Abstract: Collation can be carried out at a high speed without reducing the accuracy thereof, whereby processing of identifying documents is accurately performed at a high speed. To this end, characteristic data of a predetermined pattern is registered in advance. Characteristic data in a first area greater than an area of the predetermined pattern registered in advance in an image to be identified is compared and collated with characteristic data of the predetermined pattern. A second area smaller than the first area is cut out from the first area based on the result of comparison, so that characteristic data of an image in the second area is compared and collated with the characteristic data of the predetermined pattern, thus making it possible to identify the predetermined pattern contained in the image based on the result of comparison.

Abstract: A data medium handling apparatus and a data medium handling method suitable for use for handling of documents, for example, in a financial organ. The data medium handling apparatus (30) for recognizing, based on an image (19) read from a data medium on which information is described in an arbitrary format, the information, is constructed such that it comprises means (2) for extracting characteristics unique to the data medium including the format from the read image data (19) and specifying, from the characteristics, a position at which information to be recognized is present, and image recognition means (3) for recognizing the image (19) at the position specified by the preceding means (2) to discriminate the information, so that the data medium handling apparatus (30) can handle documents having various formats such as private slips.

Abstract: A data medium handling apparatus and a data medium handling method suitable for use for handling of documents, for example, in a financial organ. The data medium handling apparatus (30) for recognizing, based on an image (19) read from a data medium on which information is described in an arbitrary format, the information, is constructed such that it comprises means (2) for extracting characteristics unique to the data medium including the format from the read image data (19) and specifying, from the characteristics, a position at which information to be recognized is present, and image recognition means (3) for recognizing the image (19) at the position specified by the preceding means (2) to discriminate the information, so that the data medium handling apparatus (30) can handle documents having various formats such as private slips.

Abstract: A heat-active adhesive for a connecting circuit which is used for electrically connecting circuit electrodes facing each other in the pressing direction by heating and pressing the electrodes. The adhesive has an elastic modulus of 100-2,000 MPa at 40° C. after adhesion. The adhesive can contain at least an epoxy resin, acrylic rubber, and a latent curing agent. An acrylic rubber having a glycidryl ether group as a molecule is preferably used as the acrylic rubber.

Abstract: The present invention aims at an improvement in temperature-cycle resistance after packaging in semiconductor devices and also an improvement in moisture-absorbed reflow resistance, and provides an adhesive having a storage elastic modulus at 25° C. of from 10 to 2,000 MPa and a storage elastic modulus at 260° C. of from 3 to 50 MPa as measured with a dynamic viscoelastic spectrometer, and also a double-sided adhesive film, a semiconductor device and a semiconductor chip mounting substrate which make use of the adhesive, and their production process.

Abstract: An image collating apparatus and an image collating method, in which a document larger than an image reader can be collated using a preregistered image even in the case where the document is read by the image reader, are disclosed. The image of the document read by the image reader is collated sequentially with the document images of different sizes preregistered in a data base. The document size is determined from the document image input from the image reader. In the case where the document size is smaller than the preregistered image size, the preregistered image is retrieved in accordance with the document size, so that the document features are extracted and matched between the read document image and the registered image set in size to each other, thereby collating the read image with the preregistered image.

Abstract: The present invention aims at an improvement in temperature-cycle resistance after packaging in semiconductor devices and also an improvement in moisture-absorbed reflow resistance, and provides an adhesive having a storage elastic modulus at 25° C. of from 10 to 2,000 MPa and a storage elastic modulus at 260° C. of from 3 to 50 MPa as measured with a dynamic viscoelastic spectrometer, and also a double-sided adhesive film, a semiconductor device and a semiconductor chip mounting substrate which make use of the adhesive, and their production process.

Abstract: To provide a highly reliable semiconductor device structure that enables cost reduction in the production of packages, inclusive of the cost for chips, and may cause less changes in connection resistance even under conditions of a long-term environmental resistance test. In a semiconductor device comprising a semiconductor chip face-down bonded to a wiring board, it has a structure wherein projecting metal portions are provided at the opposing wiring board terminals without forming bumps on bonding pads of the chip, the whole chip surface is bonded with an organic, anisotropic conductive adhesive material, and the whole or at least an edge of the back of the chip is covered with a sealing material.

Abstract: An insulating varnish comprising a resin component, electrical insulating whiskers, and if necessary, one or more additives such as an ion adsorbent, and/or an organic reagent for preventing injury from copper, produced by adding the additives to the resin component and the whiskers, or filtering the whiskers, or milled by using a beads mill or a three-roll mill, or the like, is excellent for producing a multilayer printed circuit board having high wiring density, high reliability and excellent other electrical properties.

Abstract: In regard to a packaging substrate on which a semiconductor chip is mounted, the surface copper foil of a double-sided copper-clad glass epoxy resin laminated sheet is subjected to circuit formation and inner-layer bonding, then an epoxy resin adhesive film with copper foil is bonded to the surface of the inner-layer circuit by press lamination, and a through hole is formed through the sheet, followed by electroless copper plating, outer-layer circuit formation by the subtractive process, and solder coating to obtain the packaging substrate. The bump electrode of the semiconductor chip and the packaging substrate are connected through an adhesive film.

Abstract: A multilayer wiring board for mounting a semiconductor device, which has a multi-bonding-deck cavity, comprises at least two wiring boards and an insulation adhesive layer having an elastic modulus of 1,400 MPa or lower having a coefficient of thermal expansion of 450 ppm/.degree. C. or lower in a direction of thickness and being a cured product of an adhesive film which is a semi-cured product of an adhesive composition comprising (a) 71 to 100 parts by weight of an epoxy group-containing acrylic rubber having a glass transition point of -10.degree. C. or above and a weight average molecular weight of 100,000 or above, (b) 50 to 70 parts by weight of an epoxy resin having a weight average molecular. weight of less than 10,000 and a curing agent, (c) 10 to 60 parts by weight of a high-molecular weight resin being compatible with the epoxy resin and having a weight average molecular weight of 30,000 or above and (d) 0.1 to 5 parts by weight of a cure accelerator.

Abstract: An adhesive comprising (1) 100 parts by weight of a combination of an epoxy resin having a weight average molecular weight of less than 5,000 and a curing agent, (2) 10 to 40 parts by weight of a high-molecular weight component being compatible with the epoxy resin and having a weight average molecular weight of 30,000 or above, (3) 20 to 100 parts by weight of a high-molecular weight component being incompatible with the epoxy resin and having a weight average molecular weight of 30,000 or above, and (4) 0.1 to 5 parts by weight of a cure accelerator. The adhesive is excellent not only in moisture resistance, heat resistance, adhesive strength at high temperature, heat dissipation, reliability of insulation, crack resistance and flexibility but also in circuit filling and tight adhesion, and exhibits suitable flow properties.

Abstract: Provided is bonding film for printed circuit boards which is resistant to cracking even when bent with a small radius of curvature, has a sufficient mechanical strength even in its semi-cured state so that the handling may be facilitated, is not undesirably brittle and therefore does not produce undesired debris when cut, and is flexible and flame retardant at the same time. The bonding film may consist of (i) high polymer epoxy resin; (ii) denatured polyamide obtained by reacting epoxy resin and polyamide; (iii) polyfunctional epoxy resin; and (iv) curing agent. Preferably, the denatured polyamide includes a polyalkylene-glycol residue or a polycarbonate-diol residue. Preferably, the high polymer epoxy resin is produced by the polymerization of bifunctional epoxy resin and bifunctional phenol resin, and has a weight averaged molecular weight equal to 50,000 or higher.

Abstract: A novel metal-encapsulated fullerene compound wherein a side chain is introduced in a metal-encapsulated fullerene is provided.A metal-encapsulated fullerene compound represented by the following structural formula (1) is synthesized by causing a disilirane derivative or digermirane derivative having the following structural formula (2) to react with a metal-encapsulation fullerene so as to add functional groups to the fullerene. ##STR1## Herein, M is an encapsulated metal atom, m is an integer from 1 to 3, n is an even number from 28 to 200, and R is a t-butyl group or an aromatic group having alkyl groups in the 2,6-positions, such as mesityl, 2,6-diethylphenyl or 2,6-dimethylphenyl groups.

Abstract: There are provided a derivative of a metal-encapsulated fullerene having application as a functional material, superconducting material, electronics material or pharmaceutical material, and a method of synthesizing this derivative. The derivative of a metal-encapsulated fullerene having the following structure is synthesized by adding a substituted diazomethane to a metal-encapsulated fullerene and denitrifying in a solvent.

Abstract: In a process for producing a multilayer printed circuit board comprising drilling holes for via holes in a composite film material containing at least a copper foil and an insulating half-cured adhesive layer, laminating the resulting film material on an innerlayer circuit substrate, ad electrically connecting an innerlayer circuit with an outer layer copper foil, when an adhesive resin flowed into the holes is roughened, or when a composite film material having a copper foil of less than 12 .mu.m thick formed on a carrier is used, or a special cushion material is further laminated on the laminate of the innerlayer circuit substrate and the film material, electrical connection reliability is enhanced and circuit density can be increased with easy steps.

Abstract: Particles contained in a suspension are separated in accordance with their magnetic susceptibility and based on the variation in flow velocity of suspension. In order to achieve this magnetic separation, a pair of wall plates having at least one flat surface in which a plurality of ferromagnetic narrow wires are buried in parallel are positioned in parallel to each other with a small distance therebetween so that the flat surfaces are opposed to each other to form a channel. The suspension flows in a laminar state with different flow velocities through the channel in the longitudinal direction of the ferromagnetic wires. A magnetic field is externally applied to the channel in the direction perpendicular both to the flow direction and the wall plates. Particles are separated in accordance with their magnetic susceptibility and based on variation in flow velocity which interacts with the magnetic susceptibility.

Abstract: A method for detecting a fluidity of powder includes the steps of: (a) making the powder come into contact with a surface of a piezoelectric element which is parallel with an oscillating direction of the piezoelectric element that generates traverse wave oscillations; (b) detecting electrical characteristics of the piezoelectric element under a condition of resonance; and (c) detecting the fluidity of the powder in accordance with a change in the electrical characteristics with respect to a reference value.

Abstract: A composite release sheet material comprising a thermoplastic low-adhesive thin layer having a thickness of at least 5 .mu.m and a synthetic resin film layer having a greater tensile strength than the thin layer and, if desired, an anchor coat layer therebetween is disclosed. The composite release sheet material has an improved dimensional stability.