Abstract: An apparatus for cutting an electrical wiring line includes a laser generator for generating a laser beam, an optical beam branching element for branching a laser beam generated by the laser generator into a plurality of branch beams, and a condenser element for condensing the branch beams branched by the optical beam branching element (the optical beam branching element can also serve as the condenser element). The condenser element may be a condenser lens which is separate from the optical beam branching element. The power and the focal depth of the branch beam may be adjusted. When the substrate has a transparency to the laser beam, the branch beam is directed to the electrical wiring line formed on the substrate from the opposite side to the surface having the electrical wiring line.

Abstract: A conductive material is provided to an open end of a penetrating hole penetrating through at least a semiconductor element, on the side of a first surface of the semiconductor element. The conductive material is melted to flow into the penetrating hole. The conductive material is made to flow into the penetrating hole in a state that an atmospheric pressure on the side of a second surface of the semiconductor element opposite to the first surface is lower than an atmospheric pressure on the side of the first surface.

Abstract: The laser processing apparatus includes lasers for emitting a plurality of laser beams of different wavelengths, a common phase grating for splitting the laser beams of different wavelengths into diffraction beams shaped in designed arrays, and a condenser lens for condensing the diffraction beams. The layout of the focused diffraction beam spots of each wavelength is decided in accordance with the design of the phase grating.

Abstract: A semiconductor chip having a vertical current conduction structure of a high reliability: a semiconductor device, a circuit substrate, and an electronic apparatus each containing such semiconductor chips; and a method for producing them. A prehole (3) is formed in a silicon substrate (10) surface-oriented to a (100) face by laser beam irradiation. The prehole (3) is enlarged by anisotropic etching to thereby form a through-hole (4). An electrically insulating film is formed on an inner wall of the through-hole (4).

Abstract: A conductive material is provided to an open end of a penetrating hole penetrating through at least a semiconductor element, on the side of a first surface of the semiconductor element. The conductive material is melted to flow into the penetrating hole. The conductive material is made to flow into the penetrating hole in a state that an atmospheric pressure on the side of a second surface of the semiconductor element opposite to the first surface is lower than an atmospheric pressure on the side of the first surface.

Abstract: A laminated core of a motor in which vibrations of core plates causing motor noise is restrained at a low cost; a method of manufacturing such a laminated core; a motor having such a laminated core; and an ink-jet recording apparatus having such a motor. In a laminated core (1) of a motor in which a plurality of core pieces (10) are laminated on each other and which has magnetic poles (13) each having a roughed surface of mountain portions (13a) and groove portions (13b) formed alternately in the direction of rotation of the motor, welded portions (31) for firmly fixing the core pieces (10) to each other are provided in the surface of one of the groove portions (13b) formed in the vicinities of the central portion of each magnetic pole (13) in the direction of rotation. Each welded portion (31) is formed continuously in the direction of lamination of the core pieces (10). Each welded portion (31) is formed by welding the surface of the groove portion (13b).

Abstract: A semiconductor chip having a vertical current conduction structure of a high aspect ratio and high reliability: a semiconductor device, a circuit substrate, and an electronic apparatus each containing such semiconductor chips; and a method for producing them. A prehole (3) is formed in a silicon substrate (10) surface-oriented to a (100) face by laser beam irradiation. The prehole (3) is enlarged by anisotropic etching to thereby form a through-hole (4). An electrically insulating film is formed on an inner wall of the through-hole (4). An electrically conducting material is provided inside the insulating film to thereby form a metal bump (30).

Abstract: The laser processing apparatus includes lasers for emitting a plurality of laser beams of different wavelengths, a common phase grating for splitting the laser beams of different wavelengths into diffraction beams shaped in designed arrays, and a condenser lens for condensing the diffraction beams. The layout of the focused diffraction beam spots of each wavelength is decided in accordance with the design of the phase grating.

Abstract: A method of manufacturing a semiconductor device includes: a first step of forming a first through hole that penetrates the location of the electrode in a semiconductor element having an electrode; a second step of providing an insulating material in a region including an inside of the first through hole 18, in such a manner that a second through hole is provided penetrating through the insulating material; and a third step of providing a conductive member within the second through hole that penetrates through at least the insulating material in the inside of the first through hole.

Abstract: According to the present invention, a case housing a product and a lid made of material that transmits a laser beam are fixed to each other with a bonding member interposed between them, and thereafter, a laser beam is focused onto the bonding member through the lid so that the bonding member is melted. By doing so, the case and the lid are welded together via the bonding member.

Abstract: A method of manufacturing a semiconductor device comprises a step of forming a through-hole in a semiconductor chip having an electrode and forming a conductive layer on a region comprising an inner side of the through-hole. An intermediate portion of the through-hole is formed to be larger than an edge portion thereof, and the conductive layer is formed by electroless plating.

Abstract: A laminated core of a motor in which vibrations of core plates causing motor noise is restrained at a low cost; a method of manufacturing such a laminated core; a motor having such a laminated core; and an ink-jet recording apparatus having such a motor. In a laminated core (1) of a motor in which a plurality of core pieces (10) are laminated on each other and which has magnetic poles (13) each having a roughed surface of mountain portions (13a) and groove portions (13b) formed alternately in the direction of rotation of the motor, welded portions (31) for firmly fixing the core pieces (10) to each other are provided in the surface of one of the groove portions (13b) formed in the vicinities of the central portion of each magnetic pole (13) in the direction of rotation. Each welded portion (31) is formed continuously in the direction of lamination of the core pieces (10). Each welded portion (31) is formed by welding the surface of the groove portion (13b).

Abstract: A laminated core of a motor in which vibrations of core plates causing motor noise is restrained at a low cost; a method of manufacturing such a laminated core; a motor having such a laminated core; and an ink-jet recording apparatus having such a motor. In a laminated core (1) of a motor in which a plurality of core pieces (10) are laminated on each other and which has magnetic poles (13) each having a roughed surface of mountain portions (13a) and groove portions (13b) formed alternately in the direction of rotation of the motor, welded portions (31) for firmly fixing the core pieces (10) to each other are provided in the surface of one of the groove portions (13b) formed in the vicinities of the central portion of each magnetic pole (13) in the direction of rotation. Each welded portion (31) is formed continuously in the direction of lamination of the core pieces (10). Each welded portion (31) is formed by welding the surface of the groove portion (13b).

Abstract: A method of smoothly processing a surface of crystal material, particularly a quartz crystal, to attain a good surface roughness and degree of eveness without substantial hillocks or micro-projections, without performing grinding or polishing processing. After lapping the surface of the crystal material, the lapped surface is etched with hydrofluoric acid. Finish etching is performed on the crystal material by buffer hydrofluoric acid as needed. In the manufacture of a crystal piece used in a crystal device, after the crystal wafer cut out from the rough crystal stone to the specified thickness is lapped, it is roughly etched to the desired thickness by hydrofluoric acid. Then, after ultrasonic washing by pure water, the crystal wafer is processed to the desired high quality of surface roughness, level of smoothness and thickness. The surface processing can be performed more easily, in less time, and with less labor than conventional methods, the cost is decreased, and productivity rises.