Patents by Inventor Kazutaka Shibuya
Kazutaka Shibuya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220413254Abstract: A lens device with which a network can be pulled out from a lens main body and connected to an operation terminal is provided. The lens device for capturing an optical image includes: a lens mechanism for forming the optical image, the lens mechanism being built into a lens main body; a drive control unit for drive-controlling the lens mechanism, the drive control unit being built into the lens main body; a central processing unit that outputs a drive control signal to the drive control unit; and a network that forms a power supply interface for the lens main body, and a communication interface for the central processing unit. Thereby, the lens and the operation terminal are connected via the network, so that it is possible to expand the connection mode between the lens and the operation terminal to an n-to-one or n-to-n connection mode.Type: ApplicationFiled: December 2, 2019Publication date: December 29, 2022Applicant: CBC CO., LTD.Inventors: Tsunemi NIIKURA, Kazutaka SHIBUYA, Katsuya HIRANO
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Publication number: 20220196390Abstract: A non-contact-type apparatus for measuring wafer thickness includes a monolithic-type wavelength sweeping semiconductor laser light source having a laser source, a laser control unit that controls the laser source, and a processor to control the laser source to oscillate laser light having a wavelength that changes with a setting profile relative to time; an optical system that guides and emits the laser light onto a wafer; a detection unit that detects an interference light signal of reflected light; an A/D converter that converts the interference light signal detected by the detection unit into a digital signal; and a calculation unit that calculates a thickness of the wafer by analyzing the digital signal from the A/D converter. The processor causes the laser control unit to operate with a clock signal, and to oscillate laser light that performs wavelength-sweeping with the setting profile relative to the time, from the laser source.Type: ApplicationFiled: April 9, 2020Publication date: June 23, 2022Inventors: Chihiro MIYAGAWA, Kazutaka SHIBUYA, Kiyohito AOKI
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Patent number: 10668593Abstract: The polishing head comprises: a head main body part; a carrier being connected to the head main body part; a pressure chamber; a fluid supplying section; a linear motion guide having an outer cylindrical body and a spline shaft, which is provided in the outer cylindrical body and capable of moving in an axial direction thereof, and which is prohibited to rotate with respect to the outer cylindrical body so as to transmit a rotational force to the spline shaft through the outer cylindrical body; and a rotation transmitting plate being provided between a lower end of the spline shaft and an upper face of the carrier, the rotation transmitting plate being capable of tiltably supporting the carrier and transmitting a rotational force of the spline shaft to the carrier.Type: GrantFiled: December 7, 2017Date of Patent: June 2, 2020Assignee: FUJIKOSHI MACHINERY CORP.Inventors: Masayuki Tsukada, Kazutaka Shibuya, Takayuki Fuse
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Patent number: 10636685Abstract: A nozzle according to the invention includes a liquid flow passage through which a liquid flows, a gas flow passage through which a gas flows, the gas flow passage communicating with the liquid flow passage and feeding the gas to the liquid flow passage, and a plasma generating mechanism for generating plasma in the gas fed from the gas flow passage to the liquid flow passage, in which the plasma generating mechanism includes a first electrode provided so as to be exposed to an inside of the liquid flow passage, a second electrode provided so as not to be exposed to the inside of the liquid flow passage and so as to be exposed to an inside of the gas flow passage, and a power source for applying a predetermined voltage across the first electrode and the second electrode, and in which the liquid with which the gas including the generated plasma is mixed as bubbles having a predetermined diameter is spouted.Type: GrantFiled: March 27, 2017Date of Patent: April 28, 2020Assignee: FUJIKOSHI MACHINERY CORP.Inventors: Kazutaka Shibuya, Yoshio Nakamura
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Patent number: 10632590Abstract: The work processing apparatus of the present invention comprises: a processing section for processing or treating a work; and a liquid chemical supplying section for supplying a liquid chemical to the processing section. The liquid chemical supplying section includes: a plurality of liquid chemical bags for storing the liquid chemical; a bag holding part in which the liquid chemical bags are attached and held; and a liquid feeding part, to which the liquid chemical bags are detachably connected, for feeding the liquid chemical from the liquid chemical bags to the processing section. Each of the liquid chemical bags is produced by overlapping flexible resin sheets with each other and welding their edge parts to form into a bag. Each of the liquid chemical bags has a port part communicating with an outside. A joint with a valve is attached to each of the port parts.Type: GrantFiled: December 6, 2016Date of Patent: April 28, 2020Assignees: FUJIKOSHI MACHINERY CORP., NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGYInventors: Masayuki Tsukada, Kazutaka Shibuya, Takayuki Fuse, Yoshio Nakamura, Shiro Hara
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Patent number: 10471565Abstract: The method of the present invention is capable of polishing a high hardness work at high polishing efficiency. The method comprises the steps of: pressing a surface of the work onto a polishing part of a rotating polishing plate; and supplying slurry while performing the pressing step. The method is characterized in that an activated gas, which has been activated by gas discharge, is turned into bubbles and mixed into the slurry.Type: GrantFiled: July 29, 2016Date of Patent: November 12, 2019Assignee: FUJIKOSHI MACHINERY CORP.Inventors: Kazutaka Shibuya, Yoshio Nakamura
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Patent number: 10464186Abstract: The method of the present invention comprises the steps of: previously obtaining correlation data between surface properties of the polishing pad dressed under a plurality of stages of dressing conditions and polishing effects of the work polished by the polishing pad dressed under the dressing conditions; determining an assumed dressing condition capable of achieving an object polishing effect from the correlation data; dressing the polishing pad under the assumed dressing condition determined; polishing the work; cleaning the polishing pad which has been used for polishing the work; and measuring a surface property of the cleaned polishing pad.Type: GrantFiled: December 29, 2016Date of Patent: November 5, 2019Assignees: FUJIKOSHI MACHINERY CORP., KANAZAWA INSTITUTE OF TECHNOLOGYInventors: Kazutaka Shibuya, Jun Yanagisawa, Yoshio Nakamura, Michio Uneda, Kenichi Ishikawa
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Patent number: 10449655Abstract: The polishing apparatus comprises: a dressing section for dressing a polishing pad; a measuring section for measuring a surface property of the polishing pad; a polishing result measuring section for measuring a polishing result of a work; a storing section for storing correlation data between dressing condition data for dressing the polishing pad, surface property of the polishing pad and polishing results, which are learned by an artificial intelligence; and an input section for inputting an object polishing result. The artificial intelligence performs a first arithmetic process, in which the surface property of the polishing pad corresponding to the object polishing result is inversely estimated on the basis of the correlation data, and a second arithmetic process, in which the corresponding dressing condition is derived on the basis of the surface property of the polishing pad inversely estimated.Type: GrantFiled: January 3, 2018Date of Patent: October 22, 2019Assignees: FUJIKOSHI MACHINERY CORP., KANAZAWA INSTITUTE OF TECHNOLOGYInventors: Kazutaka Shibuya, Yoshio Nakamura, Michio Uneda, Kenichi Ishikawa
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Publication number: 20180207768Abstract: The polishing apparatus comprises: a dressing section for dressing a polishing pad; a measuring section for measuring a surface property of the polishing pad; a polishing result measuring section for measuring a polishing result of a work; a storing section for storing correlation data between dressing condition data for dressing the polishing pad, surface property of the polishing pad and polishing results, which are learned by an artificial intelligence; and an input section for inputting an object polishing result. The artificial intelligence performs a first arithmetic process, in which the surface property of the polishing pad corresponding to the object polishing result is inversely estimated on the basis of the correlation data, and a second arithmetic process, in which the corresponding dressing condition is derived on the basis of the surface property of the polishing pad inversely estimated.Type: ApplicationFiled: January 3, 2018Publication date: July 26, 2018Inventors: Kazutaka SHIBUYA, Yoshio NAKAMURA, Michio UNEDA, Kenichi ISHIKAWA
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Publication number: 20180193975Abstract: The polishing head comprises: a head main body part; a carrier being connected to the head main body part; a pressure chamber; a fluid supplying section; a linear motion guide having an outer cylindrical body and a spline shaft, which is provided in the outer cylindrical body and capable of moving in an axial direction thereof, and which is prohibited to rotate with respect to the outer cylindrical body so as to transmit a rotational force to the spline shaft through the outer cylindrical body; and a rotation transmitting plate being provided between a lower end of the spline shaft and an upper face of the carrier, the rotation transmitting plate being capable of tiltably supporting the carrier and transmitting a rotational force of the spline shaft to the carrier.Type: ApplicationFiled: December 7, 2017Publication date: July 12, 2018Inventors: Masayuki TSUKADA, Kazutaka SHIBUYA, Takayuki FUSE
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Patent number: 9804351Abstract: This optical receptacle has first optical surfaces via which light outputted by respective light-emitting elements is inputted, a second optical surface whereby light inputted via said first optical surfaces is outputted towards an end face of a light-transporting body, a third optical surface whereby light inputted via the first optical surfaces is reflected towards the second optical surface, a plurality of first concavities formed in the surface where the second optical surface is located, and a plurality of second concavities formed in the surface where the first optical surfaces are located or a surface opposite the surface where the first concavities are located. The first concavities and the second concavities are laid out opposite each other so that the central axes thereof coincide.Type: GrantFiled: December 22, 2014Date of Patent: October 31, 2017Assignee: Enplas CorporationInventors: Kazutaka Shibuya, Shimpei Morioka
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Publication number: 20170301573Abstract: A nozzle according to the invention includes a liquid flow passage through which a liquid flows, a gas flow passage through which a gas flows, the gas flow passage communicating with the liquid flow passage and feeding the gas to the liquid flow passage, and a plasma generating mechanism for generating plasma in the gas fed from the gas flow passage to the liquid flow passage, in which the plasma generating mechanism includes a first electrode provided so as to be exposed to an inside of the liquid flow passage, a second electrode provided so as not to be exposed to the inside of the liquid flow passage and so as to be exposed to an inside of the gas flow passage, and a power source for applying a predetermined voltage across the first electrode and the second electrode, and in which the liquid with which the gas including the generated plasma is mixed as bubbles having a predetermined diameter is spouted.Type: ApplicationFiled: March 27, 2017Publication date: October 19, 2017Inventors: Kazutaka SHIBUYA, Yoshio NAKAMURA
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Patent number: 9733439Abstract: This optical receptacle comprises the following: an optical-receptacle body that is formed via injection molding; a first optical surface; a second optical surface on a first side; a first concavity that has an angled surface whereby light that has entered via the first optical surface is reflected towards the second optical surface; a gate section on a third side; a first through-hole and a second through-hole that extend in the direction of the axis of light traveling between the second optical surface and a light-transporting body; and a second concavity located between the first concavity and the third side. The part of the second concavity closest to a second side is closer to the abovementioned first side than the part of the gate section closest to the first side is. The first through-hole also opens to a first-side surface and a second-side surface of the second concavity.Type: GrantFiled: February 26, 2015Date of Patent: August 15, 2017Assignee: Enplas CorporationInventor: Kazutaka Shibuya
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Patent number: 9726835Abstract: This optical receptacle has the following: a first surface that includes a first optical surface and a third optical surface; a reflective surface whereby the light inputted via the first optical surface is reflected in a direction parallel to a substrate; an optical separation unit whereby the light reflected off the reflective surface is separated into monitoring light and signal light; a transmitting surface through which the signal light separated out by the optical separation unit is transmitted; a third surface that includes a second optical surface via which the signal light that has been transmitted through the transmitting surface is outputted towards the end face of the aforementioned light-transporting body; and a reflected-monitoring-light avoidance means whereby monitoring light that has reached the detection element is guide so as not to return to the abovementioned light-emitting element.Type: GrantFiled: March 13, 2015Date of Patent: August 8, 2017Assignee: Enplas CorporationInventor: Kazutaka Shibuya
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Patent number: 9709761Abstract: The optical receptacle of the invention includes plural first optical surfaces allowing light emitted from plural light emitting elements to be incident thereon, plural second optical surfaces emitting the light incident on the first optical surfaces toward plural optical transmission members, and a third optical surface reflecting the light incident on the first optical surfaces toward the second optical surfaces. The distances between the center of the first optical surface and the light-emitting surface of the light emitting element and between the center of the second optical surface and the light-emitting surface of the light emitting element is longer toward the center from both ends of the row. The center-to-center distances of the first optical surfaces and of the second optical surfaces are shorter, respectively, than the distance between optical axes of light emitted from the light emitting elements and the center-to-center distance of light-receiving surfaces of optical transmission members.Type: GrantFiled: February 16, 2015Date of Patent: July 18, 2017Assignee: Enplas CorporationInventors: Shimpei Morioka, Kazutaka Shibuya
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Publication number: 20170190018Abstract: The method of the present invention comprises the steps of: previously obtaining correlation data between surface properties of the polishing pad dressed under a plurality of stages of dressing conditions and polishing effects of the work polished by the polishing pad dressed under the dressing conditions; determining an assumed dressing condition capable of achieving an object polishing effect from the correlation data; dressing the polishing pad under the assumed dressing condition determined; polishing the work; cleaning the polishing pad which has been used for polishing the work; and measuring a surface property of the cleaned polishing pad.Type: ApplicationFiled: December 29, 2016Publication date: July 6, 2017Inventors: Kazutaka SHIBUYA, Jun YANAGISAWA, Yoshio NAKAMURA, Michio UNEDA, Kenichi ISHIKAWA
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Publication number: 20170157735Abstract: The work processing apparatus of the present invention comprises: a processing section for processing or treating a work; and a liquid chemical supplying section for supplying a liquid chemical to the processing section. The liquid chemical supplying section includes: a plurality of liquid chemical bags for storing the liquid chemical; a bag holding part in which the liquid chemical bags are attached and held; and a liquid feeding part, to which the liquid chemical bags are detachably connected, for feeding the liquid chemical from the liquid chemical bags to the processing section. Each of the liquid chemical bags is produced by overlapping flexible resin sheets with each other and welding their edge parts to form into a bag. Each of the liquid chemical bags has a port part communicating with an outside. A joint with a valve is attached to each of the port parts.Type: ApplicationFiled: December 6, 2016Publication date: June 8, 2017Inventors: Masayuki TSUKADA, Kazutaka SHIBUYA, Takayuki FUSE, Yoshio NAKAMURA, Shiro Hara
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Patent number: 9671573Abstract: This light receptacle comprises: first optical surfaces on which light beams emitted from light emitting elements are respectively caused to be incident; second optical surfaces which emit the light beams incident on first optical surfaces respectively toward the end faces of light transmission bodies; a third optical surface which reflects the light beams incident on the first optical surfaces toward the second optical surfaces; and recesses which are formed in the surface on which second optical surfaces are arranged. The distance between the centers of two adjacent first optical surfaces before mold release and the distance between the centers of two adjacent second optical surfaces before mold release during injection molding are shorter than the distance between the optical axes of light beams emitted from two adjacent light emitting elements that are arranged so as to face each other.Type: GrantFiled: January 6, 2015Date of Patent: June 6, 2017Assignee: Enplas CorporationInventors: Shimpei Morioka, Kazutaka Shibuya
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Publication number: 20170097477Abstract: This optical receptacle has the following: a first surface that includes a first optical surface and a third optical surface; a reflective surface whereby the light inputted via the first optical surface is reflected in a direction parallel to a substrate; an optical separation unit whereby the light reflected off the reflective surface is separated into monitoring light and signal light; a transmitting surface through which the signal light separated out by the optical separation unit is transmitted; a third surface that includes a second optical surface via which the signal light that has been transmitted through the transmitting surface is outputted towards the end face of the aforementioned light-transporting body; and a reflected-monitoring-light avoidance means whereby monitoring light that has reached the detection element is guide so as not to return to the abovementioned light-emitting element.Type: ApplicationFiled: March 13, 2015Publication date: April 6, 2017Inventor: Kazutaka SHIBUYA
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Publication number: 20170097475Abstract: This optical receptacle comprises the following: an optical-receptacle body that is formed via injection molding; a first optical surface; a second optical surface on a first side; a first concavity that has an angled surface whereby light that has entered via the first optical surface is reflected towards the second optical surface; a gate section on a third side; a first through-hole and a second through-hole that extend in the direction of the axis of light traveling between the second optical surface and a light-transporting body; and a second concavity located between the first concavity and the third side. The part of the second concavity closest to a second side is closer to the abovementioned first side than the part of the gate section closest to the first side is. The first through-hole also opens to a first-side surface and a second-side surface of the second concavity.Type: ApplicationFiled: February 26, 2015Publication date: April 6, 2017Inventor: Kazutaka SHIBUYA