Abstract: A medical interventional tool has distal and proximal ends. A responsive material is located at the distal end or elsewhere along the interventional tool and is capable of providing a temperature-dependent or pressure-dependent optical response. At least one optical guide is in optical communication with the responsive material to collect an optical signal from the responsive material located at the distal end or other location along the interventional tool. The at least one optical guide further guides the collected optical signal to an optical output at the proximal end of the interventional tool. An optical response analyzer is configured to receive the collected optical signal from the optical output and to process the collected optical signal to derive therefrom a temperature or pressure reading or indication representative of a temperature or pressure at the distal end or other location along the interventional tool.

Abstract: A light emitting module, a method of manufacturing the light emitting module, and a display device are provided. The light emitting module includes: a back frame; a first substrate; an electronic element array disposed on the first substrate, wherein the electronic element array includes a plurality of electronic elements; an encapsulation layer disposed on the first substrate and covering the electronic element array; and a bonding portion disposed between the back frame and the first substrate, wherein the bonding portion includes a first surface facing the back frame and a second surface facing the first substrate, and the first surface and the second surface are oppositely disposed, wherein a material of the first substrate is an organic material, the back frame is in direct contact with the first surface of the bonding portion, and the first substrate is in direct contact with the second surface of the bonding portion.

Abstract: A method includes obtaining, using at least one processing device of an electronic device, multiple sets of training image frames, where each set of training image frames has an associated ground truth image. The method also includes applying, using the at least one processing device, motion blur and warping to the multiple sets of training image frames in order to generate additional sets of training image frames. In addition, the method includes training, using the at least one processing device, a machine learning model to align image frames and remove motion blur from the image frames based on at least the additional sets of training image frames and the ground truth images.

Abstract: A wiring board includes a base substrate and first connection pads disposed on the base substrate. The first connection pads each include electrical connection layer(s); each electrical connection layer includes a main material layer and protective layer(s) disposed on a side of the main material layer away from the base substrate; the protective layer(s) include a first reference protective layer, which is a protective layer farthest away from the base substrate in the protective layer(s); and a material of the main material layer includes copper. The electrical connection layer(s) include a first electrical connection layer, which is an electrical connection layer farthest away from the base substrate in the electrical connection layer(s); and in protective layer(s) in the first electrical connection layer, at least a material of the first reference protective layer is capable of forming a first intermetallic compound with a first solder.

Abstract: A fiber optic ferrule has a main body with a top surface and a bottom surface and extends between a front end and a back end. The front face includes a recessed portion with a plurality of optical lenses. The front face is configured to allow for the plurality of lenses to be on an angle relative to the front face and the fiber optic ferrule will have not any undercuts and allow the fiber optic ferrule to be ejected from a mold without engaging any portions of the mold.

Abstract: In various embodiments, a method comprises: capturing, by computing hardware, video; extracting, by the computing hardware, one or more per-frame pose features from the video; extracting, by the computing hardware, one or more per-video temporal features from the video; causing, by the computing hardware, at least one of a machine-learning model or a rules-based mode to generate at least one of a risk level prediction or a severity score based on the one or more per-frame pose features and the one or more per-video temporal features, the risk level prediction and the severity score being related to a potential diagnosis of a medical condition; producing, by the computing hardware, an output based on at least one of the risk level prediction or the severity score; and generating, using a machine learning model, a treatment recommendation for the condition.

Abstract: A joint diagnosis method, including steps: collecting data of a current motion trajectory of a robot, solving for a frictional force of a joint, performing temperature compensation on a friction model based on a feedback temperature of the joint, and solving for an output torque of a connecting rod of the joint, to acquire a dynamics model error; performing detection and analysis on the dynamics model error, to acquire modal analysis and joint wear degree results; and determining, based on the modal analysis and joint wear degree results, whether the joint is in an abnormal wear state, and if the joint is in the abnormal wear state, triggering a joint abnormity alarm, otherwise, performing calibration on the friction model.

Abstract: A high-performance lithium manganese oxide cathode material with a low oxygen vacancy proportion is provided. According to characterization by electron paramagnetic resonance spectroscopy (EPR), an oxygen vacancy content in the high-performance lithium manganese oxide cathode material is 10 ppm to 10,000 ppm. A preparation method of the cathode material includes the following steps: thoroughly mixing a Li source compound, a Mn source compound, and a fluxing agent element-containing compound, and conducting first calcination in an air atmosphere to produce a first calcined product; mixing the first calcined product with a monovalent metal ion-containing compound, and conducting second calcination in an air atmosphere, where a temperature of the second calcination is lower than a temperature of the first calcination; and cooling and crushing.

Abstract: A display control method includes: displaying an initial interaction interface, the initial interaction interface including at least a first interaction area; and controlling the first interaction area to output a task interaction interface corresponding to an execution state of a target processing task, so as to present different visual effects at different task stages. The target processing task is obtained by a user terminal device based on an input operation applied to the first interaction area; and before the target processing task is obtained, a visual effect presented by the first interaction area is different from a visual effect presented by the first interaction area after the target processing task is obtained.

Abstract: A pseudo-fluid model-based numerical simulation method for deep-sea mining and related devices are disclosed. In the above method, first, an initial velocity field, an initial pressure field, and an initial particle concentration distribution in a deep-sea mining pipeline are set; then, boundary conditions at an inlet and an outlet of the deep-sea mining pipeline are defined; and finally, numerical simulation is performed on the deep-sea mining pipeline by using a pseudo-fluid model to obtain a deep-sea mining numerical simulation result, where the deep-sea mining numerical simulation result includes a pressure distribution, a velocity field, a particle concentration distribution, an effective density, and an effective viscosity. During the process, solid particles are simplified into a pseudo-fluid by using the pseudo-fluid model, and effective density and effective viscosity are introduced.

Abstract: A mining planning method is provided. The method includes: acquiring physical characteristics and initial parameters of an ore particle group; performing numerical simulation on the ore particle group based on the physical characteristics and the initial parameters to calculate resistance coefficient values of the ore particle group corresponding to different flow velocity values; establishing a mathematical relationship between a resistance coefficient and a flow velocity; calculating a settling velocity of the ore particle group based on the mathematical relationship; and calculating a minimum lifting velocity of the ore particle group based on the settling velocity, where the minimum lifting velocity is for guiding mining planning. The resistance coefficient and the settling velocity of the particle group are calculated accurately through the numerical simulation, and thus the minimum lifting velocity is determined.

Abstract: A system includes an engine including a valvetrain comprising one or more intake valves and one or more exhaust valves, a variable valve actuation (VVA) system electronically controllable to vary operation of the valvetrain to selectably operate the engine in either a Miller cycle or a non-Miller cycle, and an electronic control system configured to control the VVA system to change operation of the engine from the Miller-cycle to the non-Miller cycle if an engine speed condition is satisfied, a peak cylinder pressure (PCP) condition is satisfied, at least one of an air-fuel ratio (AFR) condition and an oxygen-fuel-control (OFC) condition is satisfied, and a minimum off time condition for the VVA system is satisfied.

Abstract: Provided is a communication method for synchronization. The method is applicable to zero-power communication and performed by a network device, and includes: transmitting a reference signal, wherein the reference signal is used for time-domain synchronization and frequency-domain synchronization of a zero-power device, and the reference signal includes at least one sequence group, wherein the at least one sequence group is formed based on a synchronization sequence repeated N times, N being an integer greater than or equal to 1.

Abstract: Disclosed is a method for preparing a C-nucleoside compound represented by Formula (III) or salt thereof. The present method has a high reaction yield, is simple to operate, uses a single metal reagent, has stable reaction temperature conditions, does not require frequent changes to the reaction system during the operation process, is suitable for scale-up synthesis, is suitable for large-scale production of Remdesivir, and has low costs.

Abstract: The present disclosure provides a high-density three-dimensional multilayer memory and a fabrication method, and relates to the preparation technology of memories. The memory comprises an underlying circuit part and a basic structure body disposed above the underlying circuit part, wherein the basic structure body is divided into two independent interdigitated structures by a curve-shaped division groove, at least three memory cell holes are formed in the curve-shaped division groove side by side, a vertical electrode is disposed in each memory cell hole, and the memory medium is an insulating medium; and a buffer region is placed on the inner wall of the memory cell hole and at the position of a first conducting medium layer, the buffer region protrudes from the inner wall of the memory cell hole to the central axis of the memory cell hole, and the buffer region is connected to the memory medium.

Abstract: A filter, a manufacturing method therefor, and an electronic device are provided. The filter includes a first substrate and a second substrate disposed opposite to each other, and a connection substrate disposed therebetween, wherein at least one first substrate electrode is disposed on the first substrate, at least one second substrate electrode is disposed on the second substrate, the connection substrate comprises, at least, a connection base substrate and at least one conductive post penetrating the connection base substrate in a thickness direction, an end of the conductive post close to the first substrate is provided with a first bump structure, an end of the conductive post close to the second substrate is provided with a second bump structure, and the first bump structure is connected with the first substrate electrode, the second bump structure is connected with the second substrate electrode, both in a bonding manner.

Abstract: A wiring board includes a base substrate and first connection pads disposed on the base substrate. The first connection pads each include electrical connection layer(s); each electrical connection layer includes a main material layer and protective layer(s) disposed on a side of the main material layer away from the base substrate; the protective layer(s) include a first reference protective layer, which is a protective layer farthest away from the base substrate in the protective layer(s); and a material of the main material layer includes copper. The electrical connection layer(s) include a first electrical connection layer, which is an electrical connection layer farthest away from the base substrate in the electrical connection layer(s); and in protective layer(s) in the first electrical connection layer, at least a material of the first reference protective layer is capable of forming a first intermetallic compound with a first solder.

Abstract: A method for manufacturing an array substrate and an array substrate are provided. The method includes: providing a base substrate; forming a driving circuit layer at a side of the base substrate; and forming a functional device layer at a side of the driving circuit layer. Forming the driving circuit layer includes forming at least one first lead layer. Forming the first lead layer includes: forming a conductive seed layer at the side of the base substrate; forming a removable pattern-defining layer on a surface of the conductive seed layer, the removable pattern-defining layer being provided with a lead opening exposing a part of the conductive seed layer; forming, in the lead opening, a metal plating layer on the surface of the conductive seed layer; removing the removable pattern-defining layer; and removing a part of the conductive seed layer not covered by the metal plating layer.

Abstract: The present disclosure provides a high-density three-dimensional multilayer memory and a preparation method. The preparation method of the memory comprises the following steps: firstly forming a basic structure body; secondly, slotting the basic structure body; thirdly, forming a preset number of memory cell holes in the a segmentation groove, an insulating medium being arranged between every two adjacent memory cell holes, a vertical electrode being arranged in the memory cell hole, and a memory medium layer being arranged between the vertical electrode and an interdigital structure; and in the third step, before the memory medium is arranged, the preparation method comprises the following steps: performing doping diffusion on the first conducting medium located on the inner wall of the segmentation groove, so that the first conducting medium close to the inner wall of the segmentation groove forms a buffer area made of a low-doped semiconductor material.