Patents by Inventor Ke Meng

Ke Meng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210328442
    Abstract: The present invention discloses a battery and an external component, which belong to the field of power supply technologies for a movie and television shooting apparatus. The battery of the present invention is used in cooperation with an external component, including at least two battery packs, a microcontroller, and a series-parallel switching circuit, and further including a connector in cooperation with the external component, the microcontroller controlling the series-parallel switching circuit according to a cooperation state of the connector and the external component, so that the battery packs are connected in series or in parallel. The present invention can be compatible with a high/low voltage camera and a high/low voltage charger automatically.
    Type: Application
    Filed: May 14, 2019
    Publication date: October 21, 2021
    Inventors: Ke MENG, Ping CHEN, Xiaohui ZHU
  • Patent number: 11150920
    Abstract: Techniques for implementing 3DI API redirection for VDI desktops are provided. In one set of embodiments, a server system can intercept a call to a 3D API made by a 3D application running within a VM on the server system, where the VM hosts a desktop that is presented to a user of a client system. The server system can determine metadata associated with the call, where the metadata including a name of the 3D API and one or more input parameter values to the call, and can transmit the metadata to the client system. In response, the client system can reconstruct the call to the 3D API using the metadata and execute the call using one or more physical GPUs residing on the client system.
    Type: Grant
    Filed: May 25, 2018
    Date of Patent: October 19, 2021
    Assignee: VMware, Inc.
    Inventors: Yuping Wei, Ke Xiao, Kejing Meng, Qiao Huang
  • Publication number: 20210296394
    Abstract: An array substrate and a manufacturing method thereof, a display panel, and a display device are provided. The array substrate includes a bonding region and a non-bonding region, and further includes: a rigid substrate, in the non-bonding region, a driving circuit layer, in the non-bonding region; a light-emitting diode layer, on a side of the driving circuit layer away from the rigid substrate; a flexible base layer, m the bonding region and on the same side of the rigid substrate as the driving circuit layer; and a bonding wire layer, on a side of the flexible base layer away from the rigid substrate. The bonding wire layer and the flexible base layer is capable of being bent along an edge of the rigid substrate to a side of the rigid substrate away from the driving circuit layer.
    Type: Application
    Filed: June 15, 2020
    Publication date: September 23, 2021
    Inventors: Ke MENG, Qiangwei CUI, Chao LIU, Lili WANG, Chuhang WANG, Yutian CHU, Linhui GONG
  • Publication number: 20210196737
    Abstract: The invention belongs to the technical field of biopharmaceuticals, and discloses the application of Trezastilbenoside in the manufacture of products for treating and/or preventing non-alcoholic fatty liver disease. The research of the present invention shows that after giving Trezastilbenoside to non-alcoholic fatty liver disease (NAFLD) model mice for 4 consecutive weeks, the serum TC, TG, and LDL content were all significantly reduced, and the HDL content was significantly increased, indicating that the drug has a lipid regulatory effect. The activities of AST and ALT in the serum were significantly weakened, and the infiltration of inflammatory factors in the liver tissue was reduced, indicating that the drug has a hepatoprotective effect. It can not only reduce the fat content of the liver, but also improve the pathological form of fatty liver, indicating an effect of against NASH.
    Type: Application
    Filed: December 29, 2020
    Publication date: July 1, 2021
    Inventors: Yidan LIU, Junfeng LIU, Xujuan YANG, Xi HUANG, Qing HUANG, Ke MENG, Guoguang LIU, Jianhua SHANG
  • Publication number: 20210167045
    Abstract: A driving substrate includes a base substrate. The base substrate has a display region and a peripheral region, and the peripheral region includes a bonding region between the display region and a first side face of the base substrate. The driving substrate further includes a plurality of first pads spaced apart from each other, which are disposed in the bonding region of the base substrate. A first side face of each first pad is flush with the first side face of the base substrate. A thickness of the first pad is approximately in a range from 0.5 microns to 2 microns.
    Type: Application
    Filed: April 30, 2020
    Publication date: June 3, 2021
    Inventors: Ke MENG, Chao LIU, Qiangwei CUI, Chuhang WANG, Lili WANG, Linhui GONG, Yutian CHU, Fan YANG
  • Publication number: 20210159208
    Abstract: A chip bonding method and a bonding device. The chip bonding method is used for bonding a chip to a display module, the display module includes a substrate and a functional layer on the substrate, the substrate includes a first substrate portion and a second substrate portion, the functional layer is on the first substrate portion, and an electrode is on an upper side of the second substrate portion. The chip bonding method includes: forming a light absorbing film layer on a side of the second substrate portion facing away from the electrode; coating a conductive adhesive film on the electrode, and placing the chip on the conductive adhesive film; and irradiating, by using a laser beam, a side of the second substrate portion facing away from the electrode.
    Type: Application
    Filed: March 26, 2020
    Publication date: May 27, 2021
    Inventors: Lili WANG, Haiwei SUN, Zhenxing TANG, Feng QU, Jing LIU, Chao LIU, Chuhang WANG, Qiangwei CUI, Ke MENG, Linhui GONG
  • Publication number: 20210088828
    Abstract: The present disclosure discloses a display panel and a method for manufacturing the same, a bonding method, and a display device. The display panel is provided with a bonding area and includes a bonding structure in the bonding area, and the bonding structure is provided with a through hole penetrating along a thickness direction of the bonding structure. The present disclosure helps to improve the bonding efficiency between the display panel and a flexible printed circuit.
    Type: Application
    Filed: June 5, 2020
    Publication date: March 25, 2021
    Inventors: Qiangwei Cui, Lili Wang, Ke Meng, Chao Liu, Chuhang Wang, Linhui Gong, Zhaohui Li, Donghui Wang
  • Publication number: 20080277822
    Abstract: An apparatus for periodically cooling injection mold has a cavity formed between a cavity insert and a core insert of the injection mold. The bottom of the cavity defines a perforation that extends and passes through a lower pushing plate. An ejector pin is received in the perforation. The bottom end of the ejector pin passes out of the lower pushing plate and is above the top surface of a lower fixed plate. A sensor switch that controls several electric valve actuators is located on the lower fixed plate and is below the ejector pin. The electric valve actuators control cooling liquid to flow into several cooling pipes that are configured in the cavity insert and the core insert respectively. A method for periodically cooling injection mold includes the steps of: closing the injection mold and pouring raw materials into the cavity to form a product; pushing the ejector pin downward along the perforation and the bottom of the ejector pin touching and pressing the sensor switch.
    Type: Application
    Filed: May 9, 2007
    Publication date: November 13, 2008
    Inventors: Chih-Yu CHEN, Jian-Ren Wang, Ke-Meng He
  • Publication number: 20070134366
    Abstract: An injection die with an early-returning apparatus includes a lower fixed plate; a plurality of padding blocks located in the lower fixed plate; a male die mounted on the padding blocks; a female die coupled with the male die; an upper fixed plate mounted on the female die; a draw core unit installed in the female die; a shaft seat unit located in a space between the padding blocks and mounted on the lower fixed plate; a restoration unit fixed on a shaft-fixing plate of the shaft seat unit and inserted into the male die and an early-returning apparatus mounted on the shaft seat unit and the upper fixed plate and inserted into the male die and the female die.
    Type: Application
    Filed: December 13, 2005
    Publication date: June 14, 2007
    Inventors: Ching-Chang Wang, Chih-Yu Chen, Jian-Ren Wang, Ke-Meng He