Patents by Inventor Ke Han

Ke Han has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250246507
    Abstract: A semiconductor device includes a first interconnect structure, a device layer, a second interconnect structure, a diamond layer, a passivation layer, and an electrical connector. The device layer is disposed over the first interconnect structure. The second interconnect structure is disposed over the device layer and comprises a topmost metallization pattern. The diamond layer is disposed over the second interconnect structure and at least revealing a part of the topmost metallization pattern. The passivation layer covers the diamond layer and reveals the part of the topmost metallization pattern. The electrical connector is disposed over the passivation layer and bonded to the part of the topmost metallization pattern.
    Type: Application
    Filed: January 29, 2024
    Publication date: July 31, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Han-Jong Chia, Yu-Jen Lien, Ke-Han Shen, Cheng-Chieh Hsieh, Kuo-Chung Yee, Szu-Wei Lu, Chung-Ju Lee, Chen-Hua Yu, Ji CUI, Chih-Ming Ke, Hung-Yi Kuo
  • Publication number: 20250239509
    Abstract: A plurality of processor dies may be attached to an interposer structure including interposer dielectric material layers having formed therein interposer metal interconnect structures, A dielectric matrix may be formed around the plurality of processor dies over the interposer structure. A router die may be attached to the plurality of processor dies. The router die includes router dielectric material layers having formed therein router metal interconnect structures and a router substrate having formed therein router through-substrate via structures therein. A backside of the router substrate may be thinned to expose end surfaces of the router through-substrate via structures. Memory dies may be attached to the router substrate after thinning the backside of the router substrate. Bonding pads of the memory dies are electrically connected to the router through-substrate via structures.
    Type: Application
    Filed: April 23, 2024
    Publication date: July 24, 2025
    Inventors: Han-Jong Chia, Chieh-Yen Chen, Ke-Han Shen, Hung-Yi Kuo
  • Publication number: 20250238438
    Abstract: A data processing method for the machine learning and an electronic device using the same are provided. The data processing method for the machine learning includes the following steps. For a plurality of sources, a source balancing procedure is performed on an original measuring data to obtain a balanced distribution map. For each of the subjects, a personalization scaling procedure is performed on a plurality of detection values to obtain a personalized scaled measuring data. For each of the sources, a source scaling procedure is performed on the detection values to obtain a by-source scaled measuring data. The balanced distribution map, the personalized scaled measuring data and the by-source scaled measuring data are combined to obtain a balanced personalized scaled data and a balanced by-source scaled data. Based on the balanced personalized scaled data and the balanced by-source scaled data, some of the detection items are outputted.
    Type: Application
    Filed: July 12, 2024
    Publication date: July 24, 2025
    Applicant: Acer Incorporated
    Inventors: Pei-Jung CHEN, Tsung-Hsien TSAI, Ke-Han PAN, Yun-Hsuan CHAN, Sheng-Wei CHU, Pin-Cyuan LIN
  • Publication number: 20250224797
    Abstract: Methods and apparatus to implement always-on context sensor hubs for processing multiple different types of data inputs are disclosed. An examples apparatus includes a first processor core to implement a host controller, and a second processor core to implement an offload engine. The host controller includes first logic to process sensor data associated with an electronic device when the electronic device is in a low power mode. The host controller is to offload a computational task associated with the sensor data to the offload engine. The offload engine includes second logic to execute the computational task.
    Type: Application
    Filed: March 28, 2025
    Publication date: July 10, 2025
    Applicant: Intel Corporation
    Inventors: Ke Han, Mingqiu Sun, Dong Wang, Prakash Iyer, Stephan Jourdan, Andrzej Mialkowski
  • Publication number: 20250218890
    Abstract: An integrated circuit package and the method of forming the same are provided. The integrated circuit package may comprise a substrate, a first package component bonded to the substrate and a first cooling system over the first package component. The first package component may comprise a first semiconductor die. The first cooling system may comprise a first base over the first package component, wherein the first base may comprise a first recess, a first pin protruding from a bottom of the first recess, and a first raised portion encircling the recess in a top-down view; a lid over the first base, wherein the lid may be spaced apart from the first pin; and a sealant connecting the lid to the first raised portion of the first base.
    Type: Application
    Filed: December 27, 2023
    Publication date: July 3, 2025
    Inventors: Yu-Jen Lien, Cheng-Chieh Hsieh, Chen-Hua Yu, Ke-Han Shen, Hung-Yi Kuo
  • Publication number: 20250215047
    Abstract: Provided is a method for extending peptide linkers between peptides, including the following steps. All combinations of the peptide linkers of a length of n are listed, and a combination of a best peptide linker is generated. After that, a first condition and a second condition are considered to extend the peptide linkers. The first condition is that a cutting point of the peptide linkers is in the middle, and a center of extending the peptide linkers is selected from amino acids of a cutting point of the best peptide linker. The second condition is that amino acids of a N-terminal and amino acids of a C-terminal of the peptide linkers are searched, and the amino acids of the N-terminal and the amino acids of the C-terminal have a higher probability of being cut off.
    Type: Application
    Filed: December 13, 2024
    Publication date: July 3, 2025
    Applicant: Acer Incorporated
    Inventors: Chih-Wei Tu, Yun-Hsuan Chan, Ke-Han Pan, Tsung-Hsien Tsai
  • Patent number: 12346191
    Abstract: Methods, apparatus, systems and articles of manufacture are disclosed to dynamically schedule a wake pattern in a computing system. An example apparatus includes a device state controller to determine contexts of a device based on sensor measurements collected at a first time, an associator to associate a state of an operating system with the contexts of the device, the state obtained at a second time after the first time, a training controller to generate a prediction model based on the association, the prediction model to predict a third time when the state of the operating system will be active based on the contexts, and a schedule controller to reduce power consumption of the device by triggering a wake event before the third time, the wake event to prepare the device for exiting an inactive state.
    Type: Grant
    Filed: June 26, 2020
    Date of Patent: July 1, 2025
    Assignee: Intel Corporation
    Inventors: Hemin Han, Ke Han, Lili Ma, Mengchun Lv, Shouwei Sun
  • Publication number: 20250181135
    Abstract: Peripheral input devices including user presence detection sensors and related methods are disclosed herein. An example apparatus includes processor circuitry to execute instructions to cause a user device to transition from a first device state to a second device state in response to an indication of a first user presence state at a first time, the first user presence state relative to a peripheral input device communicatively coupled to the user device; cause the user device to transition from the second device state to a third device state in response to an indication of a second user presence state relative to the peripheral input device at a second time; and cause the user device to transition from the third device state to the first device state in response to an indication of the second user presence state relative to the peripheral input device at a third time.
    Type: Application
    Filed: April 1, 2022
    Publication date: June 5, 2025
    Inventors: Jian LIU, Ke HAN, Zhen LI
  • Publication number: 20250167075
    Abstract: Semiconductor devices and methods of manufacture are presented herein. In accordance with some embodiments, a device includes a first semiconductor device, the first semiconductor device including a first interconnect structure, an integrated cooling structure bonded to the first interconnect structure, wherein the integrated cooling structure is configured for a working fluid to enter and exit the integrated cooling structure, a second semiconductor device including a second interconnect structure, the second semiconductor device bonded to the integrated cooling structure opposite the first interconnect structure, and a plurality of through substrate vias extending through the integrated cooling structure, wherein the plurality of through substrate vias electrically couple the first semiconductor device to the second semiconductor device.
    Type: Application
    Filed: November 17, 2023
    Publication date: May 22, 2025
    Inventors: Yu-Jen Lien, Chen-Hua Yu, Cheng-Chieh Hsieh, Kuo-Chung Yee, Hung-Yi Kuo, Ke-Han Shen
  • Publication number: 20250150296
    Abstract: Particular embodiments described herein provide for an electronic device that is configured to receive audio data related to a conference call from a network conference engine, sample the audio data at a frame rate, determine an amount of missing samples of audio data for a predetermined amount of time, and communicate, to the network conference engine, a notification when the amount of missing samples of audio data for the predetermined amount of time is greater than a lost sample threshold. The electronic device can also be configured to receive visual content and visual content verification data from the network conference engine and use the visual content verification data to determine if visual content to be rendered on a display of the electronic device is the same or similar to the received visual content from the network conference engine.
    Type: Application
    Filed: March 30, 2022
    Publication date: May 8, 2025
    Inventors: Venkat Raghavulu, Ke Han, Sean Jude William Lawrence
  • Publication number: 20250138491
    Abstract: Techniques for low power indoor/outdoor detection are disclosed. In the illustrative embodiment, an integrated sensor hub receives data from an accelerometer. The sensor hub processes the accelerometer data to determine an activity of the user. Depending on the activity of the user, the sensor hub may determine whether the compute device is indoors or outdoors or may receive data from additional sensors, such as a magnetometer, a gyroscope, or an ambient light sensor. The additional sensor data may be used to determine whether the compute device is inside or outside.
    Type: Application
    Filed: April 2, 2022
    Publication date: May 1, 2025
    Applicant: Intel Corporation
    Inventors: Shouwei Sun, Hemin Han, Lili Ma, Ke Han, Rahul C. Shah, Lu Wang
  • Publication number: 20250038073
    Abstract: A package structure and a method for forming the same are provided. The package structure includes a first package structure and a second package structure. The first package structure includes a first device formed over a first substrate. The first device includes a first conductive plug connected to a through substrate via (TSV) structure formed in the first substrate. A buffer layer surrounds the first substrate. A first bonding layer is formed over the first substrate and the buffer layer. The second package structure includes a second device formed over a second substrate. A second bonding layer is formed over the second device. A hybrid bonding structure is between the first package structure and the second package structure by bonding the first bonding layer to the second bonding layer.
    Type: Application
    Filed: July 27, 2023
    Publication date: January 30, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ke-Han SHEN, Chih-Yuan CHEN, Jiung WU, Hung-Yi Kuo, Chung-Ju LEE, Tung-He CHOU, Ji CUI, Kuo-Chung YEE, Chen-Hua YU, Cheng-Chieh HSIEH, Yu-Jen LIEN, Yian-Liang KUO, Shih-Hao TSENG, Jen Yu WANG, Tzu-Chieh Chou
  • Publication number: 20250012874
    Abstract: The present application provides a system including a plurality of components to be mounted to a first device in a preset layout and generate a magnetic field; a magnetometer integrated with a second device to detect the magnetic field to generate reading data associated with the magnetic field at the second device; and a processor configured to determine a position of the second device relative to the first device based on the reading data and the preset layout of the plurality of components.
    Type: Application
    Filed: September 20, 2023
    Publication date: January 9, 2025
    Applicant: Intel Corporation
    Inventors: Ke HAN, Xiaodong Cai, Shouwei Sun, Hemin Han, Lu Wang
  • Patent number: 12124360
    Abstract: A setting method of in-memory computing simulator is presented. It involves an in-memory computing device performing various test combinations of neural network models and datasets, recording the corresponding first estimation indices. A processing device then uses these test combinations to execute a simulator with adjustable settings and records the corresponding second estimation indices. The processing device calculates a correlation sum according to the first estimation indices and second estimation indices, and performs an optimal algorithm to search an optimal parameter in a setting space to maximize the correlation sum.
    Type: Grant
    Filed: November 21, 2022
    Date of Patent: October 22, 2024
    Assignees: Inventec (Pudong) Technology Corporation, INVENTEC CORPORATION
    Inventors: Ke-Han Li, Chih-Fan Hsu, Yu-Sheng Lin, Wei-Chao Chen
  • Publication number: 20240307007
    Abstract: An alarm system an alarm method for a medical emergency are provided. The alarm method includes: obtaining a physiological signal of a user by a sensor of a portable electronic device; receiving the physiological signal from the portable electronic device, determining whether an abnormal event has occurred according to the physiological signal, and transmitting first feedback information corresponding to the physiological signal to a server in response to the abnormal event by the terminal device; and outputting an alarm message according to the first feedback information by the server.
    Type: Application
    Filed: November 21, 2023
    Publication date: September 19, 2024
    Applicants: Acer Incorporated, Far Eastern Memorial Hospital
    Inventors: Sheng-Wei Chu, Tsung-Hsien Tsai, Ke-Han Pan, Yueh-Yarng Tsai, Pei-Jung Chen, Jun-Hong Chen, Yen-Wen Wu, Jen-Tang Sun
  • Publication number: 20240313961
    Abstract: A system for verifying edited image includes: a producer terminal device configured to tile a source image for a plurality of smaller tiled images with individual source image hash values to accordingly calculate an integrated source image hash value, and to execute digitally signing to generate an image tag pair; an editor terminal device configured to receive the image tag pair, to divide the source image into these smaller tiled images according to a tile configuration, to edit part of the smaller tiled images, to include the rest part of these smaller tiled images to generate an edited integral image and further calculate an integrated edit image hash value, and to execute digitally signing to generate a zero-knowledge proof (ZKP) assurance; and, a user terminal device configured to receive the ZKP assurance to accordingly verify whether or not the edited integral image is generated by editing the source image.
    Type: Application
    Filed: October 26, 2023
    Publication date: September 19, 2024
    Inventors: Ke-Han LI, Chih-Fan HSU, Wei-Chao CHEN, Ming-Ching CHANG, Feng-Hao LIU
  • Publication number: 20240272673
    Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a first housing, one or more sensors located in the first housing, a second housing, and a slope located in the second housing to reflect light radiation to the one or more sensors when the first housing is over the second housing. The electronic device can be a laptop computer where the first housing is a lid that includes a display and the second housing is a base that includes a keyboard and the one or more sensors face the keyboard when the first housing is over the second housing when the laptop computer is in a closed configuration.
    Type: Application
    Filed: September 24, 2021
    Publication date: August 15, 2024
    Inventors: Shouwei Sun, Lili Ma, Ke Han, Hemin Han, Xiaodong Cai
  • Patent number: 12042305
    Abstract: A method for analyzing an electrocardiography (ECG) signal is provided. The ECG signal is measured through a sensor. One or more specified waveforms in the ECG signal are detected. Multiple ECG features from each specified waveform are captured. The ECG features are input into multiple candidate models to obtain multiple candidate scores. Each candidate score is compared with a standard value to obtain an ideal score among the candidate scores. One of the candidate models corresponding to the ideal score is selected as a risk prediction model to predict disease risk through the risk prediction model.
    Type: Grant
    Filed: May 13, 2020
    Date of Patent: July 23, 2024
    Assignees: Acer Incorporated, National Yang-Ming University
    Inventors: Yun-Hsuan Chan, Ke-Han Pan, Wei-Ju Li, Liang-Kung Chen, Li-Ning Peng
  • Publication number: 20240202147
    Abstract: A system includes a processor in a lid portion of a computing device. The processor is communicatively coupled to a plurality of input/output (I/O) devices according to a plurality of I/O communication protocols via a first number of wires. The system includes a first memory coupled to the processor to store instructions that can be executed by the processor and cause the processor to receive, from a first I/O device of the plurality of I/O devices, a first message according to a first I/O communication protocol of the plurality of I/O communication protocols, convert the first message to a second message according to a host communication protocol, and send the second message over a bus containing a second number of wires traversing a hinge movably coupling the lid portion to a base portion of the computing device. The second number of wires is less than the first number of wires.
    Type: Application
    Filed: December 16, 2021
    Publication date: June 20, 2024
    Applicant: Intel Corporation
    Inventors: Marko Bartscherer, Israel A. Cepeda Lopez, Antonio S. Cheng, Ke Han, Manjunatha Kondappa, Hongjun Li, Xinpeng Sun, Feng Xu, Xiang Ye, Qipeng Zha
  • Publication number: 20240162109
    Abstract: In an embodiment, a package includes an integrated circuit device attached to a substrate; an encapsulant disposed over the substrate and laterally around the integrated circuit device, wherein a top surface of the encapsulant is coplanar with the top surface of the integrated circuit device; and a heat dissipation structure disposed over the integrated circuit device and the encapsulant, wherein the heat dissipation structure includes a spreading layer disposed over the encapsulant and the integrated circuit device, wherein the spreading layer includes a plurality of islands, wherein at least a portion of the islands are arranged as lines extending in a first direction in a plan view; a plurality of pillars disposed over the islands of the spreading layer; and nanostructures disposed over the pillars.
    Type: Application
    Filed: January 10, 2023
    Publication date: May 16, 2024
    Inventors: Hung-Yi Kuo, Chen-Hua Yu, Kuo-Chung Yee, Yu-Jen Lien, Ke-Han Shen, Wei-Kong Sheng, Chung-Shi Liu, Szu-Wei Lu, Tsung-Fu Tsai, Chung-Ju Lee, Chih-Ming Ke