Abstract: An in-line holographic microscope can be used to analyze on a frame-by-frame basis a video stream to track individual colloidal particles' three-dimensional motions. The system and method can provide real time nanometer resolution, and simultaneously measure particle sizes and refractive indexes. Through a combination of applying a combination of Lorenz-Mie analysis with selected hardware and software methods, this analysis can be carried out in near real time. An efficient particle identification methodology automates initial position estimation with sufficient accuracy to enable unattended holographic tracking and characterization.

Abstract: A method of dispatching wafer lots through a plurality of process chambers, wherein the process chambers are disposed in at least one machine. The method includes: receiving wafer lot information and process chamber data, wherein the wafer lot information identifies the wafer lots to be processed at the machine, and the process chamber data includes process information associated with the process chambers; determining a load factor of each process chamber based on the wafer lot information and process chamber data; receiving historical data of run lots previously processed through the process chambers, and determining a processing time of the wafer lots based on the historical data; generating a dispatching criteria for the wafer lots based on the load factors of the process chambers and the determined processing time of the wafer lots; and dispatching the wafer lots through the process chambers based on the dispatching criteria.

Abstract: A method for automatically collecting semiconductor manufacturing parameters of a manufacturing equipment is provided. The method includes reporting semiconductor manufacturing parameters obtained by self-monitoring of the manufacturing equipment and obtaining storage locations in an electronic data capture corresponding to reported semiconductor manufacturing parameters and transporting the reported semiconductor manufacturing parameters and corresponding storage locations. The method further includes receiving the reported semiconductor manufacturing parameters and the corresponding storage location and storing each reported semiconductor manufacturing parameters automatically into the electronic data capture of a manufacturing execution system according to the corresponding storage location.

Abstract: An optical metrology device determines physical characteristics of at least one via in a sample, such as a through-silicon vias (TSV), using signal strength data for modeling of the bottom critical dimension (BCD) and/or for refinement of the data used to determine a physical characteristic of the via, such as BCD and/or depth. The metrology device obtains interferometric data and generates height and signal strength data, from which statistical properties may be obtained. The height and signal strength data for the via is refined by removing noise using the statistical property, and the BCD for the via may be determined using the refined height and signal strength data. In one implementation, a signal strength via map for a via is generated using signal strength data and is fit to a model to determine the BCD for the via.

Abstract: A semiconductor device comprising: a lower semiconductor package that comprises a first set of one or more semiconductor dies, an upper semiconductor package that is stacked on the lower semiconductor package, the upper semiconductor package comprises a second set of one or more semiconductor dies, and a first interconnect pad that is embedded in a top side of the lower semiconductor package to couple the upper semiconductor package to the lower semiconductor package.

Abstract: A large-format printing apparatus includes multiple printing head units. Each of the printing head units can intermittently and steppingly move in a first direction and has a printing nozzle which can move reciprocatingly in a second direction which is perpendicular to the first direction for printing sub-images. Before printing starts, the printing head units are disposed at one end of a printing medium, and arranged to seamlessly splice the sub-images printed by the printing head units into a complete large-format printing image.

Abstract: A method and system for controlled fractionation of particles. A sample having a plurality of particles of different size distributions. A uniform array for the preparing of optical traps having a selected array lattice constant. The plurality of particles for inputting the plurality of particles to the uniform array of optical traps at a driving direction angle ? and the plurality of particles separating along different directions ?v based on variable particle attributes.

Abstract: A semiconductor device comprising: a lower semiconductor package that comprises a first set of one or more semiconductor dies, an upper semiconductor package that is stacked on the lower semiconductor package, the upper semiconductor package comprises a second set of one or more semiconductor dies, and a first interconnect pad that is embedded in a top side of the lower semiconductor package to couple the upper semiconductor package to the lower semiconductor package.

Abstract: A semiconductor device comprising: a lower semiconductor package that comprises a first set of one or more semiconductor dies, an upper semiconductor package that is stacked on the lower semiconductor package, the upper semiconductor package comprises a second set of one or more semiconductor dies, and a first interconnect pad that is embedded in a top side of the lower semiconductor package to couple the upper semiconductor package to the lower semiconductor package.

Abstract: A method for analyzing porosity of a particle and a medium disposed in the porosity of the particle. A video-holographic microscope is provided to analyze interference patterns produced by providing a laser source to output a collimated beam, scattering the collimated beam off a particle and interacting with an unscattered beam to generate the interference pattern for analyzation to determine the refractive index of the particle and a medium disposed in the porosity of the particle to measure porosity and the medium.

Abstract: A large-format printing apparatus includes multiple printing head units. Each of the printing head units can intermittently and steppingly move in a first direction and has a printing nozzle which can move reciprocatingly in a second direction which is perpendicular to the first direction for printing sub-images. Before printing starts, the printing head units are disposed at one end of a printing medium, and arranged to seamlessly splice the sub-images printed by the printing head units into a complete large-format printing image.

Abstract: A method and system for controlled fractionation of particles. A sample having a plurality of particles of different size distributions. A uniform array for the preparing of optical traps having a selected array lattice constant. The plurality of particles for inputting the plurality of particles to the uniform array of optical traps at a driving direction angle and the plurality of particles separating along different directions based on variable particle attributes.

Abstract: An in-line holographic microscope can be used to analyze on a frame-by-frame basis a video stream to track individual colloidal particles' three-dimensional motions. The system and method can provide real time nanometer resolution, and simultaneously measure particle sizes and refractive indexes. Through a combination of applying a combination of Lorenz-Mie analysis with selected hardware and software methods, this analysis can be carried out in near real time. An efficient particle identification methodology automates initial position estimation with sufficient accuracy to enable unattended holographic tracking and characterization.

Abstract: A semiconductor device comprising: a lower semiconductor package that comprises a first set of one or more semiconductor dies, an upper semiconductor package that is stacked on the lower semiconductor package, the upper semiconductor package comprises a second set of one or more semiconductor dies, and a first interconnect pad that is embedded in a top side of the lower semiconductor package to couple the upper semiconductor package to the lower semiconductor package.