating terminals and support elements which interconnect the lead terminals are formed with an equal length and in an equal pitch to allow the support elements to be cut away by a plurality of punches which are arranged in an equal pitch and have an equal width.

Abstract: A plastic-encapsulated semiconductor device is provided, which is capable of efficient heat dissipation without upsizing while preventing the moisture from reaching an IC chip. This device is comprised of an electrically-conductive island having a chip-mounting area, an IC chip fixed on the chip-mounting area of the island, leads electrically connected to bonding pads of the chip through bonding wires, a plastic package for encapsulating the island, the chip, the bonding wires, and inner parts of the leads. The package has an approximately flat bottom face. Outer parts of the leads are protruded from the package and are located in approximately a same plane as the bottom face of the package. The island has an exposition part exposed from the package at a location excluding the chip-mounting area. A lower face of the exposition part of the island is located in approximately a same plane as the bottom face of the package. The chip and the chip-mounting area of the island are entirely buried in the package.