Abstract: A managing structure for an umbilical member includes a flexible conduit for leading an umbilical member inserted therein from a front arm of a robot to a working tool mounted on a wrist of the robot, a first conduit mounting portion provided adjacent to the front arm, and a second conduit mounting portion provided adjacent to a point where the umbilical member is connected to the working tool. One end of the conduit is attached to the first conduit mounting portion, while the other end of the conduit is attached to the second conduit mounting portion. The conduit is laid so that a section thereof between the first conduit mounting portion and the second conduit mounting portion does not contact the body of the robot.

Abstract: An arc welding device, having a simple structure, in which a welding torch does not interfere with external equipment. A Y-shaped torch cable includes first and second wire liners and a junction block having a Y-shaped liner section having two inlets connected to the wire liners and one outlet. A welding wire selectively fed from one of two wire feeders extends in the first or second wire liner and reaches the outlet of the liner section. Therefore, as one of plural kinds of welding wires may be selected and fed to a single-electrode welding torch, the plurality of welding wires being used for welding, nevertheless the welding torch does not interfere with external equipment.

Abstract: A robot base 15 is installed on a ceiling 100, and a first wrist element 11 is attached to a front arm base 10 to be rotatable about a first axis A. A second wrist element 12 is attached to the first wrist element 11 to be rotatable about a second axis B, and a welding torch 2 is supported via a transmission mechanism 13 to be rotatable about an offset axis C. The welding torch 2 is attached so that a tip end thereof is directed downward in the illustrated posture of the robot. A linear guide 6a and a slider 7 are provided via a support base 5, and an intermediate portion of a torch cable 3 (or a welding wire delivery device 4) is fixed thereto to draw a tensioning device 80. Such a structure is applicable to a wall-hanging type robot.

Abstract: A first wrist element 11 is rotatably provided around an axis line A, on the front end of a forearm base 10 of a robot 1. A second wrist element 12 is rotatably provided around a second axis line B, on the first wrist element 11. A welding torch 2 is rotatably supported around a line C via a transmission mechanism 13. The third axis line C is disposed approximately perpendicularly to the axis line B and is remote from the axis line A by a predetermined distance. A wire feeder 4 is disposed at a position (on a mounting table 8, an upper arm, or a rotating body) other than a forearm. A torch cable 3 is fitted to a slider 6b that is movably fitted along a direction approximately parallel with the first axis line A, with an intermediate fitting section 3a. A slider 6b can be pulled backward by returning a wire 81 connected to a tension generator 80 using a pulley 82.

Abstract: A managing structure for an umbilical member of an industrial robot, the umbilical member being for supplying air and electric energy to a work tool attached to an end of a wrist of the robot, in which the umbilical member is properly moved and interference between the umbilical member and a peripheral object or a forearm of the robot is prevented. The umbilical member elastically contacts a guide surface of a guide plate attached to a second wrist element of the robot without widely projecting from the robot. The umbilical member is guided such that the extending direction of the umbilical member generally coincides with the longitudinal direction of the guide plate before the umbilical member is connected to the work tool. The thickness of the guide plate may be gradually reduced or constant toward a free end of the guide plate.

Abstract: The purpose of the present invention is to remove minute particles adhered to the surface of semiconductor wafers effectively in the cleaning process of semiconductor wafers. In the final rinsing step using ultra-pure water or hydrogen water and carried out after cleaning of semiconductor wafers with HF solution, ultrasonic waves are irradiated in the cleaning solution after a prescribed time delay (preferably 20-30 sec or more).

Abstract: An umbilical-member managing structure for a welding torch in an arc welding robot, for laying and managing, along a manipulator, a plurality of umbilical members connected to a welding torch attached to the manipulator. The umbilical members include a welding wire fed to the welding torch, a tubular liner surrounding the welding wire, a tube for supplying an assist gas to the welding torch, and an electrical conductor for feeding a welding current to the welding torch. The arc welding robot is provided with a wire feeding device mounted on the manipulator for feeding the welding wire to the welding torch.

Abstract: The method for removing particles that adhere to the surface of semiconductor wafers is constituted so as to sequentially carry out a first cleaning process in which semiconductor wafers 100 are cleaned for a prescribed time in cleaning tank 104 containing a first cleaning solution consisting of ozone water, and, after said first cleaning process, a second cleaning process in which said semiconductor wafers 100 are cleaned for a prescribed time in cleaning tank 106 containing a second cleaning solution consisting of hydrogen water.

Abstract: An umbilical-member managing system for an industrial robot. The embodiment of the umbilical-member managing system provided in an arc welding robot serves to lay and manage, along a manipulator, a torch cable connected to a welding torch attached to the manipulator. This umbilical-member managing system includes a support unit provided on the manipulator movably toward and away from the welding torch to support the torch cable; and a biasing mechanism continually biasing the support unit on the manipulator in a direction away from the welding torch. In this arrangement, the support unit may be composed of a wire feeding device for feeding a welding wire in the torch cable toward the welding torch. A guide unit is provided on the manipulator, which can guide the wire feeding device in a direction toward and away from the welding torch.

Abstract: The present invention provides a robot that can use an inexpensive connector and keep the connector assembly dust-free and safe. A base of a robot mechanical unit has a hollow structure. An opening is provided on a lateral surface of the base, a through-hole is provided on a closing member that covers the opening, and a cable mounting member provided with a through-hole is fixed on the closing member. A connecting cable from a control unit passes through the through-holes and is connected to robot mechanical unit-internal cables by a cable connector inside the base. The robot mechanical unit-internal cables are fixed by a cable clamp inside the base and a swivel body. The connector is installed inside the base and suspended in space, providing superior dust-proofing. No external force is applied, and so an inexpensive configuration can be achieved that does not require an especially strong connector. Moreover, the connector can be connected and disconnected easily.

Abstract: The present invention provides a conductor composition that can be formed into a film conductor having a resistance to soldering heat of a sufficient level in practical use without using a large amount of expensive precious metals such as Pd and without performing a Ni plating treatment or other treatments separately. This conductor composition is provided in the form of paste or ink having metal powder as the main component. This metal powder is constituted substantially by particulates of Ag or an Ag based alloy whose surface is coated with an organic metal compound. The organic metal compound is preferably an organic acid metal salt, metal alkoxide or a chelate compound having as a main constituent metal element any one selected from the group consisting of Al, Zr, Ti, Y, Ca, Mg and Zn.

Abstract: A first wrist element is provided at a distal end of a front arm of an arc welding robot rotatably about a first axial line, a second wrist element is provided on the first wrist element rotatably about a second axial line, and a welding torch is supported on the second wrist element about a third axial line. A slide mechanism which can reciprocate in a direction approximately parallel to the first axial line is provided at a proper position from an upper portion of the front arm to an upper portion of the first wrist element and a wire feeding apparatus is mounted on the slide mechanism. By sliding the position of the wire feeding apparatus in response to the attitude of the welding torch, an extending state of the torch cable can be maintained properly.

Abstract: A method for removing particles on semiconductor wafers, which is a process involving a cleaning tank filled with a first cleaning solution consisting of hydrogen water, is accomplished by carrying out said process in which in-solution hydrogen concentration in said first cleaning solution is in the range 20% to 50% of its saturated concentration (0.3 ppm to 0.8 ppm), a process in which ultrasonic waves are generated in said semiconductor wafers are cleaned for a prescribed time in said cleaning tank. Here the in-solution hydrogen concentration in said first cleaning solution is in the range 0.3 ppm to 0.8 ppm.

Abstract: The method for removing particles that adhere to the surface of semiconductor wafers is constituted so as to sequentially carry out a first cleaning process in which semiconductor wafers 100 are cleaned for a prescribed time in cleaning tank 104 containing a first cleaning solution consisting of ozone water, and, after said first cleaning process, a second cleaning process in which said semiconductor wafers 100 are cleaned for a prescribed time in cleaning tank 106 containing a second cleaning solution consisting of hydrogen water.

Abstract: The purpose of the present invention is to remove minute particles adhered to the surface of semiconductor wafers effectively in the cleaning process of semiconductor wafers. In the final rinsing step using ultra-pure water or hydrogen water and carried out after cleaning of semiconductor wafers with HF solution, ultrasonic waves are irradiated in the cleaning solution after a prescribed time delay (preferably 20-30 sec or more).

Abstract: A robot system and a machining method capable of accurately and simply cutting an end of a pipe into a saddle shape and forming a hole on an outer surface thereof, and further machining a workpiece of a three-dimensional shape which does not have platelike shape. A tool unit is attached to a final axis of a movable arm of a robot. The tool unit is provided with a first additional variable axis expanding and retracting vertically and a second additional variable axis expanding and retracting in the horizontal direction. By rotating the final axis, a cutting tool (machining nozzle of laser) at a distal end of the tool unit is turned about the final axis to cut a workpiece W of a pipe shape. By driving the first and the second additional variable axes in synchronism with rotation of the final axis, the cutting into a saddle shape and the forming of a hole are carried out. The movable arm of the robot is only for rotating the final axis and therefore machining accuracy is promoted.

Abstract: There are disclosed a resistor whose life span is long and whose miniaturization can be implemented by restraining a short-circuit among a resistor pattern, an electron gun for a cathode-ray tube provided with the resistor and a method of manufacturing the resistor. In the resistor (2), the natrium concentration of overcoat glass (4) coated on a surface thereof and covering its resistance patterns (5) is set to less than 500 ppm, and the resistor 2 is manufactured in such a manner that at a time when the overcoat glass (4) is manufactured, after a process (S2) of crushing a glass cullet which is a raw material of the overcoat glass (4), the crushed glass powder is raised with pure water to thereby set the natrium concentration thereof to less than 500 ppm.

Abstract: Surface-decorated utensil includes a ceramic ware and a plurality of decorative laminar elements of noble metal on its surface. As an alternative, the spacing between neighboring laminar elements is not less than 0.2 mm and the maximum length of each laminar element is not more than 8.5 mm. As another alternative, the spacing between neighboring laminar elements is not less than 10 mm and the maximum length of each laminar element is not more than 12 mm. In addition, the laminar elements are coated with a frit layer. The surface-decorated utensil is not damaged when used in an electronic range, while it is superior in chemical durability and coloration.

Abstract: After the process of manufacturing a cell of a display device, a thick film conductor is bonded onto the terminal portion of a transparent electrode of the display panel by a dry or wet transfer mounting method and a flexible printed circuit board for a driver is soldered on the thick film conductor, such a display device; a process for producing the display device; and a decal for dry or wet transfer mounting method to form a display panel terminal are disclosed.