Abstract: A permeation preventing film of a silicon nitride film 16 is inserted between a silicon substrate 10 and a High-k gate insulation film 18 to thereby prevent the High-k gate insulation film 18 from being deprived of oxygen, while oxygen anneal is performed after a gate electrode layer 20 has been formed to thereby supplement oxygen. The silicon nitride film 16, which is the permeation preventing film, becomes a silicon oxide nitride film 17 without changing the film thickness, whereby characteristics deterioration of the High-k gate insulation film 18 due to the oxygen loss can be prevented without lowering the performance of the transistor. The semiconductor device having the gate insulation film formed of even a high dielectric constant material can be free from the shift of the threshold voltage.

Abstract: A semiconductor device manufacture method has the steps of: (a) forming an interface layer of SiO or SiON on the surface of an active region of a silicon substrate; (b) forming a high dielectric constant gate insulating film such as HfSiON having a dielectric constant higher than that of silicon oxide, above the interface layer; (c) forming a gate electrode of polysilicon above the high dielectric constant gate insulating film; (d) passivating the substrate surface at least before or after the high dielectric constant gate insulating film is formed; (e) forming an insulated gate electrode structure by patterning at least the gate electrode and the high dielectric constant gate insulating film; and (f) forming source/drain regions in the active region on both sides of the insulated gate electrode structure. The semiconductor device has the high dielectric constant insulating film having a dielectric constant higher than that of silicon oxide.

Abstract: A method of manufacturing a semiconductor device has the steps of: (a) evacuating a sputtering chamber to a pressure of 1.5×10?8 torr to 9×10?8 torr and heating a silicon substrate to a temperature of 330° C. to 395° C.; (b) sputtering Co on the heated silicon substrate; (c) after the step (b), forming a cap layer having a small oxygen transmission performance on the silicon substrate without exposing the silicon substrate in air; (d) after the step (c), performing primary annealing; (e) after the step (d), removing the cap layer and unreacted Co; and (f) after the step (e), performing secondary annealing by heating the silicon substrate to a temperature of 450° C. to 750° C.

Abstract: Each of a pair of side members (4) is located relative to an underbody (3) using two locators (16). Each locator is lowered by a lifter (15) and placed on a slide base (18). The slide base is movable along a slide guide (17) toward and away from a transfer conveyor (11).

Abstract: A roof panel (31) is pre-set on the left and right side members (4) fixed to an underbody of a car. A roof panel spot welding station (7) includes a pair of frames (34) and two joisted-locating jigs (35, 36) bridging the frames. Each of the joisted-locating jigs is furnished with a clamp mechanism for holding the roof panel. The roof panel is located to the side members by the locating jigs, and spot-welded to the side members.

Abstract: Objectives of the present invention are to reduce the size and weight of side-member and roofjigs, and to simplify analysis of problems related to ease-of-assembly of vehicle body roofs and side-members. In a first step, using clamping jigs 11-1 through 11-4, a left and right pair of side-members 4 are positioned with respect to an underbody 3 (that was positioned at a prescribed position in a vehicle body assembly line 2), and welded in place. Continuing in a second step, after the clamping jigs 11-1 through 11-4 have been released, a roof 31 is placed on upper welding edges of the left and right side-members 4 while being positioned using suspension jigs 35 and 36, after which it is welded in place.

Abstract: A method of manufacturing a semiconductor device has the steps of: (a) evacuating a sputtering chamber to a pressure of 1.5×10−8 torr to 9×10−8 torr and heating a silicon substrate to a temperature of 330° C. to 395° C.; (b) sputtering Co on the heated silicon substrate; (c) after the step (b), forming a cap layer having a small oxygen transmission performance on the silicon substrate without exposing the silicon substrate in air; (d) after the step (c), performing primary annealing; (e) after the step (d), removing the cap layer and unreacted Co; and (f) after the step (e), performing secondary annealing by heating the silicon substrate to a temperature of 450° C. to 750° C.

Abstract: A thin film of a high temperature superconductive oxide of rare earth metal-alkali earth metal-copper-oxygen system or group VA metal-alkali earth metal-copper-oxygen system, which has an excellent crystallinity, particularly a single crystalline structure, is formed on a substrate by a CVD method, in which halides of the metals and an oxygen source gas are separately flowed over a substrate and caused to react with each other over the substrate, to deposit a desired superconducting oxide film.