Patents by Inventor Ke Meng

Ke Meng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11939386
    Abstract: Disclosed are a new AXL-targeting monoclonal antibody and antibody-drug conjugate. Also disclosed is a method for preparing said antibody and antibody-drug conjugate. The AXL antibody of the present invention can bind with purified human AXL protein and multiple AXL on tumor cell surface with high effectiveness and high specificity. Said humanized antibody also has high affinity and low immunogenicity. Said AXL antibody-drug conjugate has markable performance against tumors having high AXL expression.
    Type: Grant
    Filed: May 10, 2019
    Date of Patent: March 26, 2024
    Assignee: Shanghai Institute of Materia Medica, Chinese Academy of Sciences
    Inventors: Ke Yu, Jingkang Shen, Tao Meng, Jinpeng Pei, Lanping Ma, Xin Wang, Rui Jin, Zhiyan Du, Lin Chen, Ting Yu, Yongliang Zhang
  • Patent number: 11893942
    Abstract: A GOA unit circuit is provided with an input sub-circuit configured to set a turn-on voltage to a first node and a turn-off voltage to a second node in response to an input signal and a first clock signal; a first pull-down sub-circuit, a pull-up sub-circuit, a first control sub-circuit, and a second control sub-circuit configured to set voltage levels of the first, the second, and a third nodes. The gate on array unit circuit also includes a first output sub-circuit to output a first output signal at the turn-on voltage triggered by a second clock in response to voltage levels at the first, second nodes and a second output sub-circuit to output a second output signal falling to the turn-off voltage triggered by the first clock and rising to the turn-on voltage triggered by the third clock in response to voltage levels at the first, third nodes.
    Type: Grant
    Filed: September 17, 2019
    Date of Patent: February 6, 2024
    Assignee: BOE Technology Group Co., Ltd.
    Inventors: Lubin Shi, Ke Meng
  • Patent number: 11888744
    Abstract: A network congestion control method, a node and a system are disclosed, where the method is applied to a spine-leaf network system. The method includes: a spine node receives network information sent by the at least one leaf node, where the network information includes network topology information of the leaf node and a network performance indicator of the leaf node; networks the at least one leaf node and the spine node based on the network topology information of the at least one leaf node, to obtain a combined network topology; and if the combined network topology is a global network topology of the spine-leaf network system, performs network congestion control on the at least one leaf node based on the network performance indicator of the at least one leaf node.
    Type: Grant
    Filed: March 16, 2022
    Date of Patent: January 30, 2024
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Ke Meng, Hewen Zheng, Haonan Ye, Weiqing Kong
  • Patent number: 11872802
    Abstract: Disclosed are a pattern transfer apparatus and a pattern transfer method. The pattern transfer method includes: transferring a pattern to a flexible printing substrate; and transferring the pattern on the printing substrate to a bending surface of a rigid carrier through an elastic rubber head.
    Type: Grant
    Filed: January 12, 2021
    Date of Patent: January 16, 2024
    Assignees: BOE MLED TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Linhui Gong, Chao Liu, Qiangwei Cui, Ke Meng, Haiwei Sun
  • Patent number: 11870708
    Abstract: A congestion control method and an apparatus are disclosed. The method includes: after a sending device generates an unscheduled data packet of a first flow, if it is determined, based on an unscheduled packet send window shared by all flows, that the unscheduled data packet meets a sending condition, determining whether to request to add a quota for at least one of the unscheduled packet send window and a scheduled packet send window corresponding to the first flow; and if it is determined that the quota is requested to be added for the at least one of the unscheduled packet send window and the scheduled packet send window corresponding to the first flow, setting indication information in the unscheduled data packet, and sending, to a receiving device, the unscheduled data packet in which the indication information is set.
    Type: Grant
    Filed: March 17, 2023
    Date of Patent: January 9, 2024
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Chen Tian, Lei Han, Kexin Liu, Wenhao Sun, Ke Meng, Yonghui Xu, Long Yan
  • Publication number: 20230259929
    Abstract: Disclosed is a computer implemented method, system and computer readable medium for performing blockchain-based identity management for a supply chain of a computerised network. In one aspect, the method includes receiving, by a computerised device of a party, an identity issuing transaction initiated by a computerised component or service being in the supply chain, the identity issuing transaction being indicative of a name of the computerised component or service, an identity issuing request message, and a first random number obtained from a distributed database, wherein the identity issuing transaction is initiated by the computerised component or service in response to determining the party is an authoritative party recorded in the blockchain and permitted to issue an identity, invoking a first smart contract, and executing an identity issuance logic of the first smart contract.
    Type: Application
    Filed: July 30, 2021
    Publication date: August 17, 2023
    Inventors: Abubakar Sadiq Sani, Zhao Yang Dong, Ke Meng, Dong Yuan
  • Publication number: 20230216809
    Abstract: A congestion control method and an apparatus are disclosed. The method includes: after a sending device generates an unscheduled data packet of a first flow, if it is determined, based on an unscheduled packet send window shared by all flows, that the unscheduled data packet meets a sending condition, determining whether to request to add a quota for at least one of the unscheduled packet send window and a scheduled packet send window corresponding to the first flow; and if it is determined that the quota is requested to be added for the at least one of the unscheduled packet send window and the scheduled packet send window corresponding to the first flow, setting indication information in the unscheduled data packet, and sending, to a receiving device, the unscheduled data packet in which the indication information is set.
    Type: Application
    Filed: March 17, 2023
    Publication date: July 6, 2023
    Inventors: Chen TIAN, Lei HAN, Kexin LIU, Wenhao SUN, Ke MENG, Yonghui XU, Long YAN
  • Publication number: 20230142651
    Abstract: A GOA unit circuit is provided with an input sub-circuit configured to set a turn-on voltage to a first node and a turn-off voltage to a second node in response to an input signal and a first clock signal; a first pull-down sub-circuit, a pull-up sub-circuit, a first control sub-circuit, and a second control sub-circuit configured to set voltage levels of the first, the second, and a third nodes. The gate on array unit circuit also includes a first output sub-circuit to output a first output signal at the turn-on voltage triggered by a second clock in response to voltage levels at the first, second nodes and a second output sub-circuit to output a second output signal falling to the turn-off voltage triggered by the first clock and rising to the turn-on voltage triggered by the third clock in response to voltage levels at the first, third nodes.
    Type: Application
    Filed: September 17, 2019
    Publication date: May 11, 2023
    Applicant: BOE Technology Group Co., Ltd.
    Inventors: Lubin Shi, Ke Meng
  • Patent number: 11493793
    Abstract: The present disclosure discloses a display panel and a method for manufacturing the same, a bonding method, and a display device. The display panel is provided with a bonding area and includes a bonding structure in the bonding area, and the bonding structure is provided with a through hole penetrating along a thickness direction of the bonding structure. The present disclosure helps to improve the bonding efficiency between the display panel and a flexible printed circuit.
    Type: Grant
    Filed: June 5, 2020
    Date of Patent: November 8, 2022
    Assignee: Beijing BOE Technology Development Co., Ltd.
    Inventors: Qiangwei Cui, Lili Wang, Ke Meng, Chao Liu, Chuhang Wang, Linhui Gong, Zhaohui Li, Donghui Wang
  • Publication number: 20220314598
    Abstract: Disclosed are a pattern transfer apparatus and a pattern transfer method. The pattern transfer method includes: transferring a pattern to a flexible printing substrate; and transferring the pattern on the printing substrate to a bending surface of a rigid carrier through an elastic rubber head.
    Type: Application
    Filed: January 12, 2021
    Publication date: October 6, 2022
    Inventors: Linhui Gong, Chao Liu, Qiangwei Cui, Ke Meng, Haiwei Sun
  • Publication number: 20220210071
    Abstract: A network congestion control method, a node and a system are disclosed, where the method is applied to a spine-leaf network system. The method includes: a spine node receives network information sent by the at least one leaf node, where the network information includes network topology information of the leaf node and a network performance indicator of the leaf node; networks the at least one leaf node and the spine node based on the network topology information of the at least one leaf node, to obtain a combined network topology; and if the combined network topology is a global network topology of the spine-leaf network system, performs network congestion control on the at least one leaf node based on the network performance indicator of the at least one leaf node.
    Type: Application
    Filed: March 16, 2022
    Publication date: June 30, 2022
    Inventors: Ke MENG, Hewen ZHENG, Haonan YE, Weiqing KONG
  • Publication number: 20220200906
    Abstract: A network congestion handling method includes obtaining network status information; determining, based on the network status information and an Explicit Congestion Notification (ECN) optimization model, a reference probability corresponding to recommended ECN configuration information; determining destination ECN configuration information based on the reference probability; and performing ECN marking on a packet by using the destination ECN configuration information.
    Type: Application
    Filed: March 15, 2022
    Publication date: June 23, 2022
    Inventors: Haonan Ye, Huafeng Wen, Liang Zhang, Ke Meng
  • Patent number: 11296517
    Abstract: The present invention discloses a battery and an external component, which belong to the field of power supply technologies for a movie and television shooting apparatus. The battery of the present invention is used in cooperation with an external component, including at least two battery packs, a microcontroller, and a series-parallel switching circuit, and further including a connector in cooperation with the external component, the microcontroller controlling the series-parallel switching circuit according to a cooperation state of the connector and the external component, so that the battery packs are connected in series or in parallel. The present invention can be compatible with a high/low voltage camera and a high/low voltage charger automatically.
    Type: Grant
    Filed: May 14, 2019
    Date of Patent: April 5, 2022
    Inventors: Ke Meng, Ping Chen, Xiaohui Zhu
  • Patent number: 11276674
    Abstract: A driving substrate includes a base substrate. The base substrate has a display region and a peripheral region, and the peripheral region includes a bonding region between the display region and a first side face of the base substrate. The driving substrate further includes a plurality of first pads spaced apart from each other, which are disposed in the bonding region of the base substrate. A first side face of each first pad is flush with the first side face of the base substrate. A thickness of the first pad is approximately in a range from 0.5 microns to 2 microns.
    Type: Grant
    Filed: April 30, 2020
    Date of Patent: March 15, 2022
    Assignees: BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Ke Meng, Chao Liu, Qiangwei Cui, Chuhang Wang, Lili Wang, Linhui Gong, Yutian Chu, Fan Yang
  • Patent number: 11239198
    Abstract: A chip bonding method and a bonding device. The chip bonding method is used for bonding a chip to a display module, the display module includes a substrate and a functional layer on the substrate, the substrate includes a first substrate portion and a second substrate portion, the functional layer is on the first substrate portion, and an electrode is on an upper side of the second substrate portion. The chip bonding method includes: forming a light absorbing film layer on a side of the second substrate portion facing away from the electrode; coating a conductive adhesive film on the electrode, and placing the chip on the conductive adhesive film; and irradiating, by using a laser beam, a side of the second substrate portion facing away from the electrode.
    Type: Grant
    Filed: March 26, 2020
    Date of Patent: February 1, 2022
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Lili Wang, Haiwei Sun, Zhenxing Tang, Feng Qu, Jing Liu, Chao Liu, Chuhang Wang, Qiangwei Cui, Ke Meng, Linhui Gong
  • Publication number: 20220013398
    Abstract: A micro-LED transfer method, including: moving a passing substrate to a position above a donor substrate and moving the pasting substrate in a direction approaching the donor substrate to paste up LED grains so that the LED grains are separated from the bearing substrate; moving the pasting substrate with the LED grains to a position above a target substrate with the LED grains being closer to the target substrate than the pasting substrate, and conducting an alignment so that the LED grains are directly opposite to positions on the target substrate where the LED grains are to be arranged; and heating the pasting substrate with the LED grains to a first temperature greater than or equal to a melting temperature of the hot melt adhesive film to melt the hot melt adhesive film, so that the LED grains are separated from the pasting substrate and transferred to the target substrate.
    Type: Application
    Filed: May 9, 2020
    Publication date: January 13, 2022
    Applicant: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Lili WANG, Chuhang WANG, Chao LIU, Qiangwei CUI, Ke MENG, Linhui GONG
  • Publication number: 20210328442
    Abstract: The present invention discloses a battery and an external component, which belong to the field of power supply technologies for a movie and television shooting apparatus. The battery of the present invention is used in cooperation with an external component, including at least two battery packs, a microcontroller, and a series-parallel switching circuit, and further including a connector in cooperation with the external component, the microcontroller controlling the series-parallel switching circuit according to a cooperation state of the connector and the external component, so that the battery packs are connected in series or in parallel. The present invention can be compatible with a high/low voltage camera and a high/low voltage charger automatically.
    Type: Application
    Filed: May 14, 2019
    Publication date: October 21, 2021
    Inventors: Ke MENG, Ping CHEN, Xiaohui ZHU
  • Publication number: 20210296394
    Abstract: An array substrate and a manufacturing method thereof, a display panel, and a display device are provided. The array substrate includes a bonding region and a non-bonding region, and further includes: a rigid substrate, in the non-bonding region, a driving circuit layer, in the non-bonding region; a light-emitting diode layer, on a side of the driving circuit layer away from the rigid substrate; a flexible base layer, m the bonding region and on the same side of the rigid substrate as the driving circuit layer; and a bonding wire layer, on a side of the flexible base layer away from the rigid substrate. The bonding wire layer and the flexible base layer is capable of being bent along an edge of the rigid substrate to a side of the rigid substrate away from the driving circuit layer.
    Type: Application
    Filed: June 15, 2020
    Publication date: September 23, 2021
    Applicant: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Ke MENG, Qiangwei CUI, Chao LIU, Lili WANG, Chuhang WANG, Yutian CHU, Linhui GONG
  • Publication number: 20210196737
    Abstract: The invention belongs to the technical field of biopharmaceuticals, and discloses the application of Trezastilbenoside in the manufacture of products for treating and/or preventing non-alcoholic fatty liver disease. The research of the present invention shows that after giving Trezastilbenoside to non-alcoholic fatty liver disease (NAFLD) model mice for 4 consecutive weeks, the serum TC, TG, and LDL content were all significantly reduced, and the HDL content was significantly increased, indicating that the drug has a lipid regulatory effect. The activities of AST and ALT in the serum were significantly weakened, and the infiltration of inflammatory factors in the liver tissue was reduced, indicating that the drug has a hepatoprotective effect. It can not only reduce the fat content of the liver, but also improve the pathological form of fatty liver, indicating an effect of against NASH.
    Type: Application
    Filed: December 29, 2020
    Publication date: July 1, 2021
    Applicant: KPC PHARMACEUTICALS, INC.
    Inventors: Yidan LIU, Junfeng LIU, Xujuan YANG, Xi HUANG, Qing HUANG, Ke MENG, Guoguang LIU, Jianhua SHANG
  • Publication number: 20210167045
    Abstract: A driving substrate includes a base substrate. The base substrate has a display region and a peripheral region, and the peripheral region includes a bonding region between the display region and a first side face of the base substrate. The driving substrate further includes a plurality of first pads spaced apart from each other, which are disposed in the bonding region of the base substrate. A first side face of each first pad is flush with the first side face of the base substrate. A thickness of the first pad is approximately in a range from 0.5 microns to 2 microns.
    Type: Application
    Filed: April 30, 2020
    Publication date: June 3, 2021
    Inventors: Ke MENG, Chao LIU, Qiangwei CUI, Chuhang WANG, Lili WANG, Linhui GONG, Yutian CHU, Fan YANG