Patents by Inventor Kazuya Okubo
Kazuya Okubo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11967593Abstract: A semiconductor device includes a substrate; a circuit region provided with a power supply wiring, a ground wiring, and a signal line; and a first diode connected between the signal line and a first wiring. The first wiring is one of the power supply wiring and the ground wiring. The first diode includes a first impurity region of a first conductive type, electrically connected to the signal line, and a second impurity region of a second conductive type, different from the first conductive type, electrically connected to the first wiring. The signal line, the first wiring, or both is formed in the substrate.Type: GrantFiled: November 17, 2021Date of Patent: April 23, 2024Assignee: SOCIONEXT INC.Inventor: Kazuya Okubo
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Publication number: 20230407090Abstract: A polyphenylene sulfide resin composition includes 100 parts by weight of (A) a polyphenylene sulfide resin, 16 to 50 parts by weights of (B) a thermoplastic resin having a tracking resistance of 125 V or more based on the IEC60112 standard, and having a glass-transition temperature of 0° C. or more, 10 to 25 parts by weight of (C) an epoxy group-containing olefinic copolymer, 10 to 25 parts by weight of (D) an olefinic copolymer having no polar functional group, and furthermore 40 to 140 parts by weight of (E) a fibrous filler, wherein (B) the thermoplastic resin, (C) the epoxy group-containing olefinic copolymer, and (D) the olefinic copolymer having no polar functional group are dispersed, having a number average dispersed particle size of 500 nm or less.Type: ApplicationFiled: November 8, 2021Publication date: December 21, 2023Inventors: Shohei Yumiyama, Keita Tokuzumi, Kazuya Okubo
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Patent number: 11551930Abstract: Embodiments are described herein to reshape spacer profiles to improve spacer uniformity and thereby improve etch uniformity during pattern transfer associated with self-aligned multiple-patterning (SAMP) processes. For disclosed embodiments, cores are formed on a material layer for a substrate of a microelectronic workpiece. A spacer material layer is then formed over the cores. Symmetric spacers are then formed adjacent the cores by reshaping the spacer material layer using one or more directional deposition processes to deposit additional spacer material and using one or more etch process steps. For one example embodiment, one or more oblique physical vapor deposition (PVD) processes are used to deposit the additional spacer material for the spacer profile reshaping. This reshaping of the spacer profiles allows for symmetric spacers to be formed thereby improving etch uniformity during subsequent pattern transfer processes.Type: GrantFiled: March 12, 2019Date of Patent: January 10, 2023Assignee: Tokyo Electron LimitedInventors: Akiteru Ko, Kazuya Okubo, Hiroyuki Toshima
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Publication number: 20220403111Abstract: A polyphenylene sulfide resin composition for automotive cooling parts contains, with respect to 100 parts by weight of a polyphenylene sulfide resin (A): 30 to 110 parts by weight of glass fibers (B); and 0.1 to 3 parts by weight of a silane compound (C) having a functional group selected from an amino group and an isocyanate group. In this polyphenylene sulfide resin composition, the PPS resin (A) has a number-average molecular weight of 7,000 to 14,000, and gives a residue amount of 0.05 to 1.0% by weight when dissolved in 20-fold amount by weight of 1-chloronaphthalene at 250° C. for 5 minutes and subsequently subjected to heat pressure filtration through a PTFE membrane filter having a pore size of 1 ?m.Type: ApplicationFiled: November 18, 2020Publication date: December 22, 2022Inventors: Shunsuke Kondo, Kazuya Okubo, Koki Fukuyasu
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Publication number: 20220380598Abstract: A polyphenylene sulfide resin composition for automotive cooling parts contains, with respect to 100 parts by weight of a polyphenylene sulfide resin (A): 30 to 110 parts by weight of glass fibers (B); and 0.1 to 3 parts by weight of a silane compound (C) having a functional group selected from an amino group and an isocyanate group. In this polyphenylene sulfide resin composition, the PPS resin (A) has a number-average molecular weight of 7,000 to 14,000, and gives a residue amount of 2.0 to 5.0% by weight when dissolved in 20-fold amount by weight of 1-chloronaphthalene at 250° C. for 5 minutes and subsequently subjected to heat pressure filtration through a PTFE membrane filter having a pore size of 1 ?m.Type: ApplicationFiled: November 18, 2020Publication date: December 1, 2022Inventors: Shunsuke Kondo, Kazuya Okubo, Koki Fukuyasu
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Publication number: 20220266578Abstract: The present invention is a flame-resistant layered molded article in which one surface of a fiber sheet material containing at least infusible fibers A, particularly a fiber sheet material containing infusible fibers A and thermoplastic fibers B, is exposed to the outside of a molded article, and in which at least a part of the other surface side is joined to a thermoplastic resin C forming a molded article body. As a flame-resistant layered molded article, the present invention can realize to exhibit the high flame resistance and flame-shielding property that are required, and to ensure the desired strength and stiffness and good moldability that are required overall.Type: ApplicationFiled: October 2, 2020Publication date: August 25, 2022Applicant: TORAY INDUSTRIES, INC.Inventors: Makoto WADA, Masaru HARADA, Kazuya OKUBO, Osamu NIWA, Hiroshi KIYAMA
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Publication number: 20220077138Abstract: A semiconductor device includes a first wiring; a first circuit region provided with a first power supply wiring and a first ground wiring; a second circuit region provided with a second power supply wiring and a second ground wiring; and a bidirectional diode connected between the first and second ground wirings, and provided with first and second diodes. The first diode includes a first impurity region of a first conductive type, connected to the second ground wiring, and a second impurity region of a second conductive type, connected to the first ground wiring. The second diode includes a third impurity region of the second conductive type connected to the second ground wiring, and a fourth impurity region of the first conductive type connected to the first ground wiring. Any of the first to fourth impurity regions, or any combination of the impurity regions is connected to the first wiring.Type: ApplicationFiled: November 18, 2021Publication date: March 10, 2022Inventor: Kazuya OKUBO
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Publication number: 20220077141Abstract: A semiconductor device includes a substrate; a circuit region provided with a power supply wiring, a ground wiring, and a signal line; and a first diode connected between the signal line and a first wiring. The first wiring is one of the power supply wiring and the ground wiring. The first diode includes a first impurity region of a first conductive type, electrically connected to the signal line, and a second impurity region of a second conductive type, different from the first conductive type, electrically connected to the first wiring. The signal line, the first wiring, or both is formed in the substrate.Type: ApplicationFiled: November 17, 2021Publication date: March 10, 2022Inventor: Kazuya Okubo
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Patent number: 11241818Abstract: Provided are: a pipe-shaped integrally molded article which is formed by molding a polyphenylene sulfide resin composition, and which has, at one or more portions thereof, at least one selected from different-shape sections, bent sections, and different-diameter sections, the pipe-shaped integrally molded article being characterized in that the total length L (mm) thereof is 1000 or more, and the ratio (L/D) of the total length L (mm) to the outer diameter D (mm) of the pipe-shaped integrally molded article is 20 or more: and a production method for the pipe-shaped integrally molded article. According to the present invention, it is possible to efficiently provide a pipe-shaped integrally molded article having a desired large length and including a three-dimensionally complicated shape, by using a PPS resin composition having excellent heat resistance and chemical resistance.Type: GrantFiled: January 10, 2019Date of Patent: February 8, 2022Assignee: TORAY INDUSTRIES, INC.Inventors: Yuki Suzuki, Rei Sato, Kazuya Okubo
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Publication number: 20220010073Abstract: A polyphenylene sulfide resin composition includes a blend of the following: 100 parts by weight of a polyphenylene sulfide resin (A); 100 to 250 parts by weight of a modified cross-section glass fiber (B); and 25 to 150 parts by weight of a non-fibrous inorganic filler (C) satisfying the following (C-a) and (C-b): (C-a) having a Mohs hardness of more than 2 and less than 4, and (C-b) having a melting point or softening point of 380° C. or more; wherein the ratio X/Y of the mass X of the modified cross-section glass fiber (B) to the mass Y of the non-fibrous inorganic filler (C) is more than 1 and less than 7.Type: ApplicationFiled: March 19, 2020Publication date: January 13, 2022Inventors: Keita Tokuzumi, Kazuya Okubo
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Publication number: 20200254964Abstract: A pretensioner includes a wire having one end connectable to webbing that restrains an occupant of a vehicle; a piston connected to another end of the wire; a cylinder that slidably accommodates the piston; a housing through which the wire passes and that holds the cylinder; and a gas generator that supplies gas to the piston through a gas chamber within the housing, the gas being for operating the piston in a retraction direction of the wire. The piston includes, at one end of a gas chamber side, a cylindrical portion that extends in an axial direction of the piston, and an initial volume of the gas chamber is adjusted by adjusting a volume of an inner space of the cylindrical portion.Type: ApplicationFiled: September 5, 2018Publication date: August 13, 2020Inventors: Kazuya OKUBO, Shigeru KOHAMA
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Publication number: 20200247028Abstract: Provided are: a pipe-shaped integrally molded article which is formed by molding a polyphenylene sulfide resin composition, and which has, at one or more portions thereof, at least one selected from different-shape sections, bent sections, and different-diameter sections, the pipe-shaped integrally molded article being characterized in that the total length L (mm) thereof is 1000 or more, and the ratio (L/D) of the total length L (mm) to the outer diameter D (mm) of the pipe-shaped integrally molded article is 20 or more: and a production method for the pipe-shaped integrally molded article. According to the present invention, it is possible to efficiently provide a pipe-shaped integrally molded article having a desired large length and including a three-dimensionally complicated shape, by using a PPS resin composition having excellent heat resistance and chemical resistance.Type: ApplicationFiled: January 10, 2019Publication date: August 6, 2020Applicant: TORAY INDUSTRIES, INC.Inventors: Yuki SUZUKI, Rei SATO, Kazuya OKUBO
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Publication number: 20200194261Abstract: Embodiments are described herein to reshape spacer profiles to improve spacer uniformity and thereby improve etch uniformity during pattern transfer associated with self-aligned multiple-patterning (SAMP) processes. For disclosed embodiments, cores are formed on a material layer for a substrate of a microelectronic workpiece. A spacer material layer is then formed over the cores. Symmetric spacers are then formed adjacent the cores by reshaping the spacer material layer using one or more directional deposition processes to deposit additional spacer material and using one or more etch process steps. For one example embodiment, one or more oblique physical vapor deposition (PVD) processes are used to deposit the additional spacer material for the spacer profile reshaping. This reshaping of the spacer profiles allows for symmetric spacers to be formed thereby improving etch uniformity during subsequent pattern transfer processes.Type: ApplicationFiled: March 12, 2019Publication date: June 18, 2020Inventors: Akiteru Ko, Kazuya Okubo, Hiroyuki Toshima
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Publication number: 20190081032Abstract: First diodes being gate-type diodes are arrayed in a lateral direction, and each configured including a gate electrode and a p-type region and an n-type region on both sides of the gate electrode. Second diodes being STI-type diodes are arrayed in a longitudinal direction, and each configured including a p-type region and an n-type region and an STI element isolation structure between the p-type region and the n-type region. This configuration can surely prevent electrostatic breakdown even if a large surge current occurs while achieving lowered resistance and reduced occupied area of an ESD protection diode.Type: ApplicationFiled: November 8, 2018Publication date: March 14, 2019Inventor: Kazuya OKUBO
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Method for measuring resistance of conveyor belt to getting over support roller, and device therefor
Patent number: 9823180Abstract: An evaluation subject formed by a cut sample of a conveyor belt is mounted on a flat substrate with an inner periphery-side cover rubber layer located on the upper side, a support roller mounted in a frame is horizontally pulled and rolled in the longitudinal direction of the evaluation subject by pulling the frame by a wire while the support roller is pressed vertically downward against the upper surface of the evaluation subject at a preset pressure using a pneumatic cylinder without substantial deformation of the outer peripheral surface thereof, and tensile force in a horizontal direction measured at this time by a tensile force sensor connected to the wire is evaluated as resistance to moving over the support roller.Type: GrantFiled: June 12, 2013Date of Patent: November 21, 2017Assignee: The Yokohama Rubber Co., LTD.Inventors: Shigehiko Amano, Gang Hou, Toru Fujii, Kazuya Okubo -
Patent number: 9551068Abstract: A film forming method includes supplying a first source gas containing a first metal element onto a substrate, supplying a second source gas containing a second metal element onto the substrate, supplying a reaction gas converted into plasma and containing a nonmetal element reacting with the first metal element and the second metal element to generate a first reaction product and a second reaction product, respectively, to the substrate, to generate a third reaction product containing the first metal element, the second metal element and the nonmetal element. A mixing ratio of the first metal element contained in the third reaction product is higher than that of the second metal element, and a crystallization temperature of the second reaction product is higher than that of the first reaction product.Type: GrantFiled: April 23, 2015Date of Patent: January 24, 2017Assignee: TOKYO ELECTRON LIMITEDInventors: Takeshi Kumagai, Muneyuki Otani, Kazuya Okubo
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Patent number: 9188177Abstract: A brake disc is provided capable of effectively reducing the generation of noise such as brake noise by making specifications relating to lightening holes different from each other between two brake disc plates. In the brake disc, two brake disc plates are laminated so as to slide on each other by vibration during braking, and specifications relating to one or more selected from lightening holes, plate thickness, diameter, and warpage are made different from each other between the brake disc plates. In addition, lightening holes are formed on at least one of the brake disc plates, and one or more specifications selected from the number of lightening holes, the shapes of the lightening holes, the sizes of the lightening holes, and the arrangement positions of the lightening holes are made different from each other between the brake disc plates.Type: GrantFiled: February 16, 2012Date of Patent: November 17, 2015Assignees: SUNSTAR ENGINEERING INC., THE DOSHISHAInventors: Toru Fujii, Kazuya Okubo, Kiyotaka Obunai, Yoshihisa Kubota, Hideaki Okada, Tsuyoshi Nakatsuji
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Publication number: 20150315705Abstract: A film forming method includes supplying a first source gas containing a first metal element onto a substrate, supplying a second source gas containing a second metal element onto the substrate, supplying a reaction gas converted into plasma and containing a nonmetal element reacting with the first metal element and the second metal element to generate a first reaction product and a second reaction product, respectively, to the substrate, to generate a third reaction product containing the first metal element, the second metal element and the nonmetal element. A mixing ratio of the first metal element contained in the third reaction product is higher than that of the second metal element, and a crystallization temperature of the second reaction product is higher than that of the first reaction product.Type: ApplicationFiled: April 23, 2015Publication date: November 5, 2015Inventors: Takeshi KUMAGAI, Muneyuki OTANI, Kazuya OKUBO
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Method for Measuring Resistance of Conveyor Belt to Getting Over Support Roller, and Device Therefor
Publication number: 20150241332Abstract: An evaluation subject formed by a cut sample of a conveyor belt is mounted on a flat substrate with an inner periphery-side cover rubber layer located on the upper side, a support roller mounted in a frame is horizontally pulled and rolled in the longitudinal direction of the evaluation subject by pulling the frame by a wire while the support roller is pressed vertically downward against the upper surface of the evaluation subject at a preset pressure using a pneumatic cylinder without substantial deformation of the outer peripheral surface thereof, and tensile force in a horizontal direction measured at this time by a tensile force sensor connected to the wire is evaluated as resistance to moving over the support roller.Type: ApplicationFiled: June 12, 2013Publication date: August 27, 2015Applicant: The Yokohama Rubber Co., Ltd.Inventors: Shigehiko Amano, Gang Hou, Toru Fujii, Kazuya Okubo -
Patent number: 9074096Abstract: The invention provides a polyphenylene sulfide resin composition including: 1 to 100 parts by weight of an olefin elastomer (B); and 0.01 to 10 parts by weight of a carboxylic acid amide wax mixture (C), relative to 100 parts by weight of a polyphenylene sulfide resin (A), wherein the carboxylic acid amide wax mixture (C) is obtained by adding 0.01 to 5 parts by weight of an antioxidant to 100 parts by weight of a carboxylic acid amide wax produced by reaction of a higher aliphatic monocarboxylic acid, a polybasic acid and a diamine.Type: GrantFiled: June 22, 2012Date of Patent: July 7, 2015Assignee: TORAY INDUSTRIES, INC.Inventors: Kazuya Okubo, Atsushi Ishio, Yuki Ota