Abstract: A ceramic electronic component includes a ceramic body and an internal electrode layers disposed within the ceramic body. The ceramic body is covered with a diffusion layer, wherein said diffusion layer is an oxide layer into which at least a part of elements contained in the ceramic body are diffused and is located closer to a surface of the ceramic body than an outermost internal electrode layer.

Abstract: The present invention aims to provide a method for manufacturing a multilayer electronic component capable to remove a multilayer body very easily from the press mold without breaking the multilayer body when removing a green sheet multilayer body applied with a pressure from the press mold, furthermore has no waste of material, contributes to the environment conservation, and also easy to automate. Among the plurality of green sheets constituting a multilayer body 4a, the adhesive force of at least one of the outer green sheet 14a1 contacting to the lower mold 20 of the press mold 20 is made weaker compared to that of other green sheet 14a2, 10a, 14a3, and 14a4 of which are stacked with said outer green sheet 14a1. Next, a pressure is applied to the multilayer body 4a on the lower mold 20 of the press mold. Then, the press mold 25 is removed from the multilayer body 4a which is applied with the pressure.

Abstract: A ceramic electronic component has a chip element body having a conductor arranged inside, external electrodes, and a discrimination layer. The chip element body has first and second end faces facing each other, first and second side faces being perpendicular to the first and second end faces and facing each other, and third and fourth side faces being perpendicular to the first and second end faces and to the first and second side faces and facing each other. The external electrodes are formed on the first and second end faces, respectively, of the chip element body. The discrimination layer is provided on at least one side face out of the first side face and the second side face in the chip element body. The chip element body is comprised of a first ceramic. The discrimination layer is comprised of a second ceramic different from the first ceramic and has a color different from that of the third and fourth side faces.

Abstract: A ceramic green sheet structure has a ceramic green sheet including at least a ceramic material and a resin and a conductive layer formed on the ceramic green sheet. An electrode non-formed area has a porosity equal to or greater than 17%, and preferably, equal to or less than 25%. Moreover, an electrode formed area where the conductive layer is formed may have a smaller porosity than the electrode non-formed area where no conductive layer is formed.

Abstract: A ceramic electronic component includes a ceramic body and an internal electrode layers disposed within the ceramic body. The ceramic body is covered with a diffusion layer, wherein said diffusion layer is an oxide layer into which at least a part of elements contained in the ceramic body are diffused and is located closer to a surface of the ceramic body than an outermost internal electrode layer.

Abstract: A method of making a multilayer electronic component which can further improve a withstand voltage characteristic is provided. In the method of making a multilayer capacitor in accordance with the present invention, a sheet multilayer body is formed in a multilayer body forming step by laminating a plurality of electrode sheets and blank sheets formed in a sheet forming step. The sheet multilayer body is fired in a firing step, whereby a multilayer capacitor is obtained. The sheet multilayer body includes one blank sheet interposed between the electrode sheets. Namely, two green sheets are interposed between electrode patterns of the electrode sheets, whereby the green sheet thickness is substantially increased. The inventors have newly found that increasing the green sheet thickness by making the sheet multilayer body have such a structure is effective in improving the withstand voltage characteristic.

Abstract: A laminated ceramic capacitor C has a plurality of internal electrodes embedded in a dielectric base substance in a stratified manner, the internal electrodes are caused to conduct to a pair of terminal electrodes provided on an outer surface of the dielectric base substance, and the terminal electrode has an outermost layer containing Sn as a main component. There is provided a step of setting the laminated ceramic capacitor in a temperature environment which is not less than 125° C. and not more than 180° C. and applying a direct-current voltage between the terminal electrodes in order to measure a direct-current insulation resistance. The step of applying the direct-current voltage includes a first step and a second step. A direct-current voltage V1 (V/?m) which falls within a range of 20 to 40 (V/?m) is applied at the first step, and a direct-current voltage V2 (V) with a rated voltage being taken into consideration is applied at the second step after termination of the first step.

Abstract: A laminated ceramic capacitor C has a plurality of internal electrodes embedded in a dielectric base substance in a stratified manner, the internal electrodes are caused to conduct to a pair of terminal electrodes provided on an outer surface of the dielectric base substance, and the terminal electrode has an outermost layer containing Sn as a main component. There is provided a step of setting the laminated ceramic capacitor in a temperature environment which is not less than 125° C. and not more than 180° C. and applying a direct-current voltage between the terminal electrodes in order to measure a direct-current insulation resistance. The step of applying the direct-current voltage includes a first step and a second step. A direct-current voltage V1 (V/?m) which falls within a range of 20 to 40 (V/?m) is applied at the first step, and a direct-current voltage V2 (V) with a rated voltage being taken into consideration is applied at the second step after termination of the first step.