Abstract: A modularized signal conditioning apparatus system includes at least two slots formed in a coaxial cable. The slots are spaced apart so as to not reduce the measuring performance of the coaxial cable. Slots may be at least 40 mills from one another. In an ESD embodiment, within each slot is an ESD protection component, such as a pair of Shottky diodes coupled between the ground shell and the center conductor of the coaxial cable. Methods of producing modularized signal conditioning apparatus system are also described.

Abstract: A modularized signal conditioning apparatus system includes at least two slots formed in a coaxial cable. The slots are spaced apart so as to not reduce the measuring performance of the coaxial cable. Slots may be at least 40 mills from one another. In an ESD embodiment, within each slot is an ESD protection component, such as a pair of Shottky diodes coupled between the ground shell and the center conductor of the coaxial cable. Methods of producing modularized signal conditioning apparatus system are also described.

Abstract: A cable assembly including a coaxial cable having active components mounted thereon, a housing substantially surrounding the coaxial cable, and a launch connector mounted to the outside of the housing and in connection with the coaxial cable.

Abstract: A cable assembly including a coaxial cable having active components mounted thereon, a housing substantially surrounding the coaxial cable, and a launch connector mounted to the outside of the housing and in connection with the coaxial cable.

Abstract: A differential measurement probe has a ground clip system for electrically coupling outer shielding conductors of differential probing tips together. In one embodiment, the probing tips independently move vertically relative to each other with the ground clip system secured to each of the outer shielding conductors of the probing tips. In a further embodiment, the probing tips move both vertically and horizontally and the ground clip system has a spring wire member that is secured to the probe. The spring wire member is formed with various sections having various angles to each other that allows one section to slidably engage one of the outer shielding conductors on one of the probing tips and another section to slidably engage the outer shielding conductor of the other probing tip.

Abstract: A differential measurement probe has a ground clip system for electrically coupling outer shielding conductors of differential probing tips together. In one embodiment, the probing tips independently move vertically relative to each other with the ground clip system secured to each of the outer shielding conductors of the probing tips. In a further embodiment, the probing tips move both vertically and horizontally and the ground clip system has a spring wire member that is secured to the probe. The spring wire member is formed with various sections having various angles to each other that allows one section to slidably engage one of the outer shielding conductors on one of the probing tips and another section to slidably engage the outer shielding conductor of the other probing tip.

Abstract: A differential measurement probe has a ground clip system for electrically coupling outer shielding conductors of differential probing tips together. In one embodiment, the probing tips independently move vertically relative to each other with the ground clip system secured to each of the outer shielding conductors of the probing tips. In a further embodiment, the probing tips move both vertically and horizontally and the ground clip system has a spring wire member that is secured to the probe. The spring wire member is formed with various sections having various angles to each other that allows one section to slidably engage one of the outer shielding conductors on one of the probing tips and another section to slidably engage the outer shielding conductor of the other probing tip.

Abstract: A differential measurement probe has a ground clip system for electrically coupling outer shielding conductors of differential probing tips together. In one embodiment, the probing tips independently move vertically relative to each other with the ground clip system secured to each of the outer shielding conductors of the probing tips. In a further embodiment, the probing tips move both vertically and horizontally and the ground clip system has a spring wire member that is secured to the probe. The spring wire member is formed with various sections having various angles to each other that allows one section to slidably engage one of the outer shielding conductors on one of the probing tips and another section to slidably engage the outer shielding conductor of the other probing tip.

Abstract: A differential measurement probe has a ground clip system for electrically coupling outer shielding conductors of differential probing tips together. In one embodiment, the probing tips independently move vertically relative to each other with the ground clip system secured to each of the outer shielding conductors of the probing tips. In a further embodiment, the probing tips move both vertically and horizontally and the ground clip system has a spring wire member that is secured to the probe. The spring wire member is formed with various sections having various angles to each other that allows one section to slidably engage one of the outer shielding conductors on one of the probing tips and another section to slidably engage the outer shielding conductor of the other probing tip.

Abstract: A signal acquisition probe has a double cushioned spring loaded probing tip assembly disposed in a housing. A first compressive element produces a first pre-loaded compressive force and an increasing compressive force on the probing tip assembly and a second compressive element produces a second pre-loaded compressive force and an increasing compressive force on the probing tip assembly subsequent to the first increasing compressive force. First and second double cushioned spring loaded probing tip assemblies may be disposed in a housing to produce a differential signal acquisition probe.

Abstract: A measurement probe has a spring loaded probe assembly and a pressure sensor disposed in a housing. The pressure sensor forms an electrical switch for passing an activation signal to a EOS/ESD protection module in response to axial movement of the housing relative to the probe assembly. A first compressive element produces a first pre-loaded compressive force and an increasing compressive force on the probe assembly and a second compressive element produces a second pre-loaded compressive force and an increasing compressive force on the probe assembly subsequent to the first increasing compressive force.

Abstract: A differential measurement probe has spring loaded, double cushioned probe assemblies and a pressure sensors disposed in a housing. The pressure sensors forms an electrical switch having an electrical AND function for passing an activation signal to a EOS/ESD protection control module in response to axial movement of the housing relative to the probe assemblies. First compressive elements produces first pre-loaded compressive forces and increasing compressive forces on the probe assemblies and second compressive elements produces second pre-loaded compressive forces and increasing compressive forces on the probe assemblies subsequent to the first increasing compressive forces on the probe assemblies. An adjustment member allows variable spacing of the differential probing tips.

Abstract: A differential measurement probe has spring loaded probe assemblies and a pressure sensors disposed in a housing. The pressure sensors forms an electrical switch having an electrical AND function for passing an activation signal to a EOS/ESD protection control module in response to axial movement of the housing relative to the probe assemblies. First compressive elements produces first pre-loaded compressive forces and increasing compressive forces on the probe assemblies and second compressive elements produces second pre-loaded compressive forces and increasing compressive forces on the probe assemblies subsequent to the first increasing compressive forces on the probe assemblies.

Abstract: A butt joined electronic assembly has first and second matching coplanar transmission structures that are independently aligned in a proximate abutting relationship. The coplanar transmission structures are formed on respective first and second electrical elements that are secured on respective independently positioned and mechanically joined first and second open end face carriers. The first and second matching coplanar transmission structures are electrically coupled together via substantially flat electrical conductors.

Abstract: A butt joined electronic assembly has first and second coplanar transmission structures that are independently aligned in a proximate abutting relationship. The coplanar transmission structures are formed on at least a first standoff dielectric substrate and on first and second electrical elements. The standoff dielectric substrate is positioned in an abutting relationship with one of the electrical elements. The standoff dielectric substrate and the first and second electrical elements are secured on respective independently positioned and mechanically joined first and second open end face carriers. The first and second coplanar transmission structures are electrically coupled together via substantially flat electrical conductors.

Abstract: A measurement probe has housing in which are disposed a spring loaded coaxial probe assembly and a pressure sensor. The probe assembly is formed from a semi-rigid coaxial cable having a probing tip formed at one end and a coaxial connector at the other end. The pressure sensor has first electrically conductive contact secured and electrically coupled to the semi-rigid coaxial cable and a second electrically conductive contact positioned and secured within the internal cavity of the housing. The probing tip is coupled to electrical ground via a control module when the housing is in a first position and the probing tip is coupled to the input circuitry of the measurement test instrument via the control module in response to an activation signal generated by the pressure sensor in response to movement of the housing to a second position and coupled to the control module.

Abstract: A measurement probing system has a measurement probe having a housing, spring loaded coaxial probe assembly and a pressure sensor that generates a resistive activation signal in response to movement of the housing in relation to the spring loaded coaxial probe assembly. The activation signal is applied to control circuitry in a control module for generating an output signal to drive an RF relay to couple the probing tip of the measurement probe from electrical to input circuitry of a measurement test instrument. The control circuitry further includes a TTL buffer circuit for generating the output signal in response to a TTL logic signal from a controller for automated testing of a device under test.

Abstract: A butt joined electrical apparatus has an open end face carrier or housing on which is positioned an electrical element. An electrical device and a coplanar transmission structure is formed on the electrical element with the coplanar transmission structure disposed toward the open end face of the carrier or housing. The electrical device coupled an electrical signal to and from a mating opto-electrical apparatus or housing. The coplanar transmission structure is independently aligned in three mutually perpendicular directions and in a proximate abutting relationship with another matching coplanar transmission structure formed on an opto-electrical element of the mating opto-electrical apparatus or housing. The electrical and opto-electrical apparatuses are independently positioned and mechanically joined together with the matching coplanar transmission structures electrically coupled together via substantially flat electrical conductors.

Abstract: A butt joined opto-electrical apparatus has an open end face carrier or housing on which is positioned an opto-electrical element. An opto-electrical device and a coplanar transmission structure is formed on the opto-electrical element with the coplanar transmission structure disposed toward the open end face of the carrier or housing. The opto-electrical device is coupled to receive and optical signal from an optical waveguide. The coplanar transmission structure is independently aligned in three mutually perpendicular directions and in a proximate abutting relationship with another matching coplanar transmission structure formed on an electrical element of a mating electrical apparatus or housing. The opto-electrical and electrical apparatus are independently positioned and mechanically joined together with the matching coplanar transmission structures electrically coupled together via substantially flat electrical conductors.

Abstract: A butt joined electronic module has first and second coplanar transmission structures that are independently aligned in a proximate abutting relationship. The coplanar transmission structures are formed on respective first and second electrical elements that are secured on respective independently positioned and mechanically joined carrier and housing. The first and second coplanar transmission structures are electrically coupled together via substantially flat electrical conductors. The carrier and housing are bonded together as a single module.