Abstract: First, in a primary sintering step, a manufacturing system 1 for a sliding member 2 laminates and thereby forms a sintered alloy layer 4 on back metal 3. Subsequently, a large number of indents 5 are formed on a front surface of the sintered alloy layer 4 by an indent forming mechanism 14. Next, the back metal 3 and sintered alloy layer 4 are rolled by a reduction roll 15 and a secondary sintering process is applied to the sintered alloy layer 4. Consequently, the sliding member 2 is manufactured with the large number of indents 5 provided on a front surface. Since the indents 5 are formed on the sintered alloy layer 4 after the primary sintering step, it is possible to inhibit work hardening from occurring in the indents 5 and surrounding areas.

Abstract: A joint structure of a door edge member (such as a garnish or trim) includes a door upper edge member having a baglike cross section (such as a partially hollow open receptacle), constituted by inner surfaces, at the longitudinal end portion thereof, and a door rear edge member having the longitudinal end portion inserted into the end portion of the door upper edge member having the baglike cross section and connected to the door upper edge member. The baglike cross section of the door upper edge member has a first cross-sectional portion provided on one end portion of the door upper edge member in the short side direction thereof, and a second cross-sectional portion provided on the other end portion side in the short side direction.

Abstract: The invention provides a wafer mold material for collectively subjecting a wafer having semiconductor devices on a surface thereof to resin molding, wherein the wafer mold material has a resin layer containing a filler and at least any one of an acrylic resin, a silicone resin having an epoxy group, an urethane resin, and a polyimide silicone resin, and the wafer mold material is formed into a film-like shape. There can be a wafer mold material that enables collective molding (wafer molding) with respect to a wafer having semiconductor devices formed thereon, has excellent transference performance with respect to a large-diameter thin-film wafer, can provide a flexible hardened material with low-stress properties, and can be preferably used as a mold material in a wafer level package with less warp of a formed (molded) wafer.

Abstract: A semiconductor apparatus adhesive composition having excellent adhesion properties when pressure-bonded and has excellent connection reliability and insulation reliability when hardened and an adhesive sheet using this adhesive composition. An adhesive composition including: (A) a silicone resin constituted of a repeating unit represented by the following general formula (1); (B) a thermosetting resin; and (C) a compound having a flux activity, where R1 to R4 represent univalent hydrocarbon groups having carbon numbers from 1 to 8, which are equal to or different from each other; each of 1 and m is an integer from 1 to 100; each of a, b, c, and d is 0 or a positive number and meets 0<(c+d)/(a+b+c+d)?1.0; and each of X and Y is a bivalent organic group.

Abstract: A frame molding is provided. The frame molding includes a frame molding main body having first claws and a holder member assembled with the frame molding main body. A holder member includes a metal holder portion and a resin holder portion fixed to the metal holder portion. The resin holder has receiving portions that are crimped by the claws.

Abstract: The invention relates to a photo-curable resin composition, which contains a polyimide silicone having a primary alcoholic hydroxyl group, as a component (A); at least one compound selected from the group consisting of an amino condensation product modified with formalin or a formalin-alcohol and a phenol compound having two or more in average of methylol group or alkoxymethylol group in one molecule thereof, as a component (B); and a photo-acid generator as a component (C). When used as an adhesive, the photo-curable resin composition further contains a multifunctional epoxy compound as a component (D).

Abstract: Provided is a method for manufacturing a lamination type semiconductor integrated device that can simultaneously attain grinding force resistance during back side grinding of a semiconductor wafer, heat resistance during anisotropic dry etching and the like, chemical resistance during plating and etching, smooth debonding of a support substrate for processing at the end, and low adherend staining; the method comprises at least a step of back side grinding of a first semiconductor wafer having a device formed on its surface and a step of laminating by electrical bonding the first semiconductor wafer with a second semiconductor wafer having a device formed on its surface, wherein, at the time of back side grinding of the first semiconductor wafer, back of the first semiconductor wafer is ground after surface of formed device on the first semiconductor wafer is bonded to a support substrate for processing by using a pressure-sensitive silicone adhesive.

Abstract: The present invention provides a halogen-free, flame retardant adhesive composition that exhibits excellent anti-migration properties, not only within single layer structures, but also within multilayer structures of much higher density such as copper-clad laminates. The flame retardant adhesive composition according to the present invention comprises: (A) a halogen-free epoxy resin, (B) a carboxyl group-containing acrylic resin and/or a carboxyl group-containing acrylonitrile-butadiene rubber, (C) a curing agent, (E) specific phosphinate and/or diphosphonate compounds, and (F) an ion scavenger and/or a heavy metal deactivator.

Abstract: The present invention provides a halogen-free, flame retardant adhesive composition that exhibits excellent anti-migration properties, not only within single layer structures, but also within multilayer structures of much higher density. The flame retardant adhesive composition according to the present invention comprises: (A) a halogen-free epoxy resin, (B) a carboxyl group-containing acrylic resin and/or a carboxyl group-containing acrylonitrile-butadiene rubber, (C) a curing agent, (E) a specific polyphosphoric acid-melamine-based compound salt and/or polyphosphoric acid-diamine compound salt, and (F) an ion scavenger and/or a heavy metal deactivator.

Abstract: A joint structure of a door edge member includes a door upper edge member having a baglike cross section, constituted by inner surfaces, at the longitudinal end portion thereof, and a door rear edge member having the longitudinal end portion inserted into the end portion of the door upper edge member having the baglike cross section and connected to the door upper edge member. The baglike cross section of the door upper edge member has a first cross-sectional portion provided on one end portion of the door upper edge member in the short side direction thereof, and a second cross-sectional portion provided on the other end portion side in the short side direction.

Abstract: There is provided a high pressure fuel pump control system for an internal combustion engine which enables fuel pressure control with high precision without being restricted by the number of cylinders of the internal combustion engine or the number of phase sensor signals and the number of cam noses which vertically drives a plunger of a high pressure fuel pump even when a camshaft phase varies by a variable valve timing mechanism by using the high pressure fuel pump with a solenoid valve. The control system has a means which changes an effective stroke by driving the solenoid valve in the high pressure fuel pump, and has a means which changes the drive timing of the high pressure fuel pump based on a cylinder recognition value of the internal combustion engine with the cam angle detecting means as an origin.

Abstract: Provided is a flame retardant adhesive composition including (A) a halogen-free epoxy resin, (B) a thermoplastic resin and/or a synthetic rubber, (C) a curing agent, (D) a nitrogen-containing polyphosphate compound, and (E) a curing accelerator. Also provided are an adhesive sheet having a layer including the above composition, and a protective layer for covering the layer including the composition; a coverlay film having an electrically insulating film, and a layer including the above composition provided on top of the film; a flexible copper-clad laminate having an electrically insulating film, a layer including the above composition provided on top of the film, and copper foil; and a method of bonding two substrates, including the steps of sandwiching the above adhesive sheet between two substrates, and curing the adhesive sheet. Further provided are a process for producing the adhesive sheet, a process for producing the coverlay film, and a process for producing the flexible copper-clad laminate.

Abstract: Provided is a flame retardant adhesive composition including (A) a halogen-free epoxy resin, (B) a thermoplastic resin and/or a synthetic rubber, (C) a curing agent, (D) a phytate compound, and (E) a curing accelerator. Also provided are an adhesive sheet having a layer including the above composition, and a protective layer for covering the layer including the composition; a coverlay film having an electrically insulating film, and a layer including the above composition provided on top of the film; and a flexible copper-clad laminate having an electrically insulating film, a layer including the above composition provided on top of the film, and copper foil. Further provided are a process for producing the adhesive sheet, a process for producing the coverlay film, and a process for producing the flexible copper-clad laminate. The halogen-free adhesive composition yields a cured product, on curing, that exhibits excellent flame retardancy and electrical characteristics (anti-migration properties).

Abstract: The present invention provides a halogen-free, flame retardant adhesive composition that exhibits excellent anti-migration properties, not only within single layer structures, but also within multilayer structures of much higher density such as copper-clad laminates. The flame retardant adhesive composition according to the present invention comprises: (A) a halogen-free epoxy resin, (B) a carboxyl group-containing acrylic resin and/or a carboxyl group-containing acrylonitrile-butadiene rubber, (C) a curing agent, (E) specific phosphinate and/or diphosphonate compounds, and (F) an ion scavenger and/or a heavy metal deactivator.

Abstract: The present invention provides a halogen-free, flame retardant adhesive composition that exhibits excellent anti-migration properties, not only within single layer structures, but also within multilayer structures of much higher density. The flame retardant adhesive composition according to the present invention comprises: (A) a halogen-free epoxy resin, (B) a carboxyl group-containing acrylic resin and/or a carboxyl group-containing acrylonitrile-butadiene rubber, (C) a curing agent, (E) a specific polyphosphoric acid-melamine-based compound salt and/or polyphosphoric acid-diamine compound salt, and (F) an ion scavenger and/or a heavy metal deactivator.

Abstract: An adhesive sheet made of an acrylic adhesive composition comprising (A) an acrylic polymer containing carboxyl groups and having a Tg of 5-30° C., (B) a resol phenolic resin, (C) an epoxy resin, and (D) a curing accelerator has improved heat resistance, processing and handling as well as good adhesion, and is suited for use in the manufacture of FPC.

Abstract: To provide an oil cleaning sheet for makeup which has excellent oil absorption, allows clear assessment of the oil absorbing effect by becoming transparent upon oil absorption, thus providing the user with a feeling of adequate wiping and a sense of satisfaction, has an agreeable feel, is resistant to damage during use and which does not require inclusion of particulate bodies on the surface. The oil cleaning sheet consists of a porous stretched film made of a plastic material.

Abstract: To provide an oil cleaning sheet for makeup which has excellent oil absorption, allows clear assessment of the oil absorbing effect by becoming transparent upon oil absorption, thus providing the user with a feeling of adequate wiping and a sense of satisfaction, has an agreeable feel, is resistant to damage during use and which does not require inclusion of particulate bodies on the surface. The oil cleaning sheet consists of a porous stretched film made of a plastic material.

Abstract: Provided is a flame retardant adhesive composition including (A) a halogen-free epoxy resin, (B) a thermoplastic resin and/or a synthetic rubber, (C) a curing agent, (D) an organophosphinate compound, (E) a curing accelerator, and (F) a nitrogen-containing organophosphate compound represented by a general formula (1) shown below: (wherein, R1 to R4 each represent a hydrogen atom or an alkyl group, and X represents a nitrogen-containing bivalent organic group) Also provided are an adhesive sheet having a layer comprising the above composition, and a protective layer for covering the layer comprising the composition; a coverlay film having an electrically insulating film, and a layer comprising the above composition provided on top of the film; and a flexible copper-clad laminate having an electrically insulating film, a layer comprising the above composition provided on top of the film, and a copper foil provided on top of the layer comprising the composition.

Abstract: Provided is a flame retardant adhesive composition including (A) a halogen-free epoxy resin, (B) a thermoplastic resin and/or a synthetic rubber, (C) a curing agent, (D) a phytate compound, and (E) a curing accelerator. Also provided are an adhesive sheet having a layer including the above composition, and a protective layer for covering the layer including the composition; a coverlay film having an electrically insulating film, and a layer including the above composition provided on top of the film; and a flexible copper-clad laminate having an electrically insulating film, a layer including the above composition provided on top of the film, and copper foil. Further provided are a process for producing the adhesive sheet, a process for producing the coverlay film, and a process for producing the flexible copper-clad laminate. The halogen-free adhesive composition yields a cured product, on curing, that exhibits excellent flame retardancy and electrical characteristics (anti-migration properties).