Patents by Inventor Keat Chuan Ng
Keat Chuan Ng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8120056Abstract: An electronic assembly includes a Light Emitting Diode (LED) mounted on a top surface of a heat spreader, at least two electrical contacts co-planar with the heat spreader, and at least one heat slug mounted on the top surface of the heat spreader, where the heat slug is made of high thermal conductive plastic.Type: GrantFiled: October 19, 2009Date of Patent: February 21, 2012Assignee: Avago Technologies ECBU IP (Singapore) Pte. Ltd.Inventors: Lig Yi Yong, Kean Loo Keh, Keat Chuan Ng
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Patent number: 8115385Abstract: A light source having a lead frame, a body, and a plurality of dies, each die having an LED thereon is disclosed. The body includes a top surface, a bottom surface and a plurality of side surfaces. The lead frame includes first, second, and third sections, the first section includes a die mounting area having a first protrusion that passes through the body and terminates in a pad on the bottom surface. The second and third sections each include a protrusion that is bent to form first and second leads that run along one of the side surfaces. Each die is bonded to the die mounting area such that a first contact is electrically connected to the die mounting area, and a second contact is connected to one of the second and third sections. The first protrusion of the first section provides improved heat transfer.Type: GrantFiled: August 30, 2010Date of Patent: February 14, 2012Assignee: Avago Technologies ECBU IP (Singapore) Pte. Ltd.Inventors: Aizar Abdul Karim Norfidathul, Chiau Jin Lee, Kheng Leng Tan, Keat Chuan Ng, Kiam Soon Ong
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Publication number: 20110176573Abstract: In an embodiment, the invention provides a SLCC package comprising first and second electrically conductive terminals, a polysiloxane and glass fiber structural body, a light source and a polysiloxane encapsulant. The first and second electrically conductive terminals are attached to the polysiloxane and glass fiber structural body. The light source is electrically connected to the first and second electrically conductive terminals. The polysiloxane and glass fiber structural body has a cavity that contains at least a portion of the polysiloxane encapsulant.Type: ApplicationFiled: March 30, 2011Publication date: July 21, 2011Applicant: Avago Technologies ECBU IP (Singapore) Pte. Ltd.Inventors: Kheng Leng Tan, Keat Chuan Ng, Kee Hon Lee
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Publication number: 20110140133Abstract: The light intensity emitted from a package is increased by adjusting a portion of the package encapsulant so that light impacting the side walls of the adjusted encapsulant portion will encounter total internal reflection (TIR) with the reflected light directed toward the top surface of the package. The adjusted portion of the package is positioned so that air can be used as the second (exterior) medium with the critical TIR angle being such that light emitted from a light source (such as from an LED die) will be directed primarily so as to escape the package from the top surface as opposed to being scattered internal to the package. In one embodiment, a lower portion of the encapsulant is surrounded by a casing to inwardly direct light from the light source that impacts the side of the encapsulant with an angle less than the critical TIR angle.Type: ApplicationFiled: December 15, 2010Publication date: June 16, 2011Applicant: Avago Technologies General IP (Singapore) Pte. Ltd.Inventors: Keat Chuan Ng, Wei Liam Loo, Chiau Jin Lee, Yean Chon Yaw
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Publication number: 20110089460Abstract: An electronic assembly includes a Light Emitting Diode (LED) mounted on a top surface of a heat spreader, at least two electrical contacts co-planar with the heat spreader, and at least one heat slug mounted on the top surface of the heat spreader, where the heat slug is made of high thermal conductive plastic.Type: ApplicationFiled: October 19, 2009Publication date: April 21, 2011Applicant: Avago Technologies ECBU IP (Singapore) Pte. Ltd.Inventors: Lig Yi Yong, Kean Loo Keh, Keat Chuan Ng
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Publication number: 20110079802Abstract: Embodiments of light sources are disclosed herein. An embodiment of the light source comprises a lead frame having a first side and a second side. A hole extends through the lead frame between the first side and the second side. An adhesive is located in the hole and extends beyond the hole, wherein the adhesive extends beyond the diameter of the hole on the first side and the second side of the first lead frame. A light emitter adhered to the adhesive proximate the first side of the first lead frame.Type: ApplicationFiled: October 5, 2009Publication date: April 7, 2011Applicant: Avago Technologies ECBU IP (Singapore) Pte. Ltd.Inventors: Keat Chuan Ng, Lig Yi Yong, Kheng Leng Tan
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Publication number: 20110044062Abstract: An embodiment of a light source comprises a first lead and a second lead. The first lead comprises a first mounting surface wherein a first light emitter is connectable to the first mounting surface, a support member attached to the first mounting surface, a conductor portion attached to the support member, and at least one tab extending from the first mounting surface, the at least one tab being used to hold the first lead during fabrication. The second lead is second lead located adjacent the first lead and comprises a second mounting surface wherein a second light emitter is connectable to the second mounting surface, at least two support members attached to the second mounting surface, and a conductor portion attached to each of the support members.Type: ApplicationFiled: August 19, 2009Publication date: February 24, 2011Applicant: AVAGO TECHNOLOGIES ECBU IP (SINGAPORE) PTE. LTD.Inventors: Keat Chuan Ng, Chiau Jin Lee, Kheng Leng Tan, Aizar Abdul Karim Norfidathul
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Publication number: 20100320485Abstract: A light source having a lead frame, a body, and a plurality of dies, each die having an LED thereon is disclosed. The body includes a top surface, a bottom surface and a plurality of side surfaces. The lead frame includes first, second, and third sections, the first section includes a die mounting area having a first protrusion that passes through the body and terminates in a pad on the bottom surface. The second and third sections each include a protrusion that is bent to form first and second leads that run along one of the side surfaces. Each die is bonded to the die mounting area such that a first contact is electrically connected to the die mounting area, and a second contact is connected to one of the second and third sections. The first protrusion of the first section provides improved heat transfer.Type: ApplicationFiled: August 30, 2010Publication date: December 23, 2010Applicant: AVAGO TECHNOLOGIES ECBU IP (SINGAPORE) PTE. LTD.Inventors: Aizar Abdul Karim Norfidathul, Chiau Jin Lee, Kheng Leng Tan, Keat Chuan Ng, Kiam Soon Ong
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Publication number: 20100289055Abstract: In an embodiment, the invention provides a SLCC package comprising first and second electrically conductive terminals, a polysiloxane and glass fiber structural body, a light source and a polysiloxane encapsulant. The first and second electrically conductive terminals are attached to the polysiloxane and glass fiber structural body. The light source is electrically connected to the first and second electrically conductive terminals. The polysiloxane and glass fiber structural body has a cavity that contains at least a portion of the polysiloxane encapsulant.Type: ApplicationFiled: May 14, 2009Publication date: November 18, 2010Applicant: AVAGO TECHNOLOGIES ECBU IP (SINGAPORE) PTE. LTD.Inventors: Kheng Leng Tan, Keat Chuan Ng, Kee Hon Lee
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Publication number: 20100264450Abstract: Embodiments of a light source are disclosed herein. An embodiment of the light source comprises a first terminal and a second terminal. The first terminal comprises a first terminal first portion and a first terminal second portion, wherein at least a portion of the first terminal second portion is located on a first plane, the first terminal second portion comprising at least two contacts separated by a space. A second terminal comprises a second terminal first portion and a second terminal second portion. The second terminal first portion is located proximate the first terminal first portion. The second terminal second portion is located substantially on the first plane and in the space. A light emitter is affixed to the first terminal first portion, the light emitter is electrically connected to the first terminal first portion. A connection exists between the light emitter and the second terminal first portion.Type: ApplicationFiled: April 20, 2009Publication date: October 21, 2010Applicant: Avago Technologies ECUBU IP (Singapore) Pte. Ltd.Inventors: Aizar Abdul Karim Norfidathul, Chiau Jin Lee, Keat Chuan Ng
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Patent number: 7800304Abstract: A light source having a lead frame, a body, and a plurality of dies, each die having an LED thereon is disclosed. The body includes a top surface, a bottom surface and a plurality of side surfaces. The lead frame includes first, second, and third sections, the first section includes a die mounting area having a first protrusion that passes through the body and terminates in a pad on the bottom surface. The second and third sections each include a protrusion that is bent to form first and second leads that run along one of the side surfaces. Each die is bonded to the die mounting area such that a first contact is electrically connected to the die mounting area, and a second contact is connected to one of the second and third sections. The first protrusion of the first section provides improved heat transfer.Type: GrantFiled: January 12, 2007Date of Patent: September 21, 2010Assignee: Avago Technologies ECBU IP (Singapore) Pte. Ltd.Inventors: Aizar Abdul Karim Norfidathul, Chiau Jin Lee, Kheng Leng Tan, Keat Chuan Ng, Kiam Soon Ong
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Patent number: 7547583Abstract: A packaged circuit and method for packaging an integrated circuit are disclosed. The packaged circuit has a lead frame, an integrated circuit chip, and an encapsulating layer. The lead frame has first and second sections, the first section including a lateral portion, a chip mounting area and a first extension. The integrated circuit chip is mounted in the chip mounting area and is in thermal contact with the chip mounting area. The encapsulating layer has top, bottom, and first and second side surfaces. The first extension is bent to provide a first heat path from the chip mounting area to the bottom surface. The heat path connects the heat chip mounting area to the bottom surface without passing through the first and second side surfaces and provides a heat path that has less thermal resistance than the heat path through either the lateral portion or the second section.Type: GrantFiled: March 7, 2008Date of Patent: June 16, 2009Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.Inventors: Kee Yean Ng, Hui Peng Koay, Chiau Jin Lee, Kheng Leng Tan, Wei Liam Loo, Keat Chuan Ng, Aizar Abdul Karim Norfidathul
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Publication number: 20090129085Abstract: An exemplary embodiment of an optical device may include a lead frame with a plurality of leads and a reflector housing formed around the lead frame. The reflector housing includes a first end face and a second end face and a peripheral sidewall extending between the first end face and the second end face. The reflector housing includes a first pocket with a pocket opening in the first end face and a second pocket with a pocket opening in the second end face. At least one LED die is mounted in the first pocket of the reflector housing, and a light transmitting encapsulant is disposed in the first pocket and encapsulating the at least one LED die.Type: ApplicationFiled: November 16, 2007Publication date: May 21, 2009Applicant: AVAGO TECHNOLOGIES ECBU IP (SINGAPORE) PTE. LTD.Inventors: Abdul Karim Norfidathul Aizar, Chiau Jin Lee, Keat Chuan Ng, Kiam Soon Ong, Kheng Leng Tan
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Patent number: 7524087Abstract: An exemplary embodiment of an optical device may include a lead frame with a plurality of leads and a reflector housing formed around the lead frame. The reflector housing includes a first end face and a second end face and a peripheral sidewall extending between the first end face and the second end face. The reflector housing includes a first pocket with a pocket opening in the first end face and a second pocket with a pocket opening in the second end face. At least one LED die is mounted in the first pocket of the reflector housing, and a light transmitting encapsulant is disposed in the first pocket and encapsulating the at least one LED die.Type: GrantFiled: November 16, 2007Date of Patent: April 28, 2009Assignee: Avago Technologies ECBU IP (Singapore) Pte. Ltd.Inventors: Abdul Karim Norfidathul Aizar, Chiau Jin Lee, Keat Chuan Ng, Kiam Soon Ong, Kheng Leng Tan
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Patent number: 7514724Abstract: A light source having a die carrier, a lead frame, and an insulating body is disclosed. The die carrier includes a die mounting section connected to a heat transfer section. The die mounting section includes a die mounting area having a lead pad opening contained within the die mounting area. The lead frame includes a lead pad. An electrically insulating material fills the voids between the die carrier and the lead frame to maintain the lead frame and die carrier such that a surface of the heat transfer section is exposed on a surface of the body, the lead pad is positioned in the lead pad opening, and the die carrier is electrically isolated from the lead frame. A plurality of dies are attached to the die mounting area and connected to the lead pad.Type: GrantFiled: March 23, 2007Date of Patent: April 7, 2009Assignee: Avago Technologies ECBU IP (Singapore) Pte. Ltd.Inventors: Keat Chuan Ng, Chiau Jin Lee
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Publication number: 20080273340Abstract: A light source having a die carrier, a lead frame, and an insulating body is disclosed. The die carrier includes a die mounting section connected to a heat transfer section. The die mounting section includes a die mounting area having a lead pad opening contained within the die mounting area. The lead frame includes a lead pad. An electrically insulating material fills the voids between the die carrier and the lead frame to maintain the lead frame and die carrier such that a surface of the heat transfer section is exposed on a surface of the body, the lead pad is positioned in the lead pad opening, and the die carrier is electrically isolated from the lead frame. A plurality of dies are attached to the die mounting area and connected to the lead pad.Type: ApplicationFiled: March 23, 2007Publication date: November 6, 2008Inventors: Keat Chuan Ng, Chiau Jin Lee
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Publication number: 20080170391Abstract: A light source having a lead frame, a body, and a plurality of dies, each die having an LED thereon is disclosed. The body includes a top surface, a bottom surface and a plurality of side surfaces. The lead frame includes first, second, and third sections, the first section includes a die mounting area having a first protrusion that passes through the body and terminates in a pad on the bottom surface. The second and third sections each include a protrusion that is bent to form first and second leads that run along one of the side surfaces. Each die is bonded to the die mounting area such that a first contact is electrically connected to the die mounting area, and a second contact is connected to one of the second and third sections. The first protrusion of the first section provides improved heat transfer.Type: ApplicationFiled: January 12, 2007Publication date: July 17, 2008Inventors: Aizar Abdul Karim Norfidathul, Chiau Jin Lee, Kheng Leng Tan, Keat Chuan Ng, Kiam Soon Ong
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Publication number: 20080153190Abstract: A packaged circuit and method for packaging an integrated circuit are disclosed. The packaged circuit has a lead frame, an integrated circuit chip, and an encapsulating layer. The lead frame has first and second sections, the first section including a lateral portion, a chip mounting area and a first extension. The integrated circuit chip is mounted in the chip mounting area and is in thermal contact with the chip mounting area. The encapsulating layer has top, bottom, and first and second side surfaces. The first extension is bent to provide a first heat path from the chip mounting area to the bottom surface. The heat path connects the heat chip mounting area to the bottom surface without passing through the first and second side surfaces and provides a heat path that has less thermal resistance than the heat path through either the lateral portion or the second section.Type: ApplicationFiled: March 7, 2008Publication date: June 26, 2008Applicant: Avago Technologies General IP (Singapore) Pte. LtdInventors: Kee Yean Ng, Hui Peng Koay, Chiau Jin Lee, Kheng Leng Tan, Wei Liam Loo, Keat Chuan Ng, Aizar Abdul Karim Norfidathul
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Patent number: 7365407Abstract: A packaged circuit and method for packaging an integrated circuit are disclosed. The packaged circuit has a lead frame, an integrated circuit chip, and an encapsulating layer. The lead frame has first and second sections, the first section including a lateral portion, a chip mounting area and a first extension. The integrated circuit chip is mounted in the chip mounting area and is in thermal contact with the chip mounting area. The encapsulating layer has top, bottom, and first and second side surfaces. The first extension is bent to provide a first heat path from the chip mounting area to the bottom surface. The heat path connects the heat chip mounting area to the bottom surface without passing through the first and second side surfaces and provides a heat path that has less thermal resistance than the heat path through either the lateral portion or the second section.Type: GrantFiled: May 1, 2006Date of Patent: April 29, 2008Assignee: Avago Technologies General IP Pte LtdInventors: Kee Yean Ng, Hui Peng Koay, Chiau Jin Lee, Kheng Leng Tan, Wei Liam Loo, Keat Chuan Ng, Alzar Abdul Karim Norfidathul
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Patent number: D576966Type: GrantFiled: June 26, 2006Date of Patent: September 16, 2008Assignee: Avago Technologies General IP (Singapore) Pte Ltd.Inventors: Keat Chuan Ng, Chiau Jin Lee, Kheng Leng Tan, Wei Liam Loo