Patents by Inventor Kazutaka Suzuki

Kazutaka Suzuki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12038620
    Abstract: An image relay device that projects laser light representing an image emitted from a projection device onto the retina is provided. The image relay device includes a projection device, a first optical member, and a second optical member. The projection device includes a light source configured to emit laser light and a scan unit configured to scan the laser light based on image data. The first optical member receives an image light from the projection device and converts the image light which is a parallel light, to light beams of convergent light. The second optical member converts the light beams output from the first optical member into parallel light.
    Type: Grant
    Filed: March 25, 2020
    Date of Patent: July 16, 2024
    Assignee: QD Laser, Inc.
    Inventors: Makoto Suzuki, Kenji Yasui, Kazutaka Saito
  • Patent number: 11908908
    Abstract: A semiconductor device includes a substrate. The device includes a stacked film that includes a plurality of first electrode layers provided over the substrate and separated from each other in a first direction perpendicular to a front surface of the substrate and a plurality of second electrode layers provided over the first electrode layer and separated from each other in the first direction. The device further includes a first insulating film and a second insulating film that penetrate the plurality of first electrode layers and the plurality of second electrode layers in the first direction. The stacked film further includes a first gap portion including a first portion provided between the substrate and a lowermost layer of the plurality of first electrode layers and a second portion connected to the first portion, penetrating the plurality of first electrode layers in the first direction, between the first insulating film and the second insulating film.
    Type: Grant
    Filed: August 26, 2021
    Date of Patent: February 20, 2024
    Assignee: KIOXIA CORPORATION
    Inventor: Kazutaka Suzuki
  • Patent number: 11897022
    Abstract: A fin according to the present disclosure is a corrugated fin formed of a metal plate by bending into a corrugated shape, and the corrugated fin includes peak portions extending in a first direction, valley portions extending in the first direction, and inclined portions connecting the peak portions and the valley portions adjacent to each other. The peak portions and the valley portions are alternately arranged in a second direction perpendicular to the first direction, and a thickness of the metal plate at each apex of the peak portions and the valley portions is larger than a thickness of the inclined portions of the metal plate.
    Type: Grant
    Filed: July 17, 2019
    Date of Patent: February 13, 2024
    Assignee: DENSO CORPORATION
    Inventors: Kenichi Kachi, Hisashi Kobayashi, Sachi Onaga, Kazuhiro Mitsukawa, Yoshinori Sakimoto, Taichi Asano, Kazutaka Suzuki
  • Publication number: 20230328974
    Abstract: A semiconductor storage device according to an embodiment includes a multilayered body, a first dividing part, a second dividing part, a third dividing part, second columnar bodies, and third columnar bodies. The third dividing part is between the first dividing part and the second dividing part. The third dividing part divides each of gate electrode layers. The third dividing part includes first columnar bodies. The first columnar bodies having insulating properties at least in outer circumferential portions of the first columnar bodies. A width of each of the first columnar bodies is larger than a distance between two second columnar bodies adjacent in a second direction included in the second columnar bodies or larger than a distance between two third columnar bodies adjacent in the second direction included in the third columnar bodies.
    Type: Application
    Filed: June 13, 2022
    Publication date: October 12, 2023
    Applicant: Kioxia Corporation
    Inventor: Kazutaka SUZUKI
  • Publication number: 20230262973
    Abstract: A semiconductor storage device includes a substrate having a surface, a first conductive layer 25 disposed on a substrate and extending in an X direction parallel to the surface of the substrate; a second conductive layer 25 that disposed on the first conductive layer 25 and extending in the X direction; an insulation plug 30 disposed on the substrate, extends in a Z direction intersecting with the X direction, and intersects with the first conductive layer 25; and a contact plug CC disposed on the first insulation plug 30, extends in the Z direction, and intersects with the second conductive layer 25.
    Type: Application
    Filed: April 24, 2023
    Publication date: August 17, 2023
    Applicant: Kioxia Corporation
    Inventors: Kaihei KATO, Takashi FUKUSHIMA, Kazutaka SUZUKI
  • Patent number: 11723534
    Abstract: An object is to simply and easily evaluate differences in behavior of the eyes of subjects. A binocular measurement system 1 includes a photodetector 7 that detects reflected light from the right eye ER and the left eye EL of a subject, and outputs image signal of the reflected light, a feature amount calculating unit 11 that calculates a feature amount corresponding to the right eye ER and a feature amount corresponding to the left eye EL based on the image signal, and a comparison value calculating unit 13 that calculates, based on the two feature amounts, a comparison value obtained by comparing the two feature amounts.
    Type: Grant
    Filed: November 17, 2020
    Date of Patent: August 15, 2023
    Assignee: HAMAMATSU PHOTONICS K.K.
    Inventors: Kazutaka Suzuki, Munenori Takumi, Naotoshi Hakamata, Haruyoshi Toyoda, Yoshinori Matsui
  • Patent number: 11719495
    Abstract: A plate heat exchanger includes heat transfer plates having openings at four corners thereof, having outer wall portions at their edges, and stacked together. The heat transfer plates are partially brazed together such that a first flow passage for first fluid and a second flow passage for second fluid are alternately arranged, with a heat transfer plate interposed between these flow passages, the openings communicating with each other, forming a first header allowing the first fluid to flow into and out of the first flow passage and a second header allowing the second fluid to flow into and out of the second flow passage. One heat transfer plate located between the first or second flow passage is formed by stacking two metal plates. Space between the metal plates includes a fine flow passage located within a heat exchange region, and a peripheral leakage passage outward of the fine flow passage.
    Type: Grant
    Filed: February 28, 2019
    Date of Patent: August 8, 2023
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Faming Sun, Susumu Yoshimura, Yoshitaka Eijima, Sho Shiraishi, Ryosuke Abe, Masahiro Yokoi, Kazutaka Suzuki
  • Patent number: 11672113
    Abstract: A semiconductor storage device includes a substrate having a surface, a first conductive layer 25 disposed on a substrate and extending in an X direction parallel to the surface of the substrate; a second conductive layer 25 that disposed on the first conductive layer 25 and extending in the X direction; an insulation plug 30 disposed on the substrate, extends in a Z direction intersecting with the X direction, and intersects with the first conductive layer 25; and a contact plug CC disposed on the first insulation plug 30, extends in the Z direction, and intersects with the second conductive layer 25.
    Type: Grant
    Filed: August 31, 2020
    Date of Patent: June 6, 2023
    Assignee: KIOXIA CORPORATION
    Inventors: Kaihei Kato, Takashi Fukushima, Kazutaka Suzuki
  • Patent number: 11662152
    Abstract: A plate heat exchanger includes a plurality of heat transfer plates stacked together and each having openings at four corners thereof. The heat transfer plates are partially brazed together such that a first flow passage through which first fluid flows and a second flow passage through which second fluid flows are alternately arranged with one of the heat transfer plates disposed therebetween, openings at the four corners being connected forming first headers through which the first fluid enters and is discharged and second headers through which the second fluid enters and is discharged. At least one of two heat transfer plates between which the first flow passage or the second flow passage is disposed is formed by a pair of metal plates stacked together. The metal plate adjacent to the second flow passage is thinner than the metal plate adjacent to the first flow passage.
    Type: Grant
    Filed: February 28, 2019
    Date of Patent: May 30, 2023
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Faming Sun, Susumu Yoshimura, Yoshitaka Eijima, Sho Shiraishi, Ryosuke Abe, Masahiro Yokoi, Kazutaka Suzuki
  • Patent number: 11619480
    Abstract: A plurality of pixels are arranged two-dimensionally in a matrix and individually include a first photosensitive portion and a second photosensitive portion. A plurality of first wirings connect a plurality of first photosensitive portions to each other for every row. A plurality of second wirings connect a plurality of second photosensitive portions to each other for every column. A first reading unit 21 is arranged to read signal data through at least some of the plurality of first wirings. A second reading unit 31 is arranged to read signal data through at least some of the plurality of second wirings. The first reading unit 21 has a reading pixel setting unit 26 arranged to set, based on signal data read in the first frame, a pixel group for reading signal data in a second frame subsequent to a first frame from the plurality of pixels.
    Type: Grant
    Filed: June 1, 2022
    Date of Patent: April 4, 2023
    Assignee: HAMAMATSU PHOTONICS K.K.
    Inventors: Yoshinori Matsui, Yukinobu Sugiyama, Munenori Takumi, Haruyoshi Toyoda, Kazutaka Suzuki, Kazuhiro Nakamura, Keisuke Uchida
  • Patent number: 11587871
    Abstract: In one embodiment, a semiconductor device includes a first insulator, a plurality of interconnections provided in the first insulator. The device further includes a second insulator provided on the first insulator and the plurality of interconnections, and a conductor provided on a first interconnection among the plurality of interconnections and having a shape that is projected upwardly with respect to the first interconnection in the second insulator. The device further includes a plug provided on the first interconnection via the conductor. The device further includes a first pad provided above the plug and electrically connected to the plug, and a second pad provided on the first pad and electrically connected to the first pad.
    Type: Grant
    Filed: December 9, 2020
    Date of Patent: February 21, 2023
    Assignee: Kioxia Corporation
    Inventors: Kazutaka Suzuki, Kazuhiro Nakanishi, Kazuhiro Nojima
  • Patent number: 11530884
    Abstract: A heat exchanger includes a duct, a core portion, and a caulking plate. The duct has an inlet and an outlet. The core portion is housed in the duct in a state where cooling plates and cooling fins are stacked in a stacking direction. The caulking plate has a frame shape corresponding to an opening shape of the inlet and the outlet and brazed to the inlet and the outlet. The caulking plate is interposed between the duct and a tank to fix the tank. A first joint between the duct and the core portion and a second joint between the duct and the caulking plate are distanced from each other in the stacking direction by a predetermined distance. The duct has a rib between the first joint and the second joint or at the second joint.
    Type: Grant
    Filed: October 15, 2020
    Date of Patent: December 20, 2022
    Assignee: DENSO CORPORATION
    Inventors: Kazutaka Suzuki, Taichi Asano
  • Patent number: 11519673
    Abstract: A plate heat exchanger includes heat transfer plates each of which has openings at four corners thereof, and which are stacked together. The heat transfer plates are partially brazed together such that a first flow passage through which first fluid flows and a second flow passage through which second fluid flows are alternately arranged, with an associated heat transfer plate interposed between the first and second flow passages. The openings at each of the four corners communicate with each other, thereby forming a first header and a second header, the first header allowing the first fluid to flow into and flow out of the first flow passage, the second header allowing the second fluid to flow into and flow out of the second flow passage.
    Type: Grant
    Filed: February 28, 2019
    Date of Patent: December 6, 2022
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Susumu Yoshimura, Faming Sun, Yoshitaka Eijima, Sho Shiraishi, Masahiro Yokoi, Ryosuke Abe, Kazutaka Suzuki
  • Publication number: 20220290972
    Abstract: A plurality of pixels are arranged two-dimensionally in a matrix and individually include a first photosensitive portion and a second photosensitive portion. A plurality of first wirings connect a plurality of first photosensitive portions to each other for every row. A plurality of second wirings connect a plurality of second photosensitive portions to each other for every column. A first reading unit 21 is arranged to read signal data through at least some of the plurality of first wirings. A second reading unit 31 is arranged to read signal data through at least some of the plurality of second wirings. The first reading unit 21 has a reading pixel setting unit 26 arranged to set, based on signal data read in the first frame, a pixel group for reading signal data in a second frame subsequent to a first frame from the plurality of pixels.
    Type: Application
    Filed: June 1, 2022
    Publication date: September 15, 2022
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Yoshinori MATSUI, Yukinobu SUGIYAMA, Munenori TAKUMI, Haruyoshi TOYODA, Kazutaka SUZUKI, Kazuhiro NAKAMURA, Keisuke UCHIDA
  • Publication number: 20220293751
    Abstract: A semiconductor device includes a substrate. The device includes a stacked film that includes a plurality of first electrode layers provided over the substrate and separated from each other in a first direction perpendicular to a front surface of the substrate and a plurality of second electrode layers provided over the first electrode layer and separated from each other in the first direction. The device further includes a first insulating film and a second insulating film that penetrate the plurality of first electrode layers and the plurality of second electrode layers in the first direction. The stacked film further includes a first gap portion including a first portion provided between the substrate and a lowermost layer of the plurality of first electrode layers and a second portion connected to the first portion, penetrating the plurality of first electrode layers in the first direction, between the first insulating film and the second insulating film.
    Type: Application
    Filed: August 26, 2021
    Publication date: September 15, 2022
    Applicant: Kioxia Corporation
    Inventor: Kazutaka SUZUKI
  • Publication number: 20220289951
    Abstract: A vibrationproof rubber composition capable of obtaining a vibrationproof rubber having a specific hardness and an excellent balance of mechanical properties, vibrationproof properties, and a friction coefficient, a vulcanized molded body obtained by vulcanizing the vibrationproof rubber composition, and vibrationproof rubber is provided. A vibrationproof rubber composition comprising: 100 parts by mass of xanthogen-modified chloroprene rubber; 0.5 to 2 parts by mass of stearic acid amide; and 4 to 5 parts by mass of erucic acid amide, wherein: the vibrationproof rubber composition further comprises carbon black with an average primary particle diameter of 60 to 470 nm, and a molded body obtained by vulcanizing the vibrationproof rubber composition has a type A durometer hardness of 50 to 70 is provided.
    Type: Application
    Filed: January 28, 2022
    Publication date: September 15, 2022
    Applicants: DENKA COMPANY LIMITED, HONDA MOTOR CO., LTD.
    Inventors: Hiroyuki Ishiguro, Yasushi Abe, Kazutaka Suzuki, Keisuke Kawabe
  • Patent number: 11405573
    Abstract: A light detection device detects an incident position of light. The plurality of pixels are arranged two-dimensionally in a matrix and individually have a first photosensitive portion and a second photosensitive portion. The first circuit connects a plurality of first photosensitive portions to each other for every row. The second circuit connects a plurality of second photosensitive portions to each other for every column. The first reading unit reads signal data through the first circuit. The second reading unit reads signal data through the second circuit. The first circuit includes row switches arranged to switch electrical connection and disconnection between first photosensitive portions adjacent to each other in the same row.
    Type: Grant
    Filed: December 25, 2018
    Date of Patent: August 2, 2022
    Assignee: HAMAMATSU PHOTONICS K.K.
    Inventors: Yoshinori Matsui, Munenori Takumi, Haruyoshi Toyoda, Kazutaka Suzuki, Kazuhiro Nakamura
  • Patent number: 11378382
    Abstract: A plurality of pixels are arranged two-dimensionally in a matrix and individually include a first photosensitive portion and a second photosensitive portion. A plurality of first wirings connect a plurality of first photosensitive portions to each other for every row. A plurality of second wirings connect a plurality of second photosensitive portions to each other for every column. A first reading unit is arranged to read signal data through at least some of the plurality of first wirings. A second reading unit is arranged to read signal data through at least some of the plurality of second wirings. The first reading unit has a reading pixel setting unit arranged to set, based on signal data read in the first frame, a pixel group for reading signal data in a second frame subsequent to a first frame from the plurality of pixels.
    Type: Grant
    Filed: December 25, 2018
    Date of Patent: July 5, 2022
    Assignee: HAMAMATSU PHOTONICS K.K.
    Inventors: Yoshinori Matsui, Yukinobu Sugiyama, Munenori Takumi, Haruyoshi Toyoda, Kazutaka Suzuki, Kazuhiro Nakamura, Keisuke Uchida
  • Patent number: 11326788
    Abstract: An air-conditioning apparatus includes an outdoor unit, a heat medium relay unit, and an indoor unit. The outdoor unit is installed in an outdoor space, which is a space outside a building including an air-conditioned space. The heat medium relay unit is installed in the outdoor space, and includes a housing that accommodates an intermediate heat exchanger. The indoor unit includes a load heat exchanger configured to exchange heat between air and a heat medium. The housing is installed to the outer wall of the building.
    Type: Grant
    Filed: February 28, 2018
    Date of Patent: May 10, 2022
    Assignee: Mitsubishi Electric Corporation
    Inventors: Kazunari Sawada, Taro Hattori, Kazutaka Suzuki, Hirokazu Minamisako
  • Patent number: 11313623
    Abstract: A heat exchanger includes a duct, a stacked core, and a coupling plate. The duct includes a first plate that is disposed to face at least one of end faces of the stacked core in a core width direction, and a second plate that is disposed to face at least one of the end faces of the stacked core in a tube stacking direction. The second plate includes a second-plate end plate portion disposed to face the end face of the stacked core in the core width direction and brazed to a wall surface of the first plate, a second-plate center plate portion that is disposed to face the end face of the stacked core in the tube stacking direction, and a flange portion that extends in the tube stacking direction and is brazed to a bottom wall surface of a groove portion of the coupling plate.
    Type: Grant
    Filed: February 29, 2016
    Date of Patent: April 26, 2022
    Assignee: DENSO CORPORATION
    Inventors: Masafumi Saitou, Akira Yamanaka, Masaki Harada, Kenji Yamada, Kazutaka Suzuki, Taichi Asano, Shota Terachi