Abstract: A packaged circuit and method for packaging an integrated circuit are disclosed. The packaged circuit has a lead frame, an integrated circuit chip, and an encapsulating layer. The lead frame has first and second sections, the first section including a lateral portion, a chip mounting area and a first extension. The integrated circuit chip is mounted in the chip mounting area and is in thermal contact with the chip mounting area. The encapsulating layer has top, bottom, and first and second side surfaces. The first extension is bent to provide a first heat path from the chip mounting area to the bottom surface. The heat path connects the heat chip mounting area to the bottom surface without passing through the first and second side surfaces and provides a heat path that has less thermal resistance than the heat path through either the lateral portion or the second section.

Abstract: A light source having first and second phosphor-converted component light sources is disclosed. The first component light source includes a first LED that emits light at a first wavelength and a first luminescent conversion material layer that converts light of the first wavelength to light of a first output wavelength, and the second component light source includes a second LED that emits light at a second wavelength and a second luminescent conversion material layer that converts light of the second wavelength to light of a second output wavelength that is different from the first output wavelength. The first and second LEDs are constructed in the same material system, preferably in the same batch of wafers on the fabrication line. A controller generates a current through each of the first and second LEDs that results in the light source generating light that is perceived to be a predetermined color.

Abstract: A light emitting diode (“LED”) device that emits omni-directional light is disclosed. Such omni-directional LED device may include a LED chip capable of emitting light in all directions. In one example of one implementation, the LED chip is then assembled and sealed inside a casing, such as a glass casing or tube that is capable of emitting light in 360 degree beam pattern. Further, the anode and cathode, or P or N-type contacts, may be configured on the LED chip such that light is allowed to emit from the top and/or the bottom surface of the LED chip in the LED device and is further able to reflect outward and fill the casing or tube of the LED device with light capable of emitting omni-directionally.

Abstract: A light emitting device and method of making the device uses an encapsulant to create a hollow region within a chamber of the device. The encapsulant is configured to contact at least a portion of a light source of the device and a portion of a lens of the device. The hollow region within the chamber provides space for the encapsulant to expand and contract.

Abstract: A flash module includes a first light source emitting a first primary light has a first wavelength-converting overlay disposed on the first light source to provide a first color of light. The first wavelength-converting overlay includes a first plurality of quantum dots dispersed in a matrix material. The flash module also includes a second light source providing a second color of light.

Abstract: A light emitting device having a die that includes a light source that generates light of a first wavelength and a layer of phosphor particles covering the die is disclosed. The phosphor particles convert a portion of the light of the first wavelength to light of a second wavelength. The light source can be fabricated by attaching the light source to a substrate, and converting the light source by applying a light converting layer that includes a volatile carrier material and particles of a phosphor that convert light of the first wavelength to light of the second wavelength over the light source. The volatile carrier material is then caused to evaporate leaving a layer of the phosphor particles over the light source. A binder material can be incorporated in the volatile carrier for binding the phosphor particles to one another after the volatile carrier material is evaporated.

Abstract: An encapsulant containing nanoparticles that improve the heat and UV resistance properties of electroluminescent devices. The nanoparticles that are suspended in the encapsulant may be either oxides or non-oxides and may include SiO2, TiO2, Al2O3, ZrO2, Ti, TiB2, TiC, and TiN. The nanoparticles may range in size from 5 to 165 nm in diameter. The encapsulant containing nanoparticles may be used in an electroluminescent device by being deposited in a concave base cavity to cover a light source, such as a light-emitting diode (“LED”), positioned in the concave base cavity, and may also be applied in the form of a conformal coating that covers the light source. An electroluminescent device utilizing the encapsulant containing nanoparticles and a method of producing such a device is also provided.

Abstract: A lighting device having a light source, light pipe, and a light-dispensing element is disclosed. The light source emits light at a first wavelength and transmits that light to the light pipe. The light dispensing emitter includes an extended section coupled to the light pipe that emits light along the extended section, the extended section having a side surface through which light exits from the extended section. The extended section can include a medium that is transparent to light of the first wavelength and a plurality of scattering centers, the extended section having a shape such that light that is not scattered by the scattering centers is trapped within the extended section by internal reflection. The extended section can also include a light conversion material that converts light of the first wavelength to light of a second wavelength.

Abstract: An LED Device Having a Top Surface Heat Dissipator is provided. The LED Device Having a Top Surface Heat Dissipator includes a substrate body, and a light emitting diode over the substrate body. The LED Device Having a Top Surface Heat Dissipator also has an electrically and thermally conductive heat dissipator over the substrate body. A method of dissipating heat from an LED device is also provided.

Abstract: A lighting apparatus is described. One embodiment of the lighting apparatus includes a substrate and a lighting element. The lighting element is coupled to the substrate to emit light through a light exit plane. The light exit plane is substantially perpendicular to the substrate. By providing a lighting device with a substrate oriented perpendicular to the light exit plane of the lighting device, the lighting device can enable better mixing of the light from different LEDs. The lighting apparatus facilitates light mixing, generally, to minimize or eliminate dark spots on the diffusion panel. The lighting device also facilitates color mixing to produce relatively consistent white light on the diffusion panel.

Abstract: A light-emitting diode with an improved service life is provided. The diode is formed from a transparent outer shell that contains a heat-resistant encapsulant at least partially surrounding a light-emitting diode clip. The first encapsulant is compressed between the outer shell and a second encapsulant when it is sealed into the outer shell by the second encapsulant.

Abstract: Reflective members for use in encoder systems are provided. One embodiment comprises a reflective member comprising a reflective layer, at least another layer, and a reflective pattern comprising a first portion having a first reflective property and a second portion having a different reflective property. The reflective layer forms at least a part of the reflective pattern. In addition, the aforementioned first portion of the reflective member has a width of less than half of the grating period. The reflective member enables measurement of at least one operational attribute of an object.

Abstract: A New Moisture-Resistant LED Device with Ceramic Substrate is disclosed. The Moisture-Resistant LED Device with Ceramic Substrate includes a ceramic substrate having a concave cavity, a light emitting diode (“LED”) in the concave cavity, a filler body over the LED, and a window sealed at an interface with the ceramic substrate.

Abstract: A light source and method for controlling the same. The light source includes a first component light source that includes N LEDs, a photo-detector, and a collector, where N>1. Each LED has a light emitting chip in a package. The light emitting chip emits light in a forward direction and light in a side direction. The light generated in the forward direction is determined by a drive signal coupled to that LED. A portion of the light in the side direction leaves the package. The collector is positioned such that a portion of the light in the side direction that leaves the package of each of the LEDs is directed onto the photo-detector. The photo-detector generates N intensity signals, each intensity signal having an amplitude related to the intensity of the light emitted in the side direction by a corresponding one of the LEDs.

Abstract: An optical encoder module is employed to detect light modulated by a moveable member (e.g., code wheel). The optical encoder includes an emitter having a light-emitting element, and a transparent medium encapsulating the light-emitting element. The transparent medium has a convex aspherical external surface shaped so as to focus light received from the light-emitting element into a substantially collimated beam of light using a single refractive interface for illuminating the movable member. The optical encode module also includes a detector facing the emitter for detecting modulated light of the collimated beam transmitted through the movable member.

Abstract: A substantially planar substrate having opposed major surfaces is provided. The substrate includes a through hole that extends between the major surfaces. The through hole is filled with a conductive interconnecting element. A conductive mounting pad and a conductive connecting pad are formed on different ones of the major surfaces in electrical contact with the conductive interconnecting element. The packaging device formed by the method has a volume that is only a few times that of the semiconductor die and can be fabricated from materials that can withstand high-temperature die attach processes. The packaging device can be configured as the only packaging device used in the semiconductor device or as a submount for a semiconductor die that requires a high-temperature die attach process.

Abstract: A light emitting device has a light emitting diode (LED), a reflector cup, and one or more adjustment mechanisms to control the intensity profile of light emitted from the light emitting device. The reflector cup has a base and a sidewall extending outward from the base. A base adjustment mechanism controls the total amount of light reflected from the base and into the beam of light emitted from the light emitting mechanism by controlling the aggregate reflectivity of the base. A sidewall adjustment mechanism controls the angle of the sidewall relative to the base. A vertical adjustment mechanism vertically raises or lowers the LED relative to the base.

Abstract: A light emitting device in which a primary light generator, such as a light emitting diode (LED) or laser diode, is operable to emit a primary light that is received by a body of wavelength converting material. A portion of the primary light is absorbed by the body of wavelength converting material and is emitted as secondary light. The wavelength converting material contains phosphor nano-particles and larger phosphor particles. The phosphor nano-particles prevent transmission of primary light while the larger phosphor particles provide efficient light conversion.

Abstract: An omni-directional LED device is constructed such that light is prevented from exiting from the top of the LED device. In one embodiment, an opaque barrier is created and in some embodiments enhancement surfaces are created below the opaque barrier to increase lumen output from the device sides. In one embodiment, a reflecting structure is created to assist with horizontal light mixing. The horizontally mixed light is then redirected through a structure, such as an LED structure, to create a high lumen output, slender back-lighted display.

Abstract: A LED device including a first encapsulant that at least partially encapsulates a LED and resides within a light reflecting cavity, and a second encapsulant residing above the first encapsulant—wherein the first encapsulant is partially comprised of a first percentage of a first light reflecting substance. In addition, there is provided a method for constructing a LED device.