Abstract: A stacking apparatus that stacks chip assemblies each having a plurality of chips disposed continuously with circuit patterns and electrodes, includes: a plurality of stages each allowed to move arbitrarily, on which the chip assemblies are placed; a storage unit that stores an estimated extent of change in a position of an electrode at each chip, expected to occur as heat is applied to the chip assemblies placed on the plurality of stages during a stacking process; and a control unit that sets positions of the plurality of stages to be assumed relative to each other during the stacking process based upon the estimated extent of change in the position of the electrode at each chip provided from the storage unit and position information indicating positions of individual chips formed at the chip assemblies and controls at least one of the plurality of stages.

Abstract: In a PET (Positron Emission Tomography)-MRI (Magnetic Resonance Imaging) apparatus of an embodiment, a magnet that is a seamless structure generates a static magnetic field in a bore having a cylindrical shape. First detectors and second detectors are each formed in a ring shape and detect gamma rays emitted from positron emitting radionuclides injected into a subject. The first detectors and the second detectors are disposed with a space therebetween in an axial direction of the bore so as to interpose the magnetic field center of the static magnetic field therebetween.

Abstract: An engine control unit of a power system is provided with a memory module which stores a fuel consumption data. An electric power ECU of a power supply system controls an operation mode of a generator based on a fuel consumption associated data transmitted from an engine control unit. An air-condition ECU of a heat system controls an operation mode of a compressor based on the fuel consumption associated data transmitted from the engine control unit. By updating the fuel consumption data stored in the engine control unit, control characteristics of the power supply system and the heat system can be varied. The fuel consumption associated data is transmitted to the ECU in preference to the other data. Moreover, the fuel consumption associated data is transmitted in a period which the electric power ECU and the air-condition ECU require.

Abstract: In a PET (Positron Emission Tomography)-MRI (Magnetic Resonance Imaging) apparatus of an embodiment, a transmitting radio frequency coil applies a radio frequency magnetic field on a subject placed in a static magnetic field. A detector is formed in a ring shape, disposed on a side adjacent to an outer circumference of the transmitting radio frequency coil, includes at least two PET detectors disposed with a space therebetween in an axial direction of a bore so as to interpose the magnetic field center of the static magnetic field therebetween, and detects gamma rays emitted from positron emitting radionuclides injected into the subject. Radio frequency shields are each formed in an approximately cylindrical shape, disposed between the transmitting radio frequency coil and the detector, and shield the radio frequency magnetic field generated by the transmitting radio frequency coil.

Abstract: Provided is an adhesive injection device for injecting an adhesive between the substrates of laminates which each comprise at least two substrates that face each other. The adhesive injection device is provided with: a cassette which holds multiple laminates aligned along the direction of lamination of the substrates; and an adhesive injector which injects adhesive into each inter-substrate space, as the laminates are being held in the cassette, so that the actions of injecting the adhesive into each inter-substrate space overlap chronologically. Holding multiple laminates in the cassette makes it possible to treat the multiple laminates as a unit. By injecting adhesive into each inter-substrate space, as the laminates are being held, so that the actions of injecting the adhesive into each inter-substrate space overlap chronologically, the injection of adhesive into multiple laminates is simplified, and the time required for injection can be reduced.

Abstract: Provided is a transport method comprising judging whether there is a possibility that misalignment greater than or equal to a threshold value occurs between substrates to be layered that are held by a pair of substrate holders aligned and stacked by an aligning section, the misalignment occurring when the pair of substrate holders is transported from the aligning section to a pressure applying section; and if the judgment indicates that there is the possibility of misalignment, transporting the pair of substrate holders to a region other than the pressure applying section. Whether there is the possibility of misalignment may be judged based on at least one of an acceleration of the substrate holders, an acceleration of a transporting section that transports the substrate holders, relative positions of the substrate holders, or relative positions of the transporting section and one of the pair of substrate holders.

Abstract: A stacking apparatus that stacks chip assemblies each having a plurality of chips disposed continuously with circuit patterns and electrodes, includes: a plurality of stages each allowed to move arbitrarily, on which the chip assemblies are placed; a storage unit that stores an estimated extent of change in a position of an electrode at each chip, expected to occur as heat is applied to the chip assemblies placed on the plurality of stages during a stacking process; and a control unit that sets positions of the plurality of stages to be assumed relative to each other during the stacking process based upon the estimated extent of change in the position of the electrode at each chip provided from the storage unit and position information indicating positions of individual chips formed at the chip assemblies and controls at least one of the plurality of stages.

Abstract: Provided is a multi-layered semiconductor apparatus with improved heat diffusion and improved heat release. The multi-layered semiconductor apparatus (100) includes a plurality of layered semiconductor chips (20-1, 20-2) that each include at least one circuit region, and the circuit regions are arranged such that heat generated by the circuit regions as a result of the circuit regions being driven is spread out. The multi-layered semiconductor apparatus (100) further comprises a heat releasing section (50) that releases the heat generated by the circuit regions, and the circuit regions are arranged such that there is less thermal resistance between the heat releasing section and circuit regions that generate a greater amount of heat per unit area.

Abstract: The terminals that oppose each other when substrates are bonded are designed to be reliably joined. Comprised in a semiconductor device design system are a numerical value acquiring part, which acquires the respective numerical values of a plurality of calculation parameters, a junction estimating part, which, in the case in which a plurality of substrates has been pressed at a prescribed pressure so that the bump front end faces come into contact, estimates whether or not the respective mutually opposing bumps will be joined based on the respective numerical values of the calculation parameters acquired by the numerical value acquiring part, and a change processing part, which, in the case in which it has been estimated by the junction estimating part that any of the bumps will not be joined, gives a warning or performs processing so as to change the numerical value of at least one calculation parameter among the plurality of calculation parameters.

Abstract: Provided is a transport method comprising judging whether there is a possibility that misalignment greater than or equal to a threshold value occurs between substrates to be layered that are held by a pair of substrate holders aligned and stacked by an aligning section, the misalignment occurring when the pair of substrate holders is transported from the aligning section to a pressure applying section; and if the judgment indicates that there is the possibility of misalignment, transporting the pair of substrate holders to a region other than the pressure applying section. Whether there is the possibility of misalignment may be judged based on at least one of an acceleration of the substrate holders, an acceleration of a transporting section that transports the substrate holders, relative positions of the substrate holders, or relative positions of the transporting section and one of the pair of substrate holders.

Abstract: Provided is a multi-layered semiconductor apparatus with improved heat diffusion and improved heat release. The multi-layered semiconductor apparatus (100) includes a plurality of layered semiconductor chips (20-1, 20-2) that each include at least one circuit region, and the circuit regions are arranged such that heat generated by the circuit regions as a result of the circuit regions being driven is spread out. The multi-layered semiconductor apparatus (100) further comprises a heat releasing section (50) that releases the heat generated by the circuit regions, and the circuit regions are arranged such that there is less thermal resistance between the heat releasing section and circuit regions that generate a greater amount of heat per unit area.

Abstract: Provided is a multi-layered semiconductor apparatus with improved heat diffusion and improved heat release. The multi-layered semiconductor apparatus (100) includes a plurality of layered semiconductor chips (20-1, 20-2) that each include at least one circuit region, and the circuit regions are arranged such that heat generated by the circuit regions as a result of the circuit regions being driven is spread out. The multi-layered semiconductor apparatus (100) further comprises a heat releasing section (50) that releases the heat generated by the circuit regions, and the circuit regions are arranged such that there is less thermal resistance between the heat releasing section and circuit regions that generate a greater amount of heat per unit area.

Abstract: Provided is a transport method comprising judging whether there is a possibility that misalignment greater than or equal to a threshold value occurs between substrates to be layered that are held by a pair of substrate holders aligned and stacked by an aligning section, the misalignment occurring when the pair of substrate holders is transported from the aligning section to a pressure applying section; and if the judgment indicates that there is the possibility of misalignment, transporting the pair of substrate holders to a region other than the pressure applying section. Whether there is the possibility of misalignment may be judged based on acceleration of the substrate holders. Whether there is the possibility of misalignment may be judged based on acceleration of a transporting section that transports the substrate holders. Whether there is the possibility of misalignment may be judged based on relative positions of the substrate holders.

Abstract: A radio frequency coil assembly is provided that includes a first radio frequency coil for receiving a magnetic resonance signal from a tested body; a second radio frequency coil for receiving a magnetic resonance signal from the tested body; and a third radio frequency coil for receiving a magnetic resonance signal from the tested body and having a shape that is different from that of at least one of the first and second radio frequency coils so as to increase local sensitivity in an image-picked-up region.

Abstract: In one embodiment, an RF coil device (90A) includes a base board (96), a belt member (94a), a first coil element (108a, 108b), a second coil element (104, 106) inside the base board, and a connecting unit (100, 102). Both ends of the belt member are respectively connected to mutually separated places on the base board, so that the center part of the belt member is located on the anterior surface of the base board. The belt member is curved to form “airspace between the center part thereof and the anterior surface for letting an arm pass through in interdigitation state”. The first coil element includes first and second partial coils inside the belt member, and becomes a loop coil element by their connection. The connecting unit detachably connects the base board to the belt member, and mutually connects the first and second partial coils in the interdigitation state.

Abstract: A radio frequency coil assembly is provided that includes a first radio frequency coil for receiving a magnetic resonance signal from a tested body; a second radio frequency coil for receiving a magnetic resonance signal from the tested body; and a third radio frequency coil for receiving a magnetic resonance signal from the tested body and having a shape that is different from that of at least one of the first and second radio frequency coils so as to increase local sensitivity in an image-picked-up region.

Abstract: A stacking apparatus that stacks chip assemblies each having a plurality of chips disposed continuously with circuit patterns and electrodes, includes: a plurality of stages each allowed to move arbitrarily, on which the chip assemblies are placed; a storage unit that stores an estimated extent of change in a position of an electrode at each chip, expected to occur as heat is applied to the chip assemblies placed on the plurality of stages during a stacking process; and a control unit that sets positions of the plurality of stages to be assumed relative to each other during the stacking process based upon the estimated extent of change in the position of the electrode at each chip provided from the storage unit and position information indicating positions of individual chips formed at the chip assemblies and controls at least one of the plurality of stages.

Abstract: An magnetic resonance diagnostic apparatus which includes a main unit and a coil unit, the magnetic resonance diagnostic apparatus including a sampling clock generating unit which generates a sampling clock signal, a sampling clock transmitting unit wirelessly transmits the sampling clock signal, a sampling clock receiving unit which receives the transmitted sampling clock signal, a receiving coil which outputs an electrical magnetic resonance signal in response to a magnetic resonance signal emitted from a subject as electromagnetic radiation, a digitization unit which digitizes, synchronously with the received sampling clock signal, the outputted magnetic resonance signal, a resonance signal transmitting unit which wirelessly transmits the digitized magnetic resonance signal, a resonance signal receiving unit which receives the transmitted magnetic resonance signal, and a reconstruction unit which processes, synchronously with the generated sampling clock signal, the received magnetic resonance signal and t

Abstract: A stacking apparatus that stacks chip assemblies each having a plurality of chips disposed continuously with circuit patterns and electrodes, includes: a plurality of stages each allowed to move arbitrarily, on which the chip assemblies are placed; a storage unit that stores an estimated extent of change in a position of an electrode at each chip, expected to occur as heat is applied to the chip assemblies placed on the plurality of stages during a stacking process; and a control unit that sets positions of the plurality of stages to be assumed relative to each other during the stacking process based upon the estimated extent of change in the position of the electrode at each chip provided from the storage unit and position information indicating positions of individual chips formed at the chip assemblies and controls at least one of the plurality of stages.

Abstract: A design system (1) is provided with a function of acquiring a design specification of an object to be designed and an evaluation index for evaluating a value of the object to be designed in the design specification; a function of acquiring profile data of the object to be designed; a function (design order determining section (12)) of extracting entity design elements and important design variables from the profile data and prioritizing the entity design elements and the important design variables so as to construct a design workflow; a function (evaluation approach construction section (13)) of constructing an evaluation formula for performance/evaluation of a design result of each of the entity design elements in conformity with the design workflow; a function of finding an appropriate solution by performing automatic optimization while evaluating the design result with use of the evaluation index in accordance with the design workflow with which the evaluation formula is associated; and a function of outp