Abstract: A chip bonding method and a bonding device. The chip bonding method is used for bonding a chip to a display module, the display module includes a substrate and a functional layer on the substrate, the substrate includes a first substrate portion and a second substrate portion, the functional layer is on the first substrate portion, and an electrode is on an upper side of the second substrate portion. The chip bonding method includes: forming a light absorbing film layer on a side of the second substrate portion facing away from the electrode; coating a conductive adhesive film on the electrode, and placing the chip on the conductive adhesive film; and irradiating, by using a laser beam, a side of the second substrate portion facing away from the electrode.

Abstract: The present disclosure discloses a display panel and a method for manufacturing the same, a bonding method, and a display device. The display panel is provided with a bonding area and includes a bonding structure in the bonding area, and the bonding structure is provided with a through hole penetrating along a thickness direction of the bonding structure. The present disclosure helps to improve the bonding efficiency between the display panel and a flexible printed circuit.

Abstract: An apparatus for periodically cooling injection mold has a cavity formed between a cavity insert and a core insert of the injection mold. The bottom of the cavity defines a perforation that extends and passes through a lower pushing plate. An ejector pin is received in the perforation. The bottom end of the ejector pin passes out of the lower pushing plate and is above the top surface of a lower fixed plate. A sensor switch that controls several electric valve actuators is located on the lower fixed plate and is below the ejector pin. The electric valve actuators control cooling liquid to flow into several cooling pipes that are configured in the cavity insert and the core insert respectively. A method for periodically cooling injection mold includes the steps of: closing the injection mold and pouring raw materials into the cavity to form a product; pushing the ejector pin downward along the perforation and the bottom of the ejector pin touching and pressing the sensor switch.

Abstract: An injection die with an early-returning apparatus includes a lower fixed plate; a plurality of padding blocks located in the lower fixed plate; a male die mounted on the padding blocks; a female die coupled with the male die; an upper fixed plate mounted on the female die; a draw core unit installed in the female die; a shaft seat unit located in a space between the padding blocks and mounted on the lower fixed plate; a restoration unit fixed on a shaft-fixing plate of the shaft seat unit and inserted into the male die and an early-returning apparatus mounted on the shaft seat unit and the upper fixed plate and inserted into the male die and the female die.