Abstract: A pressure sensitive adhesive sheet according to the present invention is a resin laminate, including a high thermally shrinkable base layer having relatively high thermal shrinkage ratio, having a ratio (A:B) of the thermal shrinkage ratio in a main shrinkage direction [A (%)] to the shrinkage ratio in a direction perpendicular to the main shrinkage direction [B (%)] of 1:1 to 10:1, and a low thermally shrinkable base layer having relatively low thermal shrinkage ratio, the high and low thermally shrinkable base layers bonded to each other via a self-adhesive layer, wherein the resin laminate bends toward the high thermally shrinkable base layer side when heated from any one direction and can automatically curl from one terminal unidirectionally to form a tubular roll by further heating. The pressure sensitive adhesive sheet can be separated from an adherend smoothly when heated from any one direction.

Abstract: A heat-peelable pressure-sensitive adhesive sheet comprises: a base material; and a thermo-expandable pressure-sensitive adhesive layer containing thermo-expandable microspheres, the thermo-expandable pressure-sensitive adhesive layer having a surface to be adhered to an adherend, wherein the surface of the thermo-expandable pressure-sensitive adhesive layer before subjecting to heating has a centerline average roughness of greater than 0.4 ?m, and has a convex portion resulting from the thermo-expandable microspheres.

Abstract: To provide a heat-peelable pressure-sensitive adhesive sheet which, even when applied to a flexible adherend or extremely small adherend, enables the adherend to be efficiently peeled and recovered therefrom without breakage. The heat-peelable pressure-sensitive adhesive sheet includes a substrate, and arranged on one side thereof in the following order, an intermediate layer having a thickness “A”, and a heat-peelable pressure-sensitive adhesive layer having a thickness “B” and containing heat-expandable microspheres with a largest particle diameter “C”. The parameters A, B, and C satisfy the following conditions: C?(A+B)?60 (?m) and 0.25C?B?0.8C, and the heat-peelable pressure-sensitive-adhesive layer, when subjected to a heating treatment, shows an adhesive strength of less than 0.1 N/20 mm after the heating treatment.

Abstract: A thermally strippable double faced adhesive sheet comprising a substrate, a thermally strippable pressure-sensitive adhesive layer (A) arranged on one side of the substrate, and a pressure-sensitive adhesive layer (B) arranged on the other side of the substrate, in which the substrate comprises a porous substrate. The porous substrate preferably has a density of 0.9 g/cm3 or less and a tensile elastic modulus of 20 MPa or less. The substrate may comprise a laminate of the porous substrate and a non-porous substrate. Exemplary usable adhesives for the pressure-sensitive adhesive layer (B) include pressure-sensitive adhesives, ultraviolet-curable pressure-sensitive adhesives, thermally strippable pressure-sensitive adhesives, thermoplastic pressure-sensitive adhesives, and thermosetting pressure-sensitive adhesives.

Abstract: The re-peelable pressure-sensitive adhesive sheet of the invention is a re-peelable pressure-sensitive adhesive sheet, which comprises an adhesive layer formed over a base film, and which further comprises at least one intermediate layer between the base film and the adhesive layer, the intermediate layer having a storage elastic modulus (G?) of 3.0×104 to 1.0×108 Pa at 23° C. and a storage elastic modulus (G?) of 1.0×103 to 8.0×104 Pa at 200° C.

Abstract: A heat-peelable double-faced pressure-sensitive adhesive sheet which comprises a substrate (a), a heat-peelable pressure-sensitive adhesive layer (b) formed on one side of the substrate (a) and containing heat-expandable microspheres, and a pressure-sensitive adhesive layer (c) formed on the other side of the substrate (a), wherein the heat-peelable pressure-sensitive adhesive layer (b) and the substrate (a) are peelable from each other by heating.

Abstract: The present invention relates to a self-rolling pressure-sensitive adhesive sheet, comprising a shrinkable film layer which is contractible in at least one axial direction; a restriction layer restricting a contraction of the shrinkable film layer, the restriction layer being disposed on a side of the shrinkable film layer; and a pressure-sensitive adhesive layer disposed on the side of the restriction layer which is opposite to the side on which the shrinkable film layer is disposed, the self-rolling pressure-sensitive adhesive sheet being a releasable pressure-sensitive adhesive sheet, in which the pressure-sensitive adhesive layer or the pressure-sensitive adhesive layer after an adhesiveness decreasing treatment has a pressure-sensitive adhesive power (180° peeling, against a silicon mirror wafer, tensile speed: 300 mm/min) of 6.

Abstract: The present invention relates to a method for attaching and peeling a pressure-sensitive adhesive sheet including: attaching on a semiconductor wafer a pressure-sensitive adhesive sheet having a heat shrinkable material having a heat shrinkability in at least a uniaxial direction, a restriction layer having a property of opposing a shrinkage deformation of the heat shrinkable material, and an energy-beam-curable pressure-sensitive adhesive layer laminated in this order; subjecting the semiconductor wafer on which the pressure-sensitive adhesive sheet is attached to a predetermined treatment, followed by irradiating the semiconductor wafer with an energy beam to thereby cure the pressure-sensitive adhesive layer; and heating the pressure-sensitive adhesive sheet after the curing of the pressure-sensitive adhesive layer to thereby peeling off the pressure-sensitive adhesive sheet from the semiconductor wafer, in which, in the attaching process, the pressure-sensitive adhesive sheet is attached on the semiconduc

Abstract: The present invention relates to a heat-resistant dicing tape or sheet, which includes a substrate having a glass transition temperature of 70° C. or higher; and at least one pressure-sensitive adhesive layer disposed on at least one side of the substrate, the pressure-sensitive adhesive layer having a degree of weight loss upon heating of less than 2% when the pressure-sensitive adhesive layer is heated from room temperature to 200° C. at a rate of temperature increase of 2° C./min, in which the pressure-sensitive adhesive layer has an adhesive force (peel rate: 300 mm/min; peel angle: 180°) of 0.5 N/20 mm or lower when the heat-resistant dicing tape or sheet is applied to a silicon mirror wafer, is subsequently heated at 200° C. for 30 seconds, and is then cooled to 23° C.

Abstract: The present invention relates to an adhesive sheet including a substrate and, an adherent layer containing heat-expandable microspheres, the adherent layer being disposed on at least one side of the substrate, in which the adherent layer has a thickness of 10 to 38 ?m, and wherein the heat-expandable microspheres have a maximum particle diameter equal to or smaller than the thickness of the adherent layer and have a mode diameter of 5 to 30 ?m. The adhesive sheet of the invention enables a high-accuracy processing in the step of processing an electronic part such as a small ceramic capacitor to thereby greatly improve product characteristics and productivity.

Abstract: Provided is a method for working an object which includes sticking the object fixed onto a supporting plate through a double faced pressure-sensitive adhesive sheet having a heat-peelable or radial ray curable pressure-sensitive adhesive layer onto a dicing adhesive tape, heating the double faced pressure-sensitive adhesive sheet or irradiating the double faced pressure-sensitive adhesive sheet, thereby removing the double faced pressure-sensitive adhesive sheet and the supporting plate from the object, dicing the object, on which the dicing pressure-sensitive adhesive sheet is stuck, and picking up a piece of the object, wherein the dicing pressure-sensitive adhesive sheet contains a substrate film and a pressure-sensitive adhesive layer formed over the film wherein the pressure-sensitive adhesive layer contains an acrylic polymer containing 5% or more by weight of a monomer having, in its side chain, an alkoxyl group, and the thickness of the pressure-sensitive adhesive layer is 1 to 50 ?m.

Abstract: A method of overheating and releasing a chip cut piece from a thermal release type pressure sensitive adhesive sheet is a method by which a chip cut piece stuck onto a thermal release type pressure sensitive adhesive sheet having a base material, and a thermally expandable microsphere-containing thermally expandable pressure sensitive adhesive layer provided on a surface of the base material is thermally released from the thermal release type pressure sensitive adhesive sheet and which is characterized by including the step of overheating while restraining the overheat and release type pressure sensitive adhesive sheet to thereby release the chip cut piece. A means for restraining the thermal release type pressure sensitive adhesive sheet may be an absorption means using suction or may be a bonding means using an adhesive agent.

Abstract: A heat-peelable adhesive sheet which shows small increase in the degree of contamination caused by a heat treatment for lowering an adhesive force is disclosed. The heat-peelable pressure sensitive adhesive sheet comprises a heat-expandable layer containing heat-expandable microspheres and expanding upon heating, and a non-heat expandable pressure-sensitive adhesive layer formed on at least one side thereof. The heat-peelable pressure-sensitive adhesive sheet can achieve the desired adhesive properties such as an excellent adhesive force before heating and also show a quick lowering of the adhesive force upon heating. Further, it shows small increase in the degree of contamination due to the treatment for lowering the adhesive force. Due to those characteristics, the heat-peelable pressure-sensitive adhesive sheet is practically applicable to, for example, the production of electronic parts made of thinner semiconductor wafers.

Abstract: A heat-peelable adhesive sheet which comprises a substrate and, formed on at least one side thereof, a heat-expandable layer containing heat-expandable microspheres and an adhesive layer comprising an adhesive substance and in which the substrate has heat resistance and stretchability can be used to cut an adherend so as to form and secure a sufficient space between the resultant cut pieces and can withstand a heat treatment for expanding the heat-expandable layer. Consequently, the adhesive sheet can heighten the operating efficiency and working efficiency in the step of separating and recovering the cut pieces.

Abstract: A heat-peelable pressure-sensitive adhesive sheet which ensures an efficient contact area even in case where the area of an adherend to be adhered is decreased and thus makes it possible to avoid adhesion failures such as chip-scattering or chipping. The heat-peelable pressure-sensitive adhesive sheet comprises a substrate and a heat-expandable pressure-sensitive adhesive layer containing heat-expandable microspheres, formed on at least one side of the substrate, wherein the surface of the heat-expandable pressure-sensitive adhesive layer before heating has a center line average roughness of 0.4 ?m or less.

Abstract: An energy-beam-curable thermal-releasable pressure-sensitive adhesive sheet having, on at least one side of a base material, an energy-beam-curable thermo-expandable viscoelastic layer containing thermo-expandable microspheres and a pressure-sensitive adhesive layer stacked in this order. The pressure-sensitive adhesive layer has a thickness of about 0.1 to 10 ?m and can be formed from a pressure-sensitive adhesive. The energy-beam-curable thermo-expandable viscoelastic layer, on the other hand, can be formed from a tacky substance. The energy-beam-curable thermal-releasable pressure-sensitive adhesive sheet according to the invention has adhesion enough to withstand a carrying step of an adherend, causes neither winding up of the adhesive nor chipping upon cutting and facilitates peeling and collection of cut pieces after cutting. In addition, it exhibits low contamination on the adherend after peeling.

Abstract: According to the invention, a pressure-sensitive adhesive sheet for use in dicing of a workpiece is provided which comprises a base film and at least a pressure-sensitive adhesive layer provided on the base film, wherein the pressure-sensitive adhesive layer comprises an acrylic polymer that contains at least 5% by weight of a monomer unit having an alkoxyl group in its side chain. According to the structure, there are provided a pressure-sensitive adhesive sheet for dicing that can produce good pickup performance even after a long time and a method of picking up a product worked with the pressure-sensitive adhesive sheet.

Abstract: A heat-peelable adhesive sheet which comprises a substrate and, formed on at least one side thereof, a heat-expandable layer containing heat-expandable microspheres and an adhesive layer comprising an adhesive substance and in which the substrate has heat resistance and stretchability can be used to cut an adherend so as to form and secure a sufficient space between the resultant cut pieces and can withstand a heat treatment for expanding the heat-expandable layer. Consequently, the adhesive sheet can heighten the operating efficiency and working efficiency in the step of separating and recovering the cut pieces.

Abstract: An energy-beam-curable thermal-releasable pressure-sensitive adhesive sheet has, on at least one side of a base material, an energy-beam-curable viscoelastic layer and a thermo-expandable pressure-sensitive adhesive layer containing thermo-expandable microspheres stacked in this order. The energy-beam-curable viscoelastic layer is, for example, composed of a composition of an organic viscoelastic body and an energy-beam-curable compound or an energy-beam-curable resin. The energy-beam-curable viscoelastic layer has a thickness of about 5 to 300 ?m or may be not greater than the maximum particle size of the thermo-expandable microspheres. The energy-beam-curable thermal-releasable pressure-sensitive adhesive layer according to the invention has adhesion enough to withstand a carrying step of an adherend, causes neither winding up of the adhesive nor chipping upon cutting and facilitates peeling and collection of cut pieces after cutting.

Abstract: A heat-peelable pressure-sensitive adhesive sheet which, even when used for temporarily fixing electronic parts having poor resistance to static electricity, such as magnetic heads, is effective in preventing the yield of such electronic parts from being reduced by electrostatic breakage, while ensuring its functions of adhesiveness before heating and peelability after heating. The heat-peelable pressure-sensitive adhesive sheet comprises a substrate and formed on at least one side thereof a heat-expandable pressure-sensitive adhesive layer containing heat-expandable microspheres, wherein the heat-expandable pressure-sensitive adhesive layer has a surface resistivity of 1012 ?/? or lower. In this heat-peelable pressure-sensitive adhesive sheet, the heat-expandable pressure-sensitive adhesive layer before heating may have a center line average surface roughness of 2 ?m or less and a maximum surface roughness of 5 ?m or less.