Abstract: Bonding strength with which a substrate and an adhesive layer are bonded together to seal a piezoelectric vibrator on the substrate is enhanced. A piezoelectric vibration component includes a lid including a recess and a flange protruding outward from an opening edge of the recess. Moreover, the component includes a substrate having a first area opposing the recess and a second area opposing the flange. A piezoelectric vibrator is mounted on the first area, and an adhesive layer bonds the second area and the flange together to seal the piezoelectric vibrator in a space between the recess and the first area. The second area has surface roughness greater than surface roughness of the first area.

Abstract: A piezoelectric vibration component that includes a substrate having a principal surface and a side face, a piezoelectric vibrator, a lid, and an adhesive layer that hermetically seals the piezoelectric vibrator in a space between the lid and the principal surface. The adhesive layer extends from the principal surface to at least a portion of the side face of the substrate.

Abstract: A lid and an insulating bonding layer that seal a piezoelectric vibrator on a substrate are bonded with higher strength. A piezoelectric vibration component includes a substrate having a principal surface on which a piezoelectric vibrator is mounted, an insulating film disposed on the principal surface, a lid having a recess opening toward the principal surface and an edge portion around the recess. Moreover, first and second insulating bonding layers are interposed between the lid and the substrate. The first and second insulating bonding layers are joined together between the edge portion and the insulating film so as to seal the piezoelectric vibrator in a space between the recess and the principal surface.

Abstract: A crystal vibrator that includes a crystal substrate having a front surface and a rear surface, including a vibration portion in a region including a center of the crystal substrate, and a first peripheral portion that surrounds a periphery of the vibration portion and that has a smaller thickness than the vibration portion. Drive electrodes are formed on both surfaces of the vibration portion of the crystal substrate. In at least one of the front surface and the rear surface of the crystal substrate, a step is provided between the vibration portion and the first peripheral portion, and a first peripheral edge portion of the vibration portion and a second peripheral edge portion of the first peripheral portion are in a curved surface shape.

Abstract: In a chip-type piezoelectric-resonator, which is protected with thermosetting resin, mother sheets are bonded to cover both major surfaces of a mother substrate having a plurality of piezoelectric resonance elements which are provided on a piezoelectric substrate, in order to properly form vibrating spaces. The mother sheets are provided with concave portions for defining cavities for vibration. Then, protective resin is applied to cover the mother substrate which is bonded with the mother sheets, and thereafter the mother substrate is divided so as to obtain a plurality of chip-type piezoelectric-resonators.

Abstract: A piezoelectric resonator vibrating in the thickness shear-slide mode comprises an elongated ceramic piezoelectric substrate, first and second terminal electrodes formed on both end portions of a front major surface thereof and first and a second vibrating electrodes connected with the first and the second terminal electrodes through first and second extracting electrodes respectively. A third terminal electrode is formed on a central portion of a rear major surface of the substrate, while a third vibrating electrode is formed at a position opposite to the first and the second vibrating electrodes, so that the third terminal electrode is connected with the third vibrating electrode through a third extracting electrode. An auxiliary electrode extends from the third vibrating electrode toward a position opposed to the first terminal electrode.

Abstract: In a trap circuit a plurality of cascade-connected three-terminal piezoelectric ceramic resonators having different resonance frequencies, an inductor is connected between input and output terminals of only the resonator having the lowest resonance frequency, and a resistor is connected between input and output terminals of each remaining resonator, so that large attenuation is attained at the respective resonance frequencies and a large attenuation is attained in intermediate regions between the resonance frequencies. Thus, unwanted signals can be eliminated over a large bandwidth.