Patents by Inventor Keigo Obata

Keigo Obata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6338787
    Abstract: To provide a plating method, which enables wide industrial use of the redox system electroless plating method having excellent characteristics, and a plating bath precursor which is preferable for the plating method. The plating method comprises a process oxidizing first metal ions of a redox system of a plating bath from a lower oxidation state to a high oxidation state, and second metal ions of said redox system are reduced and deposited onto the surface of an object to be plated, wherein a process is provided in which by supplying the electrical current to the plating bath, the first metal ions are reduced from said lower oxidation state to thereby activate the plating bath. The plating bath precursor is formed stabilizing the plating bath so that reduction and deposition of the second metal ions substantially do not occur in order to improve its storing performance.
    Type: Grant
    Filed: April 5, 2000
    Date of Patent: January 15, 2002
    Assignees: Daiwa Fine Chemicals Co., Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Keigo Obata, Dong-Hyun Kim, Takao Takeuchi, Seiichiro Nakao, Shinji Inazawa, Ayao Kariya, Masatoshi Majima, Shigeyoshi Nakayama
  • Patent number: 6235093
    Abstract: An aqueous solution for obtaining a noble metal by chemical reduction containing at least one water-soluble compound or complex of a metal selected from the group consisting of gold, platinum, silver, and palladium as a source of the metal to be deposited, and at least one mercapto compound or sulfide compound or a salt thereof as a reducing agent. The reducing agent is typically mercaptoacetic acid, 2-mercaptopropionic acid, 2-aminoethanethiol, 2-mercaptoethanol, glucose cysteine, 1-thioglycerol, sodium mercaptopropanesulfonate, N-acetylmethionine, thiosalicylic acid, 2-thiazoline-2-thiol, 2,5-dimercapto-1,3,4-thiadiazole, 2-benzothiazolethiol, or 2-benzimidazolethiol. They may be used singly or in combination.
    Type: Grant
    Filed: June 28, 1999
    Date of Patent: May 22, 2001
    Assignee: Daiwa Fine Chemicals Co., Ltd.
    Inventors: Yoshiaki Okuhama, Takao Takeuchi, Keigo Obata, Yasuhito Kohashi, Hidemi Nawafune
  • Patent number: 6183545
    Abstract: An aqueous solution for the reductive deposition of metals comprising, besides water, (A) a phosphine of the general formula (1)  in which R1, R2, and R3 denote lower alkyl groups, at least one of which being hydroxy-or amino-substituted lower alkyl group, and (B) a soluble compound of a metal or a compound of a metal solubilized through the formation of a soluble complex by said phosphine.
    Type: Grant
    Filed: June 28, 1999
    Date of Patent: February 6, 2001
    Assignee: Daiwa Fine Chemicals Co., Ltd.
    Inventors: Yoshiaki Okuhama, Takao Takeuchi, Masakazu Yoshimoto, Shigeru Takatani, Emiko Tanaka, Masayuki Nishino, Yuji Kato, Yasuhito Kohashi, Kyoko Kuba, Tetsuya Kondo, Keiji Shiomi, Keigo Obata, Mitsuo Komatsu, Hidemi Nawafune
  • Patent number: 4992154
    Abstract: A brush for use in electrolytic treatment having a brush body including an electrode connected to one terminal of a D.C. source and contacting a workpiece connected to the other terminal of the D.C. source. The brush body comprises a forward portion defining an electrode compartment housing an electrode contact. An electrode holder is removably mounted in the compartment.
    Type: Grant
    Filed: August 18, 1989
    Date of Patent: February 12, 1991
    Assignee: Marui Mekki Kogyo Yugen Kaisha
    Inventors: Yoshiaki Ida, Keigo Obata
  • Patent number: 4673470
    Abstract: A tin, lead, or tin-lead alloy plating bath comprising, as essential ingredients, an alkali metal salt, and a soluble divalent tin compound or/and a lead compound, all of an aliphatic or aromatic sulfocarboxylic acid of the general formula ##STR1## wherein R is a C.sub.1-4 hydrocarbon radical, M.sub.1 is a hydrogen atom or alkali metal atom, M.sub.2 is an alkali metal atom, and X.sub.1 and X.sub.2 are each a hydrogen atom, OH, COON, or SO.sub.3 N (where N represents a hydrogen atom or alkali metal atom).
    Type: Grant
    Filed: February 21, 1986
    Date of Patent: June 16, 1987
    Assignees: Keigo Obata, Nobuyasu Dohi, Daiwa Fine Chemicals Co., Ltd., Ishihara Chemical Co., Ltd.
    Inventors: Keigo Obata, Nobuyasu Dohi, Yoshiaki Okuhama, Seishi Masaki, Yukiyoshi Okada, Masakazu Yoshimoto
  • Patent number: 4555314
    Abstract: A tin-lead alloy plating bath based on a principal plating bath comprising an alkanesulfonic or alkanolsulfonic acid and both bivalent tin and lead salts thereof is characterized by the addition of a guanamine compound having the general formula ##STR1## wherein R.sub.1 and R.sub.2, which may be the same or different, represent each a hydrogen atom, C.sub.1-18 straight- or branched-chain alkyl radical, C.sub.1-18 straight- or branched-chain alkoxy-lower alkyl radical, or a C.sub.3-7 cycloalkyl radical, or R.sub.1 and R.sub.2 may combine to form a carbon cycle or hetero cycle, and A represents a lower alkylene radical.
    Type: Grant
    Filed: September 10, 1984
    Date of Patent: November 26, 1985
    Assignees: Obata, Dohi, Daiwa Fine Chemicals Co. Ltd., Ishihaa Chemical Co., Ltd.
    Inventors: Keigo Obata, Nobuyasu Dohi, Yoshiaki Okuhama, Seishi Masaki, Yukiyoshi Okada, Tadashi Yoshida
  • Patent number: 4459185
    Abstract: A tin, lead or tin-lead alloy plating bath, which comprises(A) a principal plating bath containing an alkanesulfonic or alkanolsulfonic acid, and either a divalent tin salt or a divalent lead salt thereof or both;(B) at least one of surfactants comprising(a) a cationic surfactant selected from the group consisting of quarternary ammonium salts, alkyl pyridinium salts, alkyl imidazolinium salts and higher alkyl amine salts,(b) an amphoteric surfactant selected from betaines, or(c) a nonionic surfactant selected from the group consisting of condensation products of ethylene oxide and/or propylene oxide with a styrenated phenol, a higher alcohol, an alkylphenol, an alkylnaphthol, a fatty acid amide, a sorbitan or a phosphate; and(C) at least one of levelling agents selected from the group consisting of alkylidene sulfamic acids, quinolinol derivatives, benzotriazole derivatives, dialkylidene o-phenylene diamines, benzaldehyde derivatives, triazine derivatives, salicylic acid derivatives and nitriles.
    Type: Grant
    Filed: September 16, 1983
    Date of Patent: July 10, 1984
    Assignees: Obata, Doni, Daiwa, Fine Chemicals Co., Ltd., Ishibara Chemical Co., Ltd.
    Inventors: Keigo Obata, Nobuyasu Dohi, Yoshiaki Okuhama, Seishi Masaki, Yukiyoshi Okada, Masakazu Yoshimoto
  • Patent number: 4132610
    Abstract: A method of electroplating of tin-lead alloys, which comprises using a solution containing hydroxyalkyl sulfonic acid and its divalent tin salts and lead salts, said solution being mixed with reaction products of acetaldehyde with O-toluidine as additives for brightening.
    Type: Grant
    Filed: May 18, 1976
    Date of Patent: January 2, 1979
    Assignee: Hyogo Prefectural Government
    Inventors: Nobuyasu Dohi, Keigo Obata