Abstract: To provide an epoxy resin composition exhibiting excellent low-dielectric properties, a polyvalent hydroxy resin and an epoxy resin that each provide such an epoxy resin composition, and a method for producing such a resin. A polyvalent hydroxy resin represented by the following general formula (1).

Abstract: Provided are an epoxy resin composition, which exhibits excellent low dielectric properties, and imparts excellent copper foil peel strength and interlayer cohesive strength when used in printed circuit plate applications; and a phenolic resin or an epoxy resin, which are for forming the epoxy resin composition. The phenolic resin is represented by General Formula (1) below. In the formula, R1's each represent a hydrocarbon group having 1 to 10 carbon atoms; R2's each represent a hydrogen atom, Formula (1a), or Formula (1b), where at least one of R2's is Formula (1a) or Formula (1b); and n represents the number of repetitions of 0 to 5.

Abstract: There are provided a naphthol resin and an epoxy resin that impart characteristics such as high heat resistance, a low dielectric loss tangent, and a low coefficient of thermal expansion (CTE), and an epoxy resin composition including the naphthol resin or the epoxy resin as an essential component, and cured products thereof. A naphthol resin which is represented by the following formula: where R1 represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, and n represents the number of repetitions and is a number of 2 to 10, and in which, in terms of area ratio in GPC measurement, a ratio of components for which n=6 or more is 15% or more, and a ratio of components for which n=1 in GPC is 30% or less, and a hydroxy group equivalent is 260 to 400 g/eq.

Abstract: Provided are a phenoxy resin having excellent heat resistance, low hygroscopicity, and solvent solubility, a resin composition using the same, and a cured object obtained therefrom. The phenoxy resin is represented by Formula (1) below and has an Mw of 10,000 to 200,000: where, X represents a divalent group, and includes, essentially, a group having a cyclohexane ring structure and a group having a fluorene ring structure. Y represents a hydrogen atom or a glycidyl group. n is the number of repetitions and an average value thereof is 25 to 500.

Abstract: To provide an epoxy resin composition that exhibits excellent low dielectric properties and that is excellent in copper foil peel strength and interlayer cohesion strength in a printed-wiring board application, a phenol resin and an epoxy resin for providing the composition, and a method for producing such a resin. A phenol resin containing a dicyclopentenyl group and represented by the following general formula (1): wherein each R1 independently represents a hydrocarbon group having 1 to 8 carbon atoms; each R2 independently represents a hydrogen atom or a dicyclopentenyl group, and at least one R2 is a dicyclopentenyl group; i is an integer of 0 to 2; and n represents the number of repetitions and an average value thereof is a number of 10 to 10.

Abstract: To provide a thermosetting resin composition that provides a cured product excellent in low-dielectric properties, high heat resistance, high adhesiveness, and the like. The thermosetting resin composition includes an aromatic polyhydroxy compound represented by the following formula (1), and a maleimide compound. In the formula, R1 independently represents a hydrocarbon group having 1 to 8 carbon atoms, R2 independently represents a hydrogen atom or a dicyclopentenyl group, and at least one R2 is a dicyclopentenyl group; and n represents the number of repetitions and an average value thereof is a number of 1 to 5.

Abstract: To provide an epoxy resin composition that exhibits excellent low-dielectric properties and that is excellent in copper foil peel strength and interlayer cohesion strength in a printed-wiring board application. An epoxy resin composition containing an epoxy resin and a curing agent, wherein the epoxy resin is partially or fully an epoxy resin represented by the following general formula (1). Each R1 represents a hydrocarbon group having 1 to 8 carbon atoms, each R2 represents a hydrogen atom or a dicyclopentenyl group, and at least one R2 is a dicyclopentenyl group; and m represents a number of 0 to 5.

Abstract: To provide an epoxy resin composition that exhibits excellent low-dielectric properties and that is excellent in copper foil peel strength and interlayer cohesion strength in a printed-wiring board application. An epoxy resin composition containing an epoxy resin and a curing agent, wherein the curing agent is partially or fully a polyvalent hydroxy resin represented by the following general formula (1). Each R1 independently represents a hydrocarbon group having 1 to 8 carbon atoms, each R2 independently represents a hydrogen atom or a dicyclopentenyl group, and at least one R2 is a dicyclopentenyl group; and n represents a number of repetitions of 0 to 5.

Abstract: Provided is a resin material showing a high thermal conductivity and having high heat resistance while having a low dielectric constant and a low dielectric loss tangent. The material is a polyfunctional vinyl resin, which is represented by the following general formula (1): where R1s each independently represent a hydrocarbon group having 1 to 8 carbon atoms, R2s each independently represent a hydrogen atom or a dicyclopentenyl group, and at least one thereof represents a dicyclopentenyl group, Xs each independently represent a hydrogen atom or a vinyl group-containing aromatic group represented by the formula (1a), and at least one thereof represents a vinyl group-containing aromatic group, “n” represents a number of repetitions, and the average thereof is a number of from 1 to 5, and Ar represents an aromatic ring.

Abstract: To provide an epoxy resin composition that exhibits excellent low-dielectric properties and that is excellent in copper foil peel strength and interlayer cohesion strength in a printed-wiring board application, as well as an active ester resin that provides the epoxy resin composition. An active ester resin having a polyaryloxy unit containing a dicyclopentenyl group and represented by the following formula (1), and a polyarylcarbonyl unit. Here, R1 represents a hydrocarbon group having 1 to 8 carbon atoms, R2 represents a hydrogen atom, or formula (1a) or formula (1b), and at least one R2 is formula (1a) or formula (1b); and n represents a number of repetitions of 1 to 5.

Abstract: There are provided a naphthol resin and an epoxy resin that impart characteristics such as high heat resistance, a low dielectric loss tangent, and a low coefficient of thermal expansion (CTE), and an epoxy resin composition including the naphthol resin or the epoxy resin as an essential component, and cured products thereof. A naphthol resin which is represented by the following formula: where R1 represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, and n represents the number of repetitions and is a number of 2 to 10, and in which, in terms of area ratio in GPC measurement, a ratio of components for which n=6 or more is 15% or more, and a ratio of components for which n=1 in GPC is 30% or less, and a hydroxy group equivalent is 260 to 400 g/eq.

Abstract: Provided are a phenoxy resin having excellent heat resistance, low hygroscopicity, and solvent solubility, a resin composition using the same, and a cured object obtained therefrom. The phenoxy resin is represented by Formula (1) below and has an Mw of 10,000 to 200,000: where, X represents a divalent group, and includes, essentially, a group having a cyclohexane ring structure and a group having a fluorene ring structure. Y represents a hydrogen atom or a glycidyl group. n is the number of repetitions and an average value thereof is 25 to 500.

Abstract: Provided are an epoxy resin composition, which exhibits excellent low dielectric properties, and imparts excellent copper foil peel strength and interlayer cohesive strength when used in printed circuit plate applications; and a phenolic resin or an epoxy resin, which are for forming the epoxy resin composition. The phenolic resin is represented by General Formula (1) below. In the formula, R1's each represent a hydrocarbon group having 1 to 10 carbon atoms; R2's each represent a hydrogen atom, Formula (1a), or Formula (1b), where at least one of R2's is Formula (1a) or Formula (1b); and n represents the number of repetitions of 0 to 5.

Abstract: A novel phosphorous-containing epoxy resin having a naphthalene skeleton is suitable as an insulating material, such as a copper-clad laminate used in an electronic circuit board, and a sealing material, molding material, casting material, adhesive or film material used in an electric component. Furthermore, this epoxy resin is suitable as a material for an electrically insulating coating.

Abstract: A resin composition for an optical waveguide is provided, which comprises: an epoxy compound represented by the following general formula (1): wherein m is 1 or a positive integer, n is 1 or a positive integer, R and R? which may be the same or different are each represented by the following formula (2) or (3), wherein c is a positive integer of 1 to 3 and each one of c may be the same or different, and X is represented by the following formula (4): wherein a is an integer of 0 to 2, and b is a positive integer of 1 to 3, and satisfy a condition of a+b=3; and a photoacid generator. The resin composition has a lower viscosity, and is excellent in flexibility and moisture absorption resistance. An optical waveguide produced by employing the resin composition is also provided.

Abstract: An epoxy resin possessing one or more primary hydroxyl groups and one or more epoxy groups in one molecule is useful in a photo-curing method.

Abstract: A new epoxy resin represented by following general formula comprising, possessing one or more than one primary hydroxyl group and one or more than one epoxy group in one molecular, and said epoxy resin is useful for photo curing method.

Abstract: A resin composition for an optical waveguide is provided, which comprises: an epoxy compound represented by the following general formula (1): wherein m is 0 or a positive integer, n is 0 or a positive integer, R and R? which may be the same or different are each represented by the following formula (2) or (3), wherein c is a positive integer of 1 to 3 and each one of c may be the same or different, and X is represented by the following formula (4): wherein a is an integer of 0 to 2, and b is a positive integer of 1 to 3, and satisfy a condition of a+b=3, and a is 1 to 3 in the epoxy compound represented by the formula (1); and a photoacid generator. The resin composition has a lower viscosity, and is excellent in flexibility and moisture absorption resistance. An optical waveguide produced by employing the resin composition is also provided.

Abstract: The object of the present invention is to provide a construction and coating composition that effectively utilizes vermiculite as a natural resource and is able to satisfy requirements for humidity control and/or deodorizing as well as an attractive appearance, while also offering superior balance between the amount and rates of moisture absorption and release, in particular. This object is achieved by a composition in which non-expanded vermiculite is blended into a base material so that the blended amount is 5-70 wt % of the total composition (solid portion). In addition, the above construction material can be converted into soil by crushing when it has become a waste construction material.

Abstract: The object of the present invention is to provide a construction and coating composition that effectively utilizes vermiculite as a natural resource and is able to satisfy requirements for humidity control and/or deodorizing as well as an attractive appearance, while also offering superior balance between the amount and rates of moisture absorption and release, in particular. This object is achieved by a composition in which non-expanded vermiculite is blended into a base material so that the blended amount is 5-70 wt % of the total composition (solid portion). In addition, the above construction material can be converted into soil by crushing when it has become a waste construction material.