Abstract: At least one processor included in a server carries out: an acquiring process of acquiring, from a communication terminal configured to communicate with low earth orbit satellite equipment, information which indicates a communication condition in the communication terminal regarding communication with the low earth orbit satellite equipment; and a controlling process of referring to a radio wave map of a region including a location of the communication terminal and the information, to control an air vehicle configured to measure an attenuation of a radio wave between the air vehicle and the communication terminal.

Abstract: A control apparatus capable of exhibiting the diversity effect in a hybrid mobile communication system using a terrestrial communication apparatus and a non-terrestrial communication apparatus is provided.

Abstract: A pressure sensor generates an electrical output according to a fluid pressure in a detection space applied to a diaphragm. The diaphragm is flexibly deformable in a thickness direction. The pressure sensor includes a pressure receiving recess defining the detection space and a protection film covering the pressure receiving recess. The protection film has a corner portion provided in an inner corner area of the pressure receiving recess and a thin film portion having a uniform thickness. The corner portion is located outside the diaphragm in an in-plane direction orthogonal to the thickness direction.

Abstract: The present disclosure provides a pressure sensor configured to generate an electrical output according to a fluid pressure in a detection space applied to a diaphragm. The diaphragm is flexibly deformable in a thickness direction. The pressure sensor includes a pressure receiving recess defining the detection space and a protection film covering the pressure receiving recess. The protection film has a corner portion provided in an inner corner area of the pressure receiving recess. The corner portion is located outside the diaphragm in an in-plane direction orthogonal to the thickness direction.

Abstract: A semiconductor device has a semiconductor element having a base, a cavity having a polygonal horizontal cross-section penetrating vertically through the base, a diaphragm arranged on the base to cover the cavity, and a substrate formed with a die bonding pad. A lower surface of the semiconductor element is adhered on the die bonding pad with a die bonding resin. The die bonding pad is formed so as not to contact a lower end of a valley section formed by an intersection of wall surfaces of an inner peripheral surface of the cavity of the semiconductor element.

Abstract: An inner margin adjoining an inner lead is used as the innermost part of a conductive member made of a film conductor. The inner margin is held by a bobbin upon a winding a coil. Therefore, mutual displacement, or the like, between the film conductor, or the conductive member, and an insulation separator upon the coil-winding can be prevented.

Abstract: Distances between edges which are detected and paired from images which show a driver's face are computed sequentially. Based on a change in the computed distances, a low-probability candidate for a pair of eyelid edges is eliminated. The edge pairs ultimately remaining as a result thereof are detected as upper eyelid edge and lower eyelid edge pairings. It is thus possible to carry out a detection which takes into account not only a feature which is near to an eyelid edge, but also movement as an eyelid. Accordingly, it is possible to accurately detect edges of a driver's eyelids.

Abstract: A stage base includes a plate which supports a stage. The plate has a first structure and a second structure, and the first and second structures are coupled. The stage base further includes a component which is arranged on the plate and has a cooling unit, a coolant channel arranged to extend through the plate into the component, and a seal member arranged between the first structure and the second structure so as to surround the coolant channel, an interior and an exterior of the seal member being fastened with a fastener.

Abstract: A connecting pad producing method has a first process of projecting an insulating member in a surface of a base material such that a region where a connecting pad is formed is surrounded, a second process of forming a conductive layer in the surface of the base material such that the insulating member is coated with the conductive layer, and a third process of removing the conductive layer with which the insulating member is coated, exposing the insulating member over a whole periphery from the conductive layer, and forming the connecting pad including the conductive layer in a region surrounded by the insulating member. The conductive layer with which the insulating member is coated is removed so as not to reach the conductive layer surface in a region adjacent to the insulating member in the third process.

Abstract: The present invention relates to the rigidity of a backlight chassis and is applicable to a liquid crystal display device including a backlight chassis and a light source located in the backlight chassis. A liquid crystal display device according to the present invention includes a backlight chassis (24), located to face a rear surface of a liquid crystal panel (10), for supporting a light source (22) for illuminating the rear surface of the liquid crystal panel (10). The backlight chassis (24) is a substantively flat plate-like member with upright peripheral portions (24a through 24d), and includes grooves (71 through 74) in a first area (A1) and a second area (A2), which are separated from each other by a border line (L) set on the backlight chassis (24). According to the present invention, the entirety of the backlight chassis is unlikely to be deflected.

Abstract: An electronic component has a substrate, a die bonding pad provided on an upper surface of the substrate, a semiconductor element bonded onto the die bonding pad by a die bonding resin, a conductive pattern disposed adjacent to the die bonding pad, and a coating member covering the conductive pattern. At least an outer peripheral portion of a surface of the die bonding pad is made of an inorganic material. The inorganic material of the outer peripheral portion is exposed. The die bonding pad and the conductive pattern are separated by an air gap such that the coating member does not come into contact with the die bonding pad.

Abstract: An electrostatic capacitive vibration sensor has a substrate, a through-hole, a vibrating electrode plate, and a fixed electrode plate opposite the vibrating electrode plate. The fixed electrode plate is subjected to vibration to perform membrane oscillation. Pluralities of acoustic holes are made in the fixed electrode plate. The vibrating and fixed electrode plate are disposed on a surface side of the substrate such that an opening on the surface side of the through-hole is covered. A lower surface of an outer peripheral portion of the vibrating electrode plate is partially fixed to the substrate. A vent hole that communicates a surface side and a rear surface side of the vibrating electrode plate is made between the surface of the substrate and the lower surface of the vibrating electrode plate. In addition, the acoustic hole has a smaller opening area except at the outer peripheral portion.

Abstract: An electronic component has a board, a semiconductor element mounted on an upper surface of the board, a ground electrode formed in a region surrounding the semiconductor element on the upper surface of the board, a conductive cap that overlaps the board such that the semiconductor element is covered therewith, and a conductive joining member that joins a whole periphery of a lower surface of the conductive cap to the ground electrode. The conductive cap includes a pressing portion on the lower surface thereof The lower surface of the conductive cap and the ground electrode are joined by the conductive joining member on an outer peripheral side of the pressing portion.

Abstract: The semiconductor device has a simplified structure which includes a package structure in which a member for mounting a semiconductor element is separate from a member including a signal input/output unit. A microphone package is configured with a cover and a substrate. A microphone chip and a circuit element are adhered and fixed to a top surface of a recess formed in the cover. A plurality of bonding pads are arranged on the lower surface of the cover on the outer side of the recess. A bonding wire is connected to the circuit element and the bonding pad. The substrate includes a signal input/output terminal serving as the signal input/output unit, and a connection electrode, conducted with the signal input/output terminal, is arranged facing the bonding pad on the upper surface of the substrate. The substrate, cover, connection electrode, and bonding pad are joined with a conductive member.

Abstract: An electronic component has a printed substrate having a die bonding portion, a semiconductor element rigidly bonded to the die bonding portion of the printed substrate by a die bonding resin, and a wire bonding terminal formed by a conductor pattern on the printed substrate that is connected to the semiconductor element by a bonding wire. A groove portion located at a level lower than the conductor pattern of the printed substrate is formed in a region located on at least a die bonding portion side in a region surrounding the wire bonding terminal.

Abstract: An electronic component has a substrate, a die bonding pad provided on an upper surface of the substrate, a semiconductor element bonded onto the die bonding pad by a die bonding resin, a conductive pattern disposed adjacent to the die bonding pad, and a coating member covering the conductive pattern. At least an outer peripheral portion of a surface of the die bonding pad is made of an inorganic material. The inorganic material of the outer peripheral portion is exposed. The die bonding pad and the conductive pattern are separated by an air gap such that the coating member does not come into contact with the die bonding pad.

Abstract: The present invention relates to the rigidity of a backlight chassis and is applicable to a liquid crystal display device including a backlight chassis and a light source located in the backlight chassis. A liquid crystal display device according to the present invention includes a backlight chassis (24), located to face a rear surface of a liquid crystal panel (10), for supporting a light source (22) for illuminating the rear surface of the liquid crystal panel (10). The backlight chassis (24) is a substantively flat plate-like member with upright peripheral portions (24a through 24d), and includes grooves (71 through 74) in a first area (A1) and a second area (A2), which are separated from each other by a border line (L) set on the backlight chassis (24). According to the present invention, the entirety of the backlight chassis is unlikely to be deflected.

Abstract: A backlight unit 12 includes a chassis 14, a cold cathode tube 17, and a lamp clip 18. The chassis 14 has mounting holes 32 and 33. The cold cathode tube 17 is arranged inside the chassis 14. The lamp clip 18 is mounted to the chassis 14 through the mounting holes 32 and 33. The lamp clip 18 holds the cold cathode tube 17. The lamp clip 18 includes main body 27 and mounting parts 30 and 31. The main body 27 is arranged inside the chassis 14. Each mounting part 30/31 includes a base portion 30a/31a and a holding portion 30b/31b. The base portion 30a/31a projects from the main body 27 to the outside of the chassis 14 through the mounting hole 32/33. The holding portion 30b/31b projects from the base portion 30a/31a and extends along the main body 27. An edge of each mounting hole 32/33 is sandwiched between the main body 27 and the holding portion 30b/31b. The chassis 14 includes contact portions 43 and receiving portions 39 and 40 for receiving the mounting parts 30 and 31, respectively.

Abstract: A backlight unit 12 includes a chassis 14, a cold cathode tube 17, and a lamp clip 18. The chassis has mounting holes 32 and 33. The cold cathode tube 17 is arranged inside the chassis 14. The lamp clip 18 is mounted to the chassis 14 through the mounting holes 32 and 33. The lamp clip 18 holds the cold cathode tube 17. The lamp clip 18 includes main body 27 and mounting parts 30 and 31. The main body 27 is arranged inside the chassis 14. The mounting parts 30 and 31 include base portions 30a and 31a, and holding portions 30b and 31b. The base portions 30a and 31a project from the main body 27 to the outside of the chassis 14 through the mounting holes 32 and 33. The holding portions 30b and 31b project from the base portions 30a and 31a along the main body 27. Edges of the mounting holes are sandwiched between the main body 27 and the holding portions 30b and 31b. The chassis 14 has receiving portions 39 and 40 for receiving the mounting parts 30 and 31.

Abstract: The semiconductor device has a simplified structure which includes a package structure in which a member for mounting a semiconductor element is separate from a member including a signal input/output unit. A microphone package is configured with a cover and a substrate. A microphone chip and a circuit element are adhered and fixed to a top surface of a recess formed in the cover. A plurality of bonding pads are arranged on the lower surface of the cover on the outer side of the recess. A bonding wire is connected to the circuit element and the bonding pad. The substrate includes a signal input/output terminal serving as the signal input/output unit, and a connection electrode, conducted with the signal input/output terminal, is arranged facing the bonding pad on the upper surface of the substrate. The substrate, cover, connection electrode, and bonding pad are joined with a conductive member.