Patents by Inventor Kazuyuki Mikubo

Kazuyuki Mikubo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8698010
    Abstract: Resistivity to dust and cooling performance are improved by a simple structure. Electronic apparatus (image display apparatus) 1 includes: housing 31 that forms sealed inner space 33; circuit unit 39 that is provided in inner space 33; first partition plate 34 that is provided in inner space 33 and that has upper/lower partition portion 7, wherein upper/lower partition portion 7 at least partially extends in a lateral direction extending above at least a part of circuit unit 39 and that terminates in front of both lateral sides of housing 31; and first fan 5, 6 that is provided through upper/lower partition portion 7.
    Type: Grant
    Filed: April 10, 2009
    Date of Patent: April 15, 2014
    Assignee: NEC Corporation
    Inventors: Hitoshi Sakamoto, Kazuyuki Mikubo, Takeya Hashiguchi
  • Patent number: 8514364
    Abstract: Provided is a highly reliable liquid crystal display device that prevents the penetration of a flying dust and dirt in the outside air. A liquid crystal display device (1) having a display unit housing case (2) configured to house a light source unit and a display unit, and an electronic component housing case (3) configured to house an electronic component. The liquid crystal display device (1) is tightly closed and externally disposed with heat radiation fins (6a and 6b).
    Type: Grant
    Filed: May 21, 2009
    Date of Patent: August 20, 2013
    Assignee: NEC Corporation
    Inventors: Kazuyuki Mikubo, Takeya Hashiguchi, Hitoshi Sakamoto
  • Patent number: 8264659
    Abstract: A liquid crystal display device includes a sealed housing part, a liquid crystal display part disposed at the front face of the housing part, a light source part housed in the housing part to generate the light to be displayed on the liquid crystal display part, an electric power supply part housed in the housing part to perform electric power supply, a control part housed in the housing part to perform control, and a heat exchange part disposed at the rear face of the housing part to cool the heat generated in the housing part. The heat exchange part includes an air stirring part for stirring the air in the housing part, a forced air cooling part covered with a duct in which the air stirring part is installed and constructed from a plate extending into the housing part, and a natural air cooling part constructed from a plate extending to the outside of the housing part. The forced air cooling part and the natural air cooling part are integrated with a rear face plate of the housing part.
    Type: Grant
    Filed: March 19, 2009
    Date of Patent: September 11, 2012
    Assignee: NEC Corporation
    Inventors: Kazuyuki Mikubo, Takeya Hashiguchi, Hitoshi Sakamoto
  • Publication number: 20110114384
    Abstract: Resistivity to dust and cooling performance are improved by a simple structure. Electronic apparatus (image display apparatus) 1 includes: housing 31 that forms sealed inner space 33; circuit unit 39 that is provided in inner space 33; first partition plate 34 that is provided in inner space 33 and that has upper/lower partition portion 7, wherein upper/lower partition portion 7 at least partially extends in a lateral direction extending above at least a part of circuit unit 39 and that terminates in front of both lateral sides of housing 31; and first fan 5, 6 that is provided through upper/lower partition portion 7.
    Type: Application
    Filed: April 10, 2009
    Publication date: May 19, 2011
    Applicant: NEC CORPORATION
    Inventors: Hitoshi Sakamoto, Kazuyuki Mikubo, Takeya Hashiguchi
  • Publication number: 20110116016
    Abstract: Provided is a highly reliable liquid crystal display device that prevents the penetration of a flying dust and dirt in the outside air. A liquid crystal display device (1) having a display unit housing case (2) configured to house a light source unit and a display unit, and an electronic component housing case (3) configured to house an electronic component. The liquid crystal display device (1) is tightly closed and externally disposed with heat radiation fins (6a and 6b).
    Type: Application
    Filed: May 21, 2009
    Publication date: May 19, 2011
    Applicant: NEC Corporation
    Inventors: Kazuyuki Mikubo, Takeya Hashiguchi, Hitoshi Sakamoto
  • Publication number: 20110001898
    Abstract: A liquid crystal display device includes a sealed housing part, a liquid crystal display part disposed at the front face of the housing part, a light source part housed in the housing part to generate the light to be displayed on the liquid crystal display part, an electric power supply part housed in the housing part to perform electric power supply, a control part housed in the housing part to perform control, and a heat exchange part disposed at the rear face of the housing part to cool the heat generated in the housing part. The heat exchange part includes an air stirring part for stirring the air in the housing part, a forced air cooling part covered with a duct in which the air stirring part is installed and constructed from a plate extending into the housing part, and a natural air cooling part constructed from a plate extending to the outside of the housing part. The forced air cooling part and the natural air cooling part are integrated with a rear face plate of the housing part.
    Type: Application
    Filed: March 19, 2009
    Publication date: January 6, 2011
    Applicant: NEC Corporation
    Inventors: Kazuyuki Mikubo, Takeya Hashiguchi, Hitoshi Sakamoto
  • Publication number: 20100065260
    Abstract: There is provided an energy-saving vibration generating and cooling apparatus with a small volume in which convection is created inside and outside its cabinet and which can effectively transfer heat. It includes a motor 4, a magnetic vibrator 1 mounted onto a rotary shaft of the motor 4, and a piston 5 indicating magnetism disposed physically apart from the vibrator 1; and the piston 5 repeatedly approaches and leaves the vibrator 1 in association with rotations of the vibrator 1 such that a heat generating element is cooled by a synthetic jet 7 created by the movement of the piston 5.
    Type: Application
    Filed: February 21, 2008
    Publication date: March 18, 2010
    Inventors: Hitoshi Sakamoto, Kazuyuki Mikubo, Takeya Hashiguchi
  • Publication number: 20100025019
    Abstract: Behavior of a vapor bubble that emerges should be controlled to improve operational stability and reliability of a phase shift heat exchanger having a microchannel. The heat exchanger has a dual layer structure and includes a material that is elastically deformed according to pressure difference between the layers. The layers are connected, and at the connection interface a resistance unit that exerts a predetermined resistance against a coolant flowing from the coolant supplying layer toward the microchannel layer is provided, to maintain internal pressure of the coolant supplying layer higher than that of the microchannel, under a normal operation. Once a vapor bubble emerges, the relationship in strength of the internal pressure is turned over, and the elastic material is lifted so that the vapor bubble is dividedly distributed over a plurality of microchannels.
    Type: Application
    Filed: December 3, 2007
    Publication date: February 4, 2010
    Inventors: Hitoshi Sakamoto, Kazuyuki Mikubo, Sakae Kitajo
  • Publication number: 20100012299
    Abstract: According to the present invention, there is provided a heat exchanger unit having, over a base, a surface-modified portion composed of a metal, the surface-modified portion being brought into contact with a flow path provided for a liquid refrigerant, wherein the liquid refrigerant is a liquid having a surface tension smaller than that of water, and the surface-modified portion has a porous structure, in which a plurality of recesses are provided on the flow path side thereof, each recess has an introduction path having a cross-section area gradually reduced from the inlet of the recess, and a cavity communicated with the introduction path while placing an inflection portion in between, and the shortest distance between the inflection portion and the flow path is larger than the shortest distance between the cavity and the flow path.
    Type: Application
    Filed: January 15, 2008
    Publication date: January 21, 2010
    Applicant: NEC CORPORATION
    Inventors: Hitoshi Sakamoto, Kazuyuki Mikubo, Sakae Kitajo
  • Patent number: 7483261
    Abstract: A cooling device includes a cooling panel wherein a passage is formed by bonding together a bottom heat radiation plate having a groove formed therein and a top heat radiation plate, and a circulation pump circulating refrigerant within the passage. The top heat radiation plate is provided with an outlet port through which the refrigerant flows out from the passage to the circulation pump and an inlet port through which the refrigerant flows in from the circulation pump to the passage. The circulation pump is fixed onto the top heat radiation plate of the cooling panel so that the suction port and discharge port are aligned with the outlet port and inlet port, respectively.
    Type: Grant
    Filed: June 25, 2004
    Date of Patent: January 27, 2009
    Assignee: NEC Corporation
    Inventors: Kazuyuki Mikubo, Sakae Kitajo, Atsushi Ochi, Mitsuru Yamamoto
  • Patent number: 7420807
    Abstract: The present invention provides a cooling apparatus which is easy to build and to fix it to electronic devices, superior in thermal conduction and heat dissipation, and possible to make thin the total configuration of the apparatus. The liquid cooling unit 9 and the air cooling unit 12 are formed in a unit. A heat absorption surface 19 of the liquid cooling unit 9 is contacted or bonded to the heat generation component such as the CPU and the heat generator, which have the largest power consumption and also locally generate heat within a small area in the box 2. In the liquid cooling unit 9, a liquid cooling pump 14 composed of an electromagnetic pump is arranged for circulating the coolant in the flow path 10. The heat generated by the heat generation components such as CPU 6, heat generator 7, and the like is thermally diffused with heat conduction into the whole liquid cooling unit 9 by circulating the coolant with the liquid cooling pump 14.
    Type: Grant
    Filed: August 18, 2003
    Date of Patent: September 2, 2008
    Assignee: NEC Corporation
    Inventors: Kazuyuki Mikubo, Sakae Kitajo, Yasuhiro Sasaki, Atsushi Ochi, Mitsuru Yamamoto
  • Publication number: 20080110600
    Abstract: The present invention provides a cooling apparatus which is easy to build and to fix it to electronic devices, superior in thermal conduction and heat dissipation, and possible to make thin the total configuration of the apparatus. The liquid cooling unit 9 and the air cooling unit 12 are formed in a unit. A heat absorption surface 19 of the liquid cooling unit 9 is contacted or bonded to the heat generation component such as the CPU and the heat generator, which have the largest power consumption and also locally generate heat within a small area in the box 2. In the liquid cooling unit 9, a liquid cooling pump 14 composed of an electromagnetic pump is arranged for circulating the coolant in the flow path 10. The heat generated by the heat generation components such as CPU 6, heat generator 7, and the like is thermally diffused with heat conduction into the whole liquid cooling unit 9 by circulating the coolant with the liquid cooling pump 14.
    Type: Application
    Filed: November 28, 2007
    Publication date: May 15, 2008
    Applicant: NEC CORPORATION
    Inventors: Kazuyuki MIKUBO, Sakae KITAJO, Yasuhiro SASAKI, Atsushi OCHI, Mitsuru YAMAMOTO
  • Publication number: 20070006996
    Abstract: [Object] A cooling device for a thin electronic equipment having a larger heat radiation area and preventing leakage of refrigerant. [Means for Solving Problems] A cooling device includes first and second cooling panels (1, 2) wherein a passage (11, 21) is formed by bonding together a top heat radiation panel and a bottom heat radiation panel each having a groove therein, and a circulation pump (3) for circulating refrigerant within the passage (11, 21). In the top heat radiation panel of the second cooling panel (2) are formed an outlet port through which the refrigerant flows out from the passage (21) to the circulation pump (3) and an inlet port through which the refrigerant flows in from the circulation pump (3) to the passage (21). The circulation pump (3) is fixed onto the top heat radiation plate of the cooling panel (2) so that the suction port and discharge port are aligned with the outlet port and inlet port, respectively.
    Type: Application
    Filed: June 25, 2004
    Publication date: January 11, 2007
    Inventors: Kazuyuki Mikubo, Sakae Kitajo, Atsushi Ochi, Mitsuru Yamamoto
  • Publication number: 20060215715
    Abstract: A pair of opening portions are provided as an inlet port of refrigerant and an outlet port thereof, and refrigerant flow channels are formed left-right symmetrically in its plan view from one opening portion to the other opening portion. At the area adjusted to the area which is thermally connected to the heating element in the refrigerant flow channels, projections whose cross section thereof become smaller and smaller upward from the bottom surface of the refrigerant flow channels or downward from the upper surface, that is, widens toward the end, are formed. By joining the heat radiating plate having the projections formed therein to the other heat radiating plate, which is plate-shaped, together, a heat sink is assembled. Therefore, the heat sinks are excellent in terms of thermal conductivity and reliability, are produced at a low cost, and a laser module employing the same, a laser module apparatus, and a laser processing apparatus are obtainable.
    Type: Application
    Filed: February 18, 2004
    Publication date: September 28, 2006
    Inventors: Hikaru Kouta, Hisaya Takahashi, Kazuyuki Mikubo, Hideyuki Ono, Masaki Tsunekane, Toshinori Ishida, Keiichi Kubota
  • Publication number: 20060139882
    Abstract: A cooling device includes a cooling panel wherein a passage is formed by bonding together a bottom heat radiation plate having a groove formed therein and a top heat radiation plate, and a circulation pump circulating refrigerant within the passage. The top heat radiation plate is provided with an outlet port through which the refrigerant flows out from the passage to the circulation pump and an inlet port through which the refrigerant flows in from the circulation pump to the passage. The circulation pump is fixed onto the top heat radiation plate of the cooling panel so that the suction port and discharge port are aligned with the outlet port and inlet port, respectively.
    Type: Application
    Filed: June 25, 2004
    Publication date: June 29, 2006
    Inventors: Kazuyuki Mikubo, Sakae Kitajo, Atsushi Ochi, Mitsuru Yamamoto
  • Publication number: 20050231914
    Abstract: The present invention provides a cooling apparatus which is easy to build and to fix it to electronic devices, superior in thermal conduction and heat dissipation, and possible to make thin the total configuration of the apparatus. The liquid cooling unit 9 and the air cooling unit 12 are formed in a unit. A heat absorption surface 19 of the liquid cooling unit 9 is contacted or bonded to the heat generation component such as the CPU and the heat generator, which have the largest power consumption and also locally generate heat within a small area in the box 2. In the liquid cooling unit 9, a liquid cooling pump 14 composed of an electromagnetic pump is arranged for circulating the coolant in the flow path 10. The heat generated by the heat generation components such as CPU 6, heat generator 7, and the like is thermally diffused with heat conduction into the whole liquid cooling unit 9 by circulating the coolant with the liquid cooling pump 14.
    Type: Application
    Filed: August 18, 2003
    Publication date: October 20, 2005
    Inventors: Kazuyuki Mikubo, Sakae Kitajo, Yasuhiro Sasaki, Atsushi Ochi, Mitsuru Yamamoto
  • Patent number: 6670699
    Abstract: A semiconductor package comprising an LSI chip, a chip bump, an interposer, and a BGA bump is mounted at a predetermined position of a printed wiring board having a core layer. A heat sink for dissipating heat generated from the LSI chip is installed within the core layer. Further, heat radiating vias for conveying heat generated from the LSI chip to the heat sink are provided within the printed wiring board so that the BGA bump in the LSI chip is thermally liked with the heat sink. The heat generated from the LSI chip is mainly dissipated through a route of chip bump→interposer→BGA bump→heat radiating via→heat sink. By virtue of the above construction, the semiconductor device packaging structure can reduce the packaging volume of the heat sink while providing satisfactory cooling capacity and, at the same time, can minimize the length of signal wiring between LSI chips.
    Type: Grant
    Filed: March 4, 2002
    Date of Patent: December 30, 2003
    Assignee: NEC Corporation
    Inventors: Kazuyuki Mikubo, Sakae Kitajo, Yuzo Shimada
  • Patent number: 6611057
    Abstract: A semiconductor device includes two or more semiconductor modules which are stacked up into three-dimensional structure. Each semiconductor module includes a wiring board, one or more IC chips which are mounted on the wiring board, and one or more heat sinks which are attached to the IC chips via a thermal-conductive adhesive and are forcedly cooled by a coolant flowing through channels which are formed therein. The wiring board of each semiconductor module is provided with sockets having I/O pins and concavities. Electrical connection between adjacent semiconductor modules of the semiconductor device is established by inserting the I/O pins of the sockets of one semiconductor module into the concavities of the sockets of the other semiconductor module. The channels in the heat sink are implemented by a plurality of channel grooves which are generated between a plurality of fins which are formed in a cavity inside the heat sink at predetermined intervals.
    Type: Grant
    Filed: November 8, 2001
    Date of Patent: August 26, 2003
    Assignee: NEC Corporation
    Inventors: Kazuyuki Mikubo, Sakae Kitajo
  • Publication number: 20020185718
    Abstract: A semiconductor package comprising an LSI chip, a chip bump, an interposer, and a BGA bump is mounted at a predetermined position of a printed wiring board having a core layer. A heat sink for dissipating heat generated from the LSI chip is installed within the core layer. Further, heat radiating vias for conveying heat generated from the LSI chip to the heat sink are provided within the printed wiring board so that the BGA bump in the LSI chip is thermally liked with the heat sink. The heat generated from the LSI chip is mainly dissipated through a route of chip bump→interposer→BGA bump→heat radiating via→heat sink. By virtue of the above construction, the semiconductor device packaging structure can reduce the packaging volume of the heat sink while providing satisfactory cooling capacity and, at the same time, can minimize the length of signal wiring between LSI chips.
    Type: Application
    Filed: March 4, 2002
    Publication date: December 12, 2002
    Inventors: Kazuyuki Mikubo, Sakae Kitajo, Yuzo Shimada
  • Patent number: 6438504
    Abstract: The thermal resistance of an entire semiconductor package with a semiconductor chip and radiation fins is calculated based on thermal resistance of resin between the semiconductor chip and case, thermal resistance of the radiation fins, and thermal resistance of three heat radiation paths in the semiconductor package. One of said three heat radiation paths is passing through the bottom surface of the case. The other of said three radiation paths is passing through the leadframe. The other of three radiation paths is passing through sides of the case other than the leadframe.
    Type: Grant
    Filed: March 28, 2001
    Date of Patent: August 20, 2002
    Assignee: NEC Corporation
    Inventors: Kazuyuki Mikubo, Sakae Kitajo