Abstract: A semiconductor laser device includes a substrate which is made of, e.g., silicon and which has in its principal surface first and second recessed portions formed at a distance from each other. Disposed in the first recessed portion is a first semiconductor laser chip in the form of a function block, which emits an infrared laser beam. Disposed in the second recessed portion is a second semiconductor laser chip in the form of a function block, which emits a red laser beam.

Abstract: A semiconductor laser device includes: an active layer formed on a substrate and including an AlGaAs layer; and an upper spacer layer formed at least one of above and below the active layer and including AlaGabIn1-a-bP (where 0?a?1, 0?b?1, and 0?a+b?1). The upper spacer layer has a composition enough to serve as a barrier layer against electrons injected into the active layer.

Abstract: A laser module includes a substrate 1, a first laser element 2 placed on the substrate 1, a second laser element 3 placed with an output surface opposed to the first laser element 2 on the substrate 1, and a mirror 7 placed between the first laser element 2 and the second laser element 3. The mirror 7 has a reflective surface capable of reflecting output light from the first laser element 2 or the second laser element 3 in a predetermined direction, and is placed so as to move or rotate between a first position capable of reflecting the output light from the first laser element 2 and a second position capable of reflecting the output light from the second laser element 3. Thus, a laser module can be provided in which high precision, low cost, and miniaturization can be realized.

Abstract: In a semiconductor device fabrication method using a fluidic self-assembly technique in which in a liquid, a plurality of semiconductor elements are mounted in a self-aligned manner on a substrate with a plurality of recessed portions formed therein, protruding potions that are inserted in the respective recessed portions of the substrate are formed in the lower portions of the respective semiconductor elements, the liquid in which the semiconductor elements have been spread is poured over the substrate intermittently, and the substrate is rotated in a period of time in which the liquid is not poured.

Abstract: The present invention provides a solid-state imaging device including an optical element that efficiently condenses even a wide-angle incident light and has a color separation function. The solid-state imaging device includes pixels, and in the device each pixel includes: a light receiving element; and an optical element, whose surface at least, is made of metal, the optical element has: an aperture; and convex parts which are arranged cyclically, and a distance between adjacent convex parts and a width of each convex part range from 0 to 1 wavelength of light to be condensed.

Abstract: To provide a manufacturing method for an optical pickup in which a movable member carrying an objective lens is supported by a fixed member through a pair of elastic support member groups, which are each made up of a plurality of parallel elastic support members, so as to be movable in focusing and tracking directions. In a suspension unit forming step, two holding members are formed from a synthetic resin by insert molding at different positions of each elastic support member group in a lengthwise direction of the elastic support members, thereby forming a pair of suspension units. In a connecting step, the pair of suspension units are opposed with an arrangement direction of the elastic support members being substantially the same as the focusing direction, and one holding member of each suspension unit is connected to the movable member and the other holding member to the fixed member.

Abstract: In a semiconductor-device fabrication method, a plurality of recessed portions are first formed in the principal surface of a substrate. Then, a through hole, passing through the substrate in the front-to-back direction of the substrate, is formed under a portion of the bottom of each recessed portion in the substrate. Subsequently, a plurality of semiconductor elements in the form of chips are spread in a liquid, and the semiconductor-element-spread liquid is poured over the principal surface of the substrate, while passing the liquid through the through holes, so that the semiconductor elements fit into the recessed portions in a self-aligned manner. In this way, the semiconductor elements are disposed into the recessed portions in the substrate in a self-aligned manner.

Abstract: A semiconductor device includes: a substrate having in its principal surface first and second recessed portions formed adjacent to each other; and first and second semiconductor laser chips each having a portion that is inserted in one of the recessed portions. The depth of the recessed portions is smaller than the height of the first and second semiconductor laser chips that are disposed in the recessed portions.

Abstract: According to the present invention, a first p-side electrode 7A made of metal which is provided with regularly arranged holes 10 having a diameter smaller than a laser oscillation wavelength and a second p-side electrode 7B arranged around the periphery of the first p-type electrode 7A are used as a p-side mirror of a surface-emitting laser. Light in a resonator formed of a p-side electrode 7 and an n-type mirror 2 is first converted to a surface plasmon and then reconverted to the light by the p-side electrode 7A, and then emitted outside the resonator. This improves the light transmittance, thereby permitting use of metal which is considered to have inherently low light transmittance as a material for the p-side electrode 7. If the p-side electrode 7 is made of metal, operating voltage is reduced and heat dissipation improves, without causing a spike in a valence band, which occurs when a semiconductor layer is used.

Abstract: An optical pickup having a light-emitting element, an objective lens unit, a reflecting mirror and a light-receiving element, emits a beam onto an optical recording medium and uses a reflected beam to read recorded information. In the objective lens unit, a central part of a surface, facing the light-emitting element, of an objective lens disposed so that an optical axis is substantially aligned with a chief ray of the beam emitted by the light-emitting element, is a transmissive diffraction grating, and a central part of a surface of the objective lens that will face the optical recording medium is a convex mirror which bulges toward the light-emitting element. The reflecting mirror, which is annular and encompasses the optical axis of the objective lens, reflects toward the objective lens the beam from the light-emitting element that has passed through the transmissive diffraction grating and been reflected by the convex mirror.

Abstract: An optical head includes a fixed part, a movable part movably held by a plurality of wires fixed on the fixed part, and magnets fixed to the fixed part. The movable part includes a movable-part housing, a heatsink held by the movable-part housing, a light emitting element and a light receiving element both mounted on the heatsink, magnets provided to both sides of the movable-part housing to contact the heatsink, an objective lens held by the movable-part housing to allow an emitted laser beam from the light emitting element to focus, and a diffraction grating provided between the objective lens and the light emitting element and between the objective lens and the light receiving element. The gap between each coil and the adjacent magnet is filled with ferrofluid having a higher thermal conductivity than the atmosphere.

Abstract: In a semiconductor device fabrication method using a fluidic self-assembly technique in which in a liquid, a plurality of semiconductor elements are mounted in a self-aligned manner on a substrate with a plurality of recessed portions formed therein, protruding potions that are inserted in the respective recessed portions of the substrate are formed in the lower portions of the respective semiconductor elements, the liquid in which the semiconductor elements have been spread is poured over the substrate intermittently, and the substrate is rotated in a period of time in which the liquid is not poured.

Abstract: Formed first is a template having openings located to correspond to a pattern in which a plurality of semiconductor laser elements are to be arranged. Then, the template is held on the principal surface of a mounting wafer onto which the semiconductor elements are to be arranged. Subsequently, the semiconductor laser elements are dispersed into a fluid, and the semiconductor-laser-element-dispersed fluid is poured over the wafer on which the template is held. In this manner, the semiconductor laser elements are disposed into the respective openings of the template in a self-aligned manner.

Abstract: An inventive optical pickup includes: a base; a movable part; a fixed part; and a first yoke. The movable part, fixed part and first yoke are provided over the base. The movable part is provided with: a hologram element; a package equipped with a laser/photodetectors integrated element in which a semiconductor laser and photodetectors are integrated; and an objective lens. A magnet is provided on each of second yokes provided on the base, and a heat dissipating medium is provided in a gap between a package metal section of the package and another magnet.

Abstract: A movable enclosure contains optical components, such as an objective lens, a semiconductor laser, a mirror, and a photodetector. The movable enclosure is supported by a fixed member via a plurality of wires that are positioned in parallel. This construction allows the movable enclosure to move in a tracking direction and a focusing direction. The plurality of wires are insulated from one another to be also used as power-supplying lines and signal lines for the semiconductor laser and the photodetector.

Abstract: Formed first is a template having openings located to correspond to a pattern in which a plurality of semiconductor laser elements are to be arranged. Then, the template is held on the principal surface of a mounting wafer onto which the semiconductor elements are to be arranged. Subsequently, the semiconductor laser elements are dispersed into a fluid, and the semiconductor-laser-element-dispersed fluid is poured over the wafer on which the template is held. In this manner, the semiconductor laser elements are disposed into the respective openings of the template in a self-aligned manner.

Abstract: A semiconductor device includes: a substrate having in its principal surface first and second recessed portions formed adjacent to each other; and first and second semiconductor laser chips each having a portion that is inserted in one of the recessed portions. The depth of the recessed portions is smaller than the height of the first and second semiconductor laser chips that are disposed in the recessed portions.

Abstract: A semiconductor laser device includes a substrate which is made of, e.g., silicon and which has in its principal surface first and second recessed portions formed at a distance from each other. Disposed in the first recessed portion is a first semiconductor laser chip in the form of a function block, which emits an infrared laser beam. Disposed in the second recessed portion is a second semiconductor laser chip in the form of a function block, which emits a red laser beam.

Abstract: An optical pickup records data in or reproduces data from optical recording media respectively having recording faces at different heights, and includes a semiconductor laser diode array having light emitting portions for respectively emitting laser beams of different wavelengths. A finite conjugate type object lens used in this optical pickup is designed so that the numerical aperture of the object lens can be controlled to be changed in accordance with switching between the different wavelengths for allowing a laser beam to be focused on each optical recording medium.

Abstract: To provide a manufacturing method for an optical pickup in which a movable member carrying an objective lens is supported by a fixed member through a pair of elastic support member groups, which are each made up of a plurality of parallel elastic support members, so as to be movable in focusing and tracking directions. In a suspension unit forming step, two holding members are formed from a synthetic resin by insert molding at different positions of each elastic support member group in a lengthwise direction of the elastic support members, thereby forming a pair of suspension units. In a connecting step, the pair of suspension units are opposed with an arrangement direction of the elastic support members being substantially the same as the focusing direction, and one holding member of each suspension unit is connected to the movable member and the other holding member to the fixed member.