Abstract: An apparatus for thermal control of a device under test (DUT) includes a cooling structure operable to provide cooling, the cooling structure operable to inlet cooling material via an inlet port thereof and operable to outlet cooling material via an outlet port thereof, a variable thermal conductance material (VTCM) layer disposed on a surface of the cooling structure, and a heater layer operable to generate heat based on an electronic control, and wherein the VTCM layer is operable to transfer cooling from the cooling structure to the heater layer. A thermal interface material layer is disposed on the heater layer. The thermal interface material layer is operable to provide thermal coupling and mechanical compliance with respect to the DUT. The apparatus includes a compression mechanism for providing compression to the VTCM layer to vary a thermal conductance of the VTCM layer. The compression mechanism is also for decoupling the VTCM layer from the heater layer.

Abstract: An apparatus for thermal control of a device under test (DUT) includes a cooling structure operable to provide cooling, the cooling structure operable to inlet cooling material via an inlet port thereof and operable to outlet cooling material via an outlet port thereof, a variable thermal conductance material (VTCM) layer disposed on a surface of the cooling structure, and a heater layer operable to generate heat based on an electronic control, and wherein the VTCM layer is operable to transfer cooling from the cooling structure to the heater layer. A thermal interface material layer is disposed on the heater layer. The thermal interface material layer is operable to provide thermal coupling and mechanical compliance with respect to the DUT. The apparatus includes a compression mechanism for providing compression to the VTCM layer to vary a thermal conductance of the VTCM layer. The compression mechanism is also for decoupling the VTCM layer from the heater layer.

Abstract: An apparatus for thermal control of a device under test (DUT) includes a cooling structure operable to provide cooling, the cooling structure operable to inlet cooling material via an inlet port thereof and operable to outlet cooling material via an outlet port thereof, a variable thermal conductance material (VTCM) layer disposed on a surface of the cooling structure, and a heater layer operable to generate heat based on an electronic control, and wherein the VTCM layer is operable to transfer cooling from the cooling structure to the heater layer. A thermal interface material layer is disposed on the heater layer. The thermal interface material layer is operable to provide thermal coupling and mechanical compliance with respect to the DUT. The apparatus includes a compression mechanism for providing compression to the VTCM layer to vary a thermal conductance of the VTCM layer. The compression mechanism is also for decoupling the VTCM layer from the heater layer.

Abstract: An apparatus for thermal control of a device under test (DUT) includes a cooling structure operable to provide cooling, the cooling structure operable to inlet cooling material via an inlet port thereof and operable to outlet. cooling material via an outlet port thereof, a variable thermal conductance material (VTCM) layer disposed on a surface of the cooling structure, and a heater layer operable to generate heat based on an electronic control, and wherein the VTCM layer is operable to transfer cooling from the cooling structure to the heater layer. A thermal interface material layer is disposed on the heater layer. The thermal interface material layer is operable to provide thermal coupling and mechanical compliance with respect to the DUT. The apparatus includes a compression a a mechanism for providing compression to the VTCM layer to vary a thermal conductance of the VTCM layer. The compression mechanism is also for decoupling the VTCM layer from the heater layer.

Abstract: A resin molded product is provided and capable of increasing a degree of freedom of a shape compared to prior arts, further provided with increased durability against environmental changes and improved reliability, a manufacturing method thereof, and a wavelength conversion member and an illumination member. The resin molded product is implemented by molding resin in which quantum dots are dispersed. The resin preferably contains a dispersant composed of metal soap. For example, a wavelength conversion bar (fluorescent bar) interposed between a light-emitting device such as an LED and a light-guiding board is molded using quantum-dot-containing resin.

Abstract: It is an object of the present invention to provide a resin molded product capable of increasing a degree of freedom of a shape compared to prior arts, further provided with increased durability against environmental changes and improved reliability, a manufacturing method thereof, and a wavelength conversion member and an illumination member. The present invention is implemented by molding resin in which quantum dots are dispersed. The resin preferably contains a dispersant composed of metal soap. For example, a wavelength conversion bar (fluorescent bar) (3) interposed between a light-emitting device (1) such as an LED and a light-guiding board (2) is molded using quantum-dot-containing resin of the present invention.

Abstract: A method of producing a microproduct comprises: providing a resin composition including 30 to 90 wt % of a polypropylene-based resin and 10 to 70 wt % of a hydrogenated derivative of a block copolymer shown by “X-Y” (X represents a polymer block immiscible with the polypropylene-based resin, Y represents an elastomeric polymer block of a conjugated diene that's miscible with the polypropylene-based resin after hydrogenation); attaching a silicon stamper to a mold cavity of an injection molding machine, the silicon stamper having micromachined features formed by etching the surface of a silicon plate; and precisely transferring the micromachined features of the silicon stamper to the resin composition by injecting the resin composition into the mold cavity, a resulting molded surface having recesses and/or protrusions that are 0.3 to 200 ?m deep or tall and 0.3 to 100 ?m wide.

Abstract: A resin composition that exhibits excellent moldability and excellent mechanical strength, and may suitably be used to produce a resin product that suppresses elution from the inner wall thereof is disclosed. In particular, a medical or biochemical resin composition that prevents adsorption of proteins, polypeptides, and peptides, and exhibits biocompatibility, antithrombogenicity, elution resistance, and moldability (e.g., injection moldability), and a resin molded product are disclosed. The medical or biochemical resin composition includes a polypropylene-based resin, and a hydrogenated derivative of a block copolymer shown by X-Y (wherein X represents s a polymer block immiscible with the polypropylene-based resin, and Y represents an elastomer polymer block of a conjugated diene), the polypropylene-based resin having a content of an antioxidant of 1 mass % or less and a content of an additive of 0.5 mass % or less, the additive being used to disperse the antioxidant in the polypropylene-based resin.

Abstract: A handler is configured by, separably and connectably, a plurality of types of handling modules of different throughputs and a plurality of types of test modules of different numbers of simultaneous measurements and/or test temperatures. Based on the maximum number of measurable pins of the tester outputting a test pattern and examining a response pattern, the number of terminals of the DUTs, and the test time, the throughput of the handling module and the number of simultaneous measurements and/or test temperature of the test module are selected and combined.

Abstract: A bonded structure formed by bonding a first structure and a second structure at opposed bonding surfaces to form a microstructure or the like. At least one of the first structure and the second structure is formed of a resin composition including a polypropylene resin and a hydrogenated derivative of a block copolymer of the following general formula X-Y (X is a polymer block immiscible with the polypropylene resin, and Y is a conjugated diene elastomer polymer block). The bonding surfaces are bonded by heating an alkoxysilane or alkylsilane compound or a mixture prepared by adding a hydrogenated derivative of a block copolymer of the general formula X-Y to an alkoxysilane or alkylsilane compound applied to the bonding surface.

Abstract: An electronic device test apparatus includes a plurality of testers on which are mounted test heads that are connected to test outputters for outputting test signals to the electronic devices and for receiving response signals from the electronic devices. A loading transporter is provided at a frontmost stage of the testers that transports the electronic devices from a previous process conveyance medium to a test tray before loading the electronic devices into the testers. An unloading transporter is provided at a rearmost stage of the testers that unloads the electronic devices from the test tray to a later process conveyance medium corresponding to the response signals. A transporter is provided between the testers that transports the test tray from a previous process tester to a later process tester. The transporter includes a buffer that holds test trays to absorb a waiting time due to differences in processing capacities between test trays.

Abstract: An electronic device test apparatus includes a plurality of testers on which are mounted test heads that are connected to test outputters for outputting test signals to the electronic devices and for receiving response signals from the electronic devices. A loading transporter is provided at a frontmost stage of the testers that transports the electronic devices from a previous process conveyance medium to a test tray before loading the electronic devices into the testers. An unloading transporter is provided at a rearmost stage of the testers that unloads the electronic devices from the test tray to a later process conveyance medium corresponding to the response signals. A transporter is provided between the testers that transports the test tray from a previous process tester to a later process tester. The transporter includes a buffer that holds test trays to absorb a waiting time due to differences in processing capacities between test trays.

Abstract: A method of producing a microproduct comprises: providing a resin composition including 30 to 90 wt % of a polypropylene-based resin and 10 to 70 wt % of a hydrogenated derivative of a block copolymer shown by “X-Y” (X represents a polymer block immiscible with the polypropylene-based resin, Y represents an elastomeric polymer block of a conjugated diene that's miscible with the polypropylene-based resin after hydrogenation); attaching a silicon stamper to a mold cavity of an injection molding machine, the silicon stamper having micromachined features formed by etching the surface of a silicon plate; and precisely transferring the micromachined features of the silicon stamper to the resin composition by injecting the resin composition into the mold cavity, a resulting molded surface having recesses and/or protrusions that are 0.3 to 200 ?m deep or tall and 0.3 to 100 ?m wide.

Abstract: [Problems] It is intended to provide a storing device which is convenient in preserving a slice of a pathological tissue or the like over a long time and by which a required number of slices can be quickly provided without waste. It is also intended to provide an instrument for microscopic observation which is equipped with this storing device and a transparent plate having an adhesive layer formed thereon. [Means for Solving Problems] A device comprising: a piece of a resin film on which a slice having been excised from a sample block or a cell block slice is adhered and fixed via an adhesive layer provided on the surface thereof; and a holder on the surface of which the back face of the film piece is detachably adhered and fixed via a pressure-sensitive adhesive layer. An instrument for microscopic observation which comprises the storing device and a transparent plate for adhering and fixing the film piece having been peeled off from the storing device.

Abstract: An apparatus having a plurality of test units (520), a loading transport unit (510) transporting a plurality of electronic devices from a customer tray (4C) to a test tray (4T) before being loaded in a test unit, and a classifying transport unit (530) transporting a plurality of electronic devices from a test tray while classifying them to customer trays in accordance with test results, the loading transport unit being provided at least at a frontmost stage of a plurality of test units, the classifying transport unit being provided at least at a rearmost stage of the plurality of test units, the test tray being successively conveyed from the frontmost stage to the rearmost stage of the plurality of test units in the state carrying electronic devices and returned from the rearmost stage test unit to the frontmost stage test unit.

Abstract: A bonded structure formed by bonding a first structure and a second structure at opposed bonding surfaces to form a microstructure or the like. At least one of the first structure and the second structure is formed of a resin composition including a polypropylene resin and a hydrogenated derivative of a block copolymer of the following general formula X-Y (X is a polymer block immiscible with the polypropylene resin, and Y is a conjugated diene elastomer polymer block). The bonding surfaces are bonded by heating an alkoxysilane or alkylsilane compound or a mixture prepared by adding a hydrogenated derivative of a block copolymer of the general formula X-Y to an alkoxysilane or alkylsilane compound applied to the bonding surface.

Abstract: A bonded structure formed by bonding a first structure and a second structure at opposed bonding surfaces to form a microstructure or the like. At least one of the first structure and the second structure is formed of a resin composition including a polypropylene resin and a hydrogenated derivative of a block copolymer of the following general formula X-Y (X is a polymer block immiscible with the polypropylene resin, and Y is a conjugated diene elastomer polymer block). The bonding surfaces are bonded by heating an alkoxysilane or alkylsilane compound or a mixture prepared by adding a hydrogenated derivative of a block copolymer of the general formula X-Y to an alkoxysilane or alkylsilane compound applied to the bonding surface.

Abstract: An electronic device test apparatus for testing IC chips (IC) by pushing their input/output terminals (HB) against contact units of a test head, provided with an IC moving system (410) for picking up and moving an IC chip (IC) at the front surface where input/output terminals (HB) are led out, a first camera for capturing an image of the front surface of an IC chip (IC) before being picked up, a second camera for capturing an image of a back surface of an IC chip (IC) after being picked up, and an image processing system for calculating the position of input/output terminals (HB) of an IC chip (IC) picked up by the IC moving system (410) from the image information captured by the first camera and second camera and identifying the relative position of the IC chip (IC) picked up by the IC moving system (410) with respect to a contact unit based on the results of calculation, wherein the IC moving system (410) corrects the position of the IC chip based on the relative position of the input/output terminals (HB)

Abstract: A handler is configured by, separably and connectably, a plurality of types of handling modules of different throughputs and a plurality of types of test modules of different numbers of simultaneous measurements and/or test temperatures. Based on the maximum number of measurable pins of the tester outputting a test pattern and examining a response pattern, the number of terminals of the DUTs, and the test time, the throughput of the handling module and the number of simultaneous measurements and/or test temperature of the test module are selected and combined.

Abstract: An apparatus having a plurality of test units (520), a loading transport unit (510) transporting a plurality of electronic devices from a customer tray (4C) to a test tray (4T) before being loaded in a test unit, and a classifying transport unit (530) transporting a plurality of electronic devices from a test tray while classifying them to customer trays in accordance with test results, the loading transport unit being provided at least at a frontmost stage of a plurality of test units, the classifying transport unit being provided at least at a rearmost stage of the plurality of test units, the test tray being successively conveyed from the frontmost stage to the rearmost stage of the plurality of test units in the state carrying electronic devices and returned from the rearmost stage test unit to the frontmost stage test unit.