Abstract: A semiconductor memory device comprises a first transistor including a source region, a drain region, a first channel region of a semiconductor material formed on an insulating film and connecting the source region and the drain region, and a gate electrode for controlling potential of the first channel region; a second transistor including a source region, a drain region, a second channel region of a semiconductor material connecting the source region and the drain region, a second gate electrode for controlling potential of the second channel region, and a charge storage region coupled with the second channel region by electrostatic capacity; wherein the source region of the second transistor is connected to a source line, one end of the source or the drain region of the first transistor is connected to the charge storage region of the second transistor, the other end of the source or the drain region of the first transistor is connected to a data line.

Abstract: There are provided a method of communication which can reliably transmit information from a base station to a wireless terminal in a system which can reduce power consumption by intermittent operation in which the wireless terminal repeats operating state and suspended state by power on and off and the base station used for the method. The method includes the steps of storing base station information such as a command or data supplied to the wireless terminal in the base station, transferring the wireless terminal from the suspended state to the operating state to transmit information from the sensor to the base station, coupling the base station information stored in the base station to a response signal to transmit it to the wireless terminal in the operating state for transmitting the sensor information, and returning the wireless terminal to the suspended state after completing the transmission of the base station information and sensor information.

Abstract: There is provided a logic circuit causing the same delay time as a conventional logic circuit and acting as a D flip-flop circuit with a data-selecting function. A logic circuit having the circuitry shown in FIG. 6 will be described briefly. Two transmission gates TG10a (TG10b) and TG11 and two inverters IV10 and IV11 are used to define a data propagation path from an input port I1 (I2) to an output port O1. Thus, four logic gates are located along the path in the same manner as they are in a conventional D flip-flop circuit. The transmission gate TG10a (TG10b) is controlled using a NOR circuit 12a that inputs a clock CLK and a select signal /sel that is the reverse of a select signal sel (NOR circuit 12b that inputs the clock CLK and the select signal sel). The transmission gate TG11 is controlled with the clock CLK. Either of two input data items is selected based on the select signals, and then output.

Abstract: A high integration dynamic random access memory is provided by this invention. Furthermore, a write method is provided such that cell size of two-and three-transistor gain cell memories is reduced. A dynamic memory incorporating a thin-channel transistor as the write element such that long data storage retention is achieved in the memory devices of this invention. A dynamic memory cell having low operating power and high density is also realized by this invention.

Abstract: A high integration dynamic random access memory is provided by this invention. Furthermore, a write method is provided such that the cell size of two-and three-transistor gain cell memories is reduced. A dynamic memory incorporating a thin-channel transistor as the write element such that long data storage retention is achieved in the memory devices of this invention. A dynamic memory cell having low operating power and high density is also realized by this invention.

Abstract: A very thin semiconductor film is used for channels of semiconductor memory elements such that leak currents are reduced by the quantum-mechanical containment effect in the direction of film thickness. The amount of electrical charge accumulated in each charge accumulating region is used to change conductance between a source and a drain region of each read transistor structure. The conductance change is utilized for data storage. The thickness of the channel of the write transistor structure is preferably no more than 5 nm. According to one embodiment, the channel of the write transistor is formed by a semiconductor film deposited on a surface intersecting a principal plane of the substrate.

Abstract: A semiconductor memory device comprises a first transistor including a source region, a drain region, a first channel region of a semiconductor material formed on an insulating film and connecting the source region and the drain region, and a gate electrode for controlling potential of the first channel region; a second transistor including a source region, a drain region, a second channel region of a semiconductor material connecting the source region and the drain region, a second gate electrode for controlling potential of the second channel region, and a charge storage region coupled with the second channel region by electrostatic capacity; wherein the source region of the second transistor is connected to a source line, one end of the source or the drain region of the first transistor is connected to the charge storage region of the second transistor, the other end of the source or the drain region of the first transistor is connected to a data line.

Abstract: A semiconductor memory element subject to a threshold voltage controlling method other than those based on low leak currents or on the implantation of impurities. Such semiconductor elements are used to form semiconductor memory elements that are employed in scaled-down structures and are conducive to high-speed write operations thanks to a sufficiently prolonged refresh cycle. These semiconductor memory elements are in turn used to constitute a semiconductor memory device. A very thin semiconductor film is used as channels so that leak currents are reduced by the quantum-mechanical containment effect in the direction of film thickness. An amount of electrical charges in each charge accumulating region is used to change conductance between a source and a drain region of each read transistor structure, the conductance change being utilized for data storage. A channel of a transistor for electrically charging or discharging each charge accumulating region is made of a semiconductor film 5 nm thick at most.

Abstract: For providing a cheap semiconductor memory device with improving reliability by level of a cell, in the place of escaping from defects on memory cells electrically, through such as ECC, and further for providing a cell structure enabling scaling-down in the vertical direction with maintaining the reliability, in a semiconductor memory device, upon which high-speeded read-out operation is required, a charge storage region is constructed with particles made from a large number of semiconductor charge storage small regions, each being independent, thereby increasing the reliability by the cell level.

Abstract: A semiconductor quantum memory element is disclosed which can share the terminals easily among a plurality of memory elements and can pass a high current and which is strong against noises. In order to accomplish this a control electrode is formed so as to cover the entirety of thin film regions connecting low-resistance regions. As a result, the element can have a small size and can store information with high density. Thus, a highly integrated, low power consumption non-volatile memory device can be realized with reduced size. A method of forming a memory element is also disclosed including performing the following steps of forming a first insulating layer, a second insulating layer, a first conductive layer and a layer of amorphous silicon. The amorphous silicon layer is crystallized to a polycrystalline silicon film. Semiconductor drains are deposited to form charge trapping and storage regions.

Abstract: A field-effect semiconductor element implemented with a fewer number of elements and a reduced area and capable of storing data by itself without need for cooling at a cryogenic temperature, and a memory device employing the same. Gate-channel capacitance is set so small that whether or not a trap captures one electron or hole can definitely and distinctively be detected in terms of changes of a current of the semiconductor FET element. By detecting a change in a threshold voltage of the semiconductor element brought about by trapping of electron or hole in the trap, data storage can be realized at a room temperature.

Abstract: For providing a cheap semiconductor memory device with improving reliability by level of a cell, in the place of escaping from defects on memory cells electrically, through such as ECC, and further for providing a cell structure enabling scaling-down in the vertical direction with maintaining the reliability, in a semiconductor memory device, upon which high-speeded read-out operation is required, a charge storage region is constructed with particles made from a large number of semiconductor charge storage small regions, each being independent, thereby increasing the reliability by the cell level.

Abstract: A program for automatically designing a logic circuit used for a method of designing a pass transistor circuit, by which the number of required transistors, delay time, power consumption and chip area of the pass transistor circuit is reduced.

Abstract: A semiconductor memory device comprises a first transistor including a source region, a drain region, a first channel region of a semiconductor material formed on an insulating film and connecting the source region and the drain region, and a gate electrode for controlling potential of the first channel region; a second transistor including a source region, a drain region, a second channel region of a semiconductor material connecting the source region and the drain region, a second gate electrode for controlling potential of the second channel region, and a charge storage region coupled with the second channel region by electrostatic capacity; wherein the source region of the second transistor is connected to a source line, one end of the source or the drain region of the first transistor is connected to the charge storage region of the second transistor, the other end of the source or the drain region of the first transistor is connected to a data line.

Abstract: A semiconductor quantum memory element is disclosed which can share the terminals easily among a plurality of memory elements and can pass a high current and which is strong against noise. In order to accomplish this a control electrode is formed so as to cover the entirety of thin film regions connecting low-resistance regions. As a result, the element can have a small size and can store information with high density. Thus, a highly integrated, low power consumption non-volatile memory device can be realized with reduced size. A method of forming a memory element is also disclosed including performing the following steps of forming a first insulating layer, a second insulating layer, a first conductive layer and a layer of amorphous silicon. The amorphous silicon layer is crystallized to a polycrystalline silicon film. Semiconductor drains are deposited to form charge trapping and storage regions.

Abstract: To produce a logic circuit with excellent characteristics including area, delay time and power consumption by combining pass transistor logic circuits and CMOS logic circuits, a binary decision diagram is created from a Boolean function. Respective nodes are mapped into 2-input, 1-output, 1-control input pass transistor selectors to synthesize a pass transistor logic circuit. A pass transistor selector operating as a NAND or NOR logic with any one of its two inputs, excluding the control input, being fixed to a logical constant “1” or “0” is replaced with a CMOS gate operating as a NAND or NOR logic logically equivalent to the pass transistor selector if the value of a predetermined circuit characteristic obtained by the replacement is closer to an optimal value.

Abstract: A semiconductor integrated circuit device supplied as an IP (Intellectual Property), etc., a method of manufacturing the device, and a medium for storing a processing procedure for deciding the number of delay circuits built in the device used for designing, more particularly to a semiconductor integrated circuit device which guarantees the characteristics of writing into and reading from the built-in memory even when the manufacturing process conditions are varied.

Abstract: This invention provides a storage medium on which there is stored a cell library to design a semiconductor integrated circuit to satisfy low power consumption and high speed operation and a design method using the cell library. The cell library is registered with at least two kinds of cells which are different in delay and power consumption while having the same function and the same shape. To satisfy the specification of the semiconductor integrated circuit, one cell is selected from at least two kinds of cells of the cell library.

Abstract: A field-effect semiconductor element implemented with a fewer number of elements and a reduced area and capable of storing data by itself without need for cooling at a cryogenic temperature, and a memory device employing the same. Gate-channel capacitance is set so small that whether or not a trap captures one electron or hole can definitely and distinctively be detected in terms of changes of a current of the semiconductor FET element. By detecting a change in a threshold voltage of the semiconductor element brought about by trapping of electron or hole in the trap, data storage can be realized at a room temperature.

Abstract: A high integration dynamic random access memory is provided by this invention. Furthermore, a write method is provided such that the cell size of two- and three-transistor gain cell memories is reduced. A dynamic memory incorporating a thin-channel transistor as the write element such that long data storage retention is achieved in the memory devices of this invention. A dynamic memory cell having low operating power and high density is also realized by this invention.