Abstract: A manufacturing method for a single crystal of calcium fluoride by which it is possible to obtain a single crystal of calcium fluoride with adequately small double refraction, which can be used in optical systems for photolithography, and in particular, a single crystal of calcium fluoride with a large diameter (ø200 mm or larger) having superior optical properties, which can be used for photolithography with a wavelength of 250 nm or less.

Abstract: A manufacturing method for a single crystal of calcium fluoride by which it is possible to obtain a single crystal of calcium fluoride with adequately small double refraction, which can be used in optical systems for photolithography, and in particular, a single crystal of calcium fluoride with a large diameter (ø 200 mm or larger) having superior optical properties, which can be used for photolithography with a wavelength of 250 nm or less.

Abstract: A printed-wiring substrate 1 has main-face-side connection terminals 33 for solder-bonding to connection terminals 83 of an IC chip 81 on a main face 1A thereof and back-face-side connection terminals 41 for connecting, through mechanical contact, to connection terminals 93 of a motherboard 91 on a back face 1B thereof. The surface of each of the main-face-side connection terminals 33 is covered with a main-face-side displacement Au plating layer 45 having a thickness of 0.03 to 0.12 &mgr;m, and the surface of each of the back-face-side connection terminals 41 is covered with a back-face-side displacement Au plating layer 55, which is thicker than the main-face-side displacement Au plating layer 45 and has a thickness of 0.2 &mgr;m or greater.

Abstract: Method and apparatus for short-term relining or construction of a blast furnace uses a grounding apparatus for grounding of ring-shaped blast furnace segments having shells and a casting floor present as a blast furnace floor for transferring the ring-shaped blocks or shells onto a foundation of the blast furnace, and capable of safely and precisely mounting the ring-like blocks on the casting floor, wherein the grounding apparatus is integrated with a jack system utilizing rod type lift jacks and a sliding apparatus installed with intermittently movable hydraulic cylinders for safe and precision mounting of the ring-shaped blocks or shells on the casting floor.

Abstract: Method and apparatus for short-term relining or construction of a blast furnace uses a grounding apparatus for grounding of ring-shaped blast furnace segments having shells and a casting floor present as a blast furnace floor for transferring the ring-shaped blocks or shells onto a foundation of the blast furnace, and capable of safely and precisely mounting the ring-like blocks on the casting floor, wherein the grounding apparatus is integrated with a jack system utilizing rod type lift jacks and a sliding apparatus installed with intermittently movable hydraulic cylinders for safe and precision mounting of the ring-shaped blocks or shells on the casting floor.

Abstract: A method of making a laminate ceramic substrate with domed pads is provided. In the method, a ceramic green sheet is prepared which has a pair of first and second opposite main surfaces and a plurality of through holes extending between the first and second main surfaces. The ceramic green sheet is placed upon a flat elastic sheet in such a manner that the first main surface of the ceramic green sheet is in contact with the flat elastic sheet. Metallizing ink is filled into the through hole so that a portion of the ink protrudes beyond the first main surface to form domed protruded portions by elastic deformation of the elastic sheet. The green sheet (optionally placed upon at least one other green sheet in such a manner that the second main surface is in contact with the other green sheet) is then sintered, thereby forming the domed, protruded portions of the metallizing ink into domed pads.

Abstract: A binocular has a focusing mechanism and a convergence angle correction mechanism. Focusing is achieved by moving an objective optical system or eyepiece optical system along an optical axis. The convergence angle correction mechanism, which is interlocked with the focusing mechanism, decenters an element of the objective optical system translationally with respect to the optical axis. The translational decentering is achieved by moving the objective optical element in a direction at an angle to the optical axis.

Abstract: A manufacturing method for a single crystal of calcium fluoride includes the steps of degassing calcium fluoride powder particles to desorb impurities from surfaces of the calcium fluoride powder particles, preprocessing the degassed calcium fluoride powder particles by fusing the degassed calcium fluoride powder particles in a crucible to obtain a preprocessed product, and re-fusing the preprocessed product in a crucible to grow a single crystal of calcium fluoride.

Abstract: In this screen manufacturing method, a method of effectively cooling flat display panels (1) which form a display screen is provided. A mechanism for cooling the flat display panels (1) is also provided. More specifically, in this manufacturing method, when a display screen (50) is assembled, clearances (41) are provided between modules (40) in which the flat display panels (1) are lined up to, thereby facilitate air circulation driven by a fan (42). Further, a radiation member is fitted to a holder which fixes the flat display panels (1). Thus, a surface area of the holder becomes larger by a portion equivalent to the radiation member, whereby radiative cooling is enhanced.

Abstract: A screen manufacturing method makes it possible to manufacture a display screen using flat display panels and to consistently form a flat display screen. More specifically, m flat display panels are fixed on a holder during a manufacturing process of the display screen, and then a flexible substrate is fixed to electrode pins of a flat display panel which project over a back surface of the holder so as to form a unit. After fitting a frame to the unit, a part on which a connector is arranged with a part of the flexible substrate being bent is fitted on a surface of the frame so as to form a submodule. Then, by connecting submodules, a module is formed. By assembling the module, a display screen is produced.

Abstract: A semiconductor chip is supported on a tape carrier provided with lead wirings. The semiconductor chip is electrically connected to the lead wirings. The semiconductor chip of this quality is bonded in combination with the pe carrier to an aluminum nitride substrate. The lead wirings provided on the carrier combine the two functions as an internal lead and an external lead. The semiconductor package of such a structure as is described above allows multi-terminal connection by the narrowing of pitches between the leads and permits provision of a miniature package excelling in the heat-radiating property. Alternatively, the lead wirings supported on the tape carrier and electrically connected to the semiconductor chip are utilized as internal leads. For the external leads, such lead frames as are bonded to the aluminum nitride substrate are used. The lead frames are electrically connected to the internal leads provided in the tape carrier.

Abstract: An automatic programming apparatus is provided to generate a NC program for processing a roll having a cylindrical part and axle parts. The apparatus includes a roll-profile setting module, a process-condition setting module, a process-order setting module and an automatic programming module. The roll-profile setting module establishes dimensional values of the roll between an operator and the apparatus at every locational code, while the process-condition setting module establishes a plurality of process conditions at every process code, interactively. The process-order setting module combines the locational codes with the process codes at every process order, optionally and interactively, so that the process order of the cylindrical part and the axle parts is set while allocating any one of the process conditions.

Abstract: A ceramic substrate having on the surface thereof a plurality of pads to be attached to terminal members is provided. Each pad includes a metallic layer formed on the surface of the substrate and a connecting layer made of a nickel base alloy and formed on the metallic layer. A gold-nickel layer made of a gold base alloy containing nickel is formed on the connecting layer. The gold-nickel layer may be formed by first forming a gold layer on the connecting layer and then making nickel in the connecting layer to diffuse into the gold layer by heat treatment. A method of producing such a ceramic substrate is also provided.

Abstract: A ceramic lid assembly includes an integral metallized layer provided around the periphery of a ceramic lid substrate to serve as a foundation for a solder layer. A portion of the metallized layer for contact with the ceramic lid substrate is formed from a metallized paste containing glass frits so that the metallized layer is baked to adhere to the ceramic lid by reflowed glass frits. A portion of the metallized layer for contact with the solder layer is formed from a metallized paste containing no glass frits so that substantially no void is formed in the solder layer.

Abstract: In accordance with the present invention, there is provided a ceramic IC package base which comprises a ceramic substrate, and a heat radiating member adhered to a side surface of the ceramic substrate and made of copper or copper alloy. The heat radiating member has an adhering portion at which it is adhered to the ceramic substrate. The adhering portion, when the heat radiating member is observed in a plan view, has one side which is equal to or larger than 8 mm. The adhering portion is of the thickness within the range from 0.25 mm to 0.76 mm. A ceramic IC package cover is also provided.

Abstract: In a ceramic lid for a semiconductor package, a metallized layer is generally uniform in width and has at least one increased or reduced width portion or a plurality of increased or reduced width portions which are arranged in intervals.

Abstract: A method of measuring a roll diameter of a roll is provided. At first, a step-shaped conical master roll consisting of a plurality of diametrical parts is prepared and then, the diameters of the diametrical parts under predetermined standard temperature are measured. After mounting the master roll on a roll grinder under a temperature condition similar to that surrounding the roll mounted on the roll grinder, a diameter of one diametrical part, of which standard diameter is closest to the roll diameter of the roll, is measured. Next, a difference between the diameter value of the diametrical part and the standard diameter value is calculated as a correction value, so that the roll diameter value of the roll is corrected by the correction value.

Abstract: Propylene oxide is recovered through the use of an additive in a distillation solution, resulting in suppressed side reactions and reduced loss of product. Propylene oxide is produced by oxidizing ethylbenzene in a liquid phase with molecular oxygen to a obtain a reaction liquid containing ethylbenzene hydroperoxide; distilling the reaction liquid to obtain a concentrated solution of ethylbenzene hydroperoxide; further mixing and reacting the concentrated solution with propylene to obtain a mixed solution containing propylene oxide; and distilling the mixed solution to separate and recover propylene oxide. At least one compound selected from aliphatic saturated alcohols having 2 to 4 carbon atoms, allyl alcohol, saturated aliphatic hydrocarbons having 6 or 7 carbon atoms, benzene, ethers, ketones, nitriles, amines, pyridines, diamines, and aminoalcohols is added to the mixed distillation solution in an amount of 0.01-100 parts by weight per 100 parts by weight of propylene oxide.

Abstract: An outer lead having a plurality of external leads 1 for electrically connecting the semiconductor IC of a semiconductor IC package to external devices comprises a base plate 11, a plated base structure formed over the surface of the base plate 11 and consisting of a plurality of plated base layers 12, 13 and 14 of Ni or a Ni alloy, and a surface layer 15 of Au or an Au alloy formed over the uppermost plated base layer 14 of the plated base structure. The number of the plated base layers is at least three. Each plated base layer 12, 13 and 14 of the plated base structure is subjected to crystal-growth annealing after being formed by plating to crystal-grow the grains thereof. A method of fabricating such an outer lead is provided.

Abstract: Disclosed is a sintered aluminum nitride composition and a circuit substrate for use in semiconductor device. The sintered aluminum nitride composition comprises: aluminum nitride; a first component given by a compound containing an element which is selected from the group consisting of alkaline earth elements and group IIIa elements of the periodic table; a second component made of either a simple silicon or a silicon-containig compound; and a third component made of either a simple manganese or a manganese-containing compound. The circuit substrate has an insulating layer which is compoesd of the above-described sintered aluminum nitride composition, and an electrically conductive layer containing an electrically conductive material and the same components as those of the insulating layer.