Abstract: In some embodiments, in a method, a netlist is received. The netlist comprises a subcircuit that comprises a device and a rule check module. The rule check module specifies a plurality of terminals of the device subject to an operating space, and at least one parameter that controls a non-rectangular boundary of the operating space. The netlist is simulated to obtain simulation data associated with the terminals of the device. The operating space that has the non-rectangular boundary is formed by using the at least one parameter. The simulation data is checked against the operating space. A situation in which the checked simulation data does not fall within the operating space is reflected.

Abstract: A method includes receiving input information related to devices of an integrated circuit. A first simulation of the integrated circuit is performed over a first time period. Average temperature changes of the devices over the first time period are calculated. A second simulation of the integrated circuit is performed over a second time period using the average temperature changes of the devices. The first simulation and the second simulation are executed by a processor unit.

Abstract: The present disclosure provides systems for predicting semiconductor reliability. In an embodiment a method for predicting the semiconductor reliability includes receiving a degradation parameter input of a semiconductor device and using a degradation equation to determine a plurality of bias dependent slope values for degradation over a short time period according to the degradation parameter input. The plurality of slope values include at least two different slope values for degradation over time. The system accumulates the plurality of slope values and projects the accumulated slope values over a long time period to determine a stress effect for the semiconductor device.

Abstract: A method includes determining a mapping between model parameters and electrical parameters of integrated circuits. The model parameters are configured to be used by a simulation tool. A set of electrical parameters is provided, and the mapping is used to map the set of electrical parameters to a set of model parameters.

Abstract: A method includes providing an integrated circuit device comprising a plurality of input parameters and an electrical parameter. A simulation is performed using a simulation model to simulate a plurality of data of the electrical parameter, wherein the plurality of data are generated through simulation from a first plurality of input parameter sets reflecting values of the plurality of input parameters, and wherein the plurality of data is distributed in a range. A first sub-range among the range is selected. All of the plurality of data falling into the first sub-range are selected, and are fitted with corresponding ones of the first input parameter sets to generate a first function, wherein the electrical parameter is expressed as the first function of the plurality of input parameters. The first function is different from functions in the simulation model.

Abstract: A method includes determining a mapping between model parameters and electrical parameters of integrated circuits. The model parameters are configured to be used by a simulation tool. A set of electrical parameters is provided, and the mapping is used to map the set of electrical parameters to a set of model parameters.

Abstract: The present disclosure provides systems for predicting semiconductor reliability. In an embodiment a method for predicting the semiconductor reliability includes receiving a degradation parameter input of a semiconductor device and using a degradation equation to determine a plurality of bias dependent slope values for degradation over a short time period according to the degradation parameter input. The plurality of slope values include at least two different slope values for degradation over time. The system accumulates the plurality of slope values and projects the accumulated slope values over a long time period to determine a stress effect for the semiconductor device.

Abstract: Semiconductor device junction simulation is carried out utilizing models that are developed with series resistance extractions that improve their fidelity particularly in the high current regions of device operation. The models may also be tailored to account for geometric considerations of the semiconductor devices thereby allowing for a more flexible model and simulation by providing for geometric scaling capabilities.

Abstract: A method for reducing sidewall capacitance by 25% or more in an STI structure is described. A conformal barrier layer is deposited on sloped sidewalls in a shallow trench within a substrate. The trench is filled with a low k dielectric material which is planarized and etched back. Next a barrier cap layer is deposited that is different than the underlying low k dielectric layer. In one embodiment, the barrier cap layer is a SiCOH material that is modified for enhanced CMP performance that yields fewer surface scratches and defects. A nitride etch stop layer and a pad oxide are removed above an active area on the substrate to afford the final STI structure. Optionally, the barrier cap layer is omitted and the low k dielectric layer extends slightly above the substrate level. Total parasitic capacitance in the resulting MOS device is reduced by 15% or more.

Abstract: A method for reducing sidewall capacitance by 25% or more in an STI structure is described. A conformal barrier layer is deposited on sloped sidewalls in a shallow trench within a substrate. The trench is filled with a low k dielectric material which is planarized and etched back. Next a barrier cap layer is deposited that is different than the underlying low k dielectric layer. In one embodiment, the barrier cap layer is a SiCOH material that is modified for enhanced CMP performance that yields fewer surface scratches and defects. A nitride etch stop layer and a pad oxide are removed above an active area on the substrate to afford the final STI structure. Optionally, the barrier cap layer is omitted and the low k dielectric layer extends slightly above the substrate level. Total parasitic capacitance in the resulting MOS device is reduced by 15% or more.

Abstract: A method of characterizing gate leakage current in the fabrication of integrated circuits is described. A MOSFET model is provided including a gate electrode deposed over a gate oxide layer on a substrate and source and drain regions associated with the gate electrode. Device current is measured at four terminals simultaneously wherein one of the terminals is a drain terminal. The other terminals are the source, gate, and substrate. The portion of the device current measured at the drain terminal that is contributed by gate current is evaluated. The evaluated gate current contribution is subtracted from the drain terminal current measurement to obtain pure drain current. Fitting procedures are performed to obtain curves for the device currents. The pure drain current is used to extract mobility model parameters.

Abstract: Semiconductor device junction simulation is carried out utilizing models that are developed with series resistance extractions that improve their fidelity particularly in the high current regions of device operation. The models may also be tailored to account for geometric considerations of the semiconductor devices thereby allowing for a more flexible model and simulation by providing for geometric scaling capabilities.

Abstract: A method for forming an SOI (Silicon-on-Insulator) semiconductor device and a SOI semiconductor device formed thereof, wherein the SOI semiconductor device comprises a source, a drain, and a gate formed upon a substrate. At least one P+ body contact region is generally located adjacent the source and away from a channel of the SOI semiconductor device. At least one poly tee may be connected to the gate, such that the poly tee passes through the P+ body contact region. The P+ body contact region and the source can be connected together on a surface of a silicon film utilizing a silicide, thereby forming the SOI semiconductor device.