Abstract: A substrate processing apparatus includes: a mixer configured to mix sulfuric acid as a first component and a second component different from the first component to prepare an etchant; a nozzle configured to eject the etchant to a substrate; a first component supplier including a first flow path that supplies the first component to the mixer, a first instantaneous flowmeter and a first flow rate controller provided in the first flow path; a second component supplier including a second flow path different from the first flow path and configured to supply the second component to the mixer, a second instantaneous flowmeter and a second flow rate controller provided in the second flow path; and a controller configured to control the first and second flow rate controllers using average flow rates of the first component and the second component during the ejection of the etchant to the substrate.

Abstract: A substrate processing apparatus includes: a mixer configured to mix sulfuric acid as a first component and a second component different from the first component to prepare an etchant; a nozzle configured to eject the etchant to a substrate; a first component supplier including a first flow path that supplies the first component to the mixer, a first instantaneous flowmeter and a first flow rate controller provided in the first flow path; a second component supplier including a second flow path different from the first flow path and configured to supply the second component to the mixer, a second instantaneous flowmeter and a second flow rate controller provided in the second flow path; and a controller configured to control the first and second flow rate controllers using average flow rates of the first component and the second component during the ejection of the etchant to the substrate.

Abstract: A substrate processing apparatus includes: a mixer configured to mix sulfuric acid as a first component and a second component different from the first component to prepare an etchant; a nozzle configured to eject the etchant to a substrate; a first component supplier including a first flow path that supplies the first component to the mixer, a first instantaneous flowmeter and a first flow rate controller provided in the first flow path; a second component supplier including a second flow path different from the first flow path and configured to supply the second component to the mixer, a second instantaneous flowmeter and a second flow rate controller provided in the second flow path; and a controller configured to control the first and second flow rate controllers using average flow rates of the first component and the second component during the ejection of the etchant to the substrate.

Abstract: A liquid processing apparatus includes: a substrate processing unit; a supply line that supplies the fluid to the substrate processing unit; a flow meter that measures a flow rate of the fluid flowing through the supply line; a flow rate adjustment mechanism that adjusts the flow rate of the fluid flowing through the supply line; and a controller that control the flow rate adjustment mechanism based on a measurement result of the flow meter. The controller receives the measurement result at a first cycle. When the measurement result of the flow meter indicates that the flow rate of the fluid flowing through the supply line is included in a preset range, the controller causes the flow rate adjustment mechanism to adjust the flow rate of the fluid flowing through the supply line at a cycle having a time interval longer than a time interval of the first cycle.

Abstract: Disclosed is a processing apparatus that includes a chamber accommodating a workpiece, a nozzle provided within the chamber, a measuring unit measuring the supply flow rate of the processing fluid supplied to the nozzle, an opening/closing unit performing opening/closing of the flow path of the processing fluid, and a controller. The controller sends an opening/closing operation signal that causes the opening/closing unit to perform an opening/closing operation according to recipe information that indicates processing contents. After sending the opening/closing operation signal to the opening/closing unit according to the recipe information, the controller starts the integration of the supply flow rate based on the measurement result of the measuring unit, monitors the rise of the supply flow rate based on the calculated integrated amount, and when supplying a specific flow rate, monitors the supply flow rate based on a value actually measured by the measuring unit.

Abstract: A plasma processing apparatus includes a storage; processors; a liquid supply which supplies, into the storage, at least a first liquid composed of a processing liquid or source liquids for composing the processing liquid; a detector which detects a value of a parameter indicating a state of the first liquid supplied into the storage or a state of the processing liquid in the storage; and a controller which controls the processors to perform a liquid processing in sequence. The controller determines, based on a detection result of the value of the parameter, whether it is possible to supply the processing liquid continuously into a preset number of processors concurrently under a condition requested by the processors, and, if not, the controller performs a simultaneous processing restricting control of reducing a number of processors which are supposed to perform the liquid processing concurrently to be lower than the preset number.

Abstract: A plasma processing apparatus includes a storage; processors; a liquid supply which supplies, into the storage, at least a first liquid composed of a processing liquid or source liquids for composing the processing liquid; a detector which detects a value of a parameter indicating a state of the first liquid supplied into the storage or a state of the processing liquid in the storage; and a controller which controls the processors to perform a liquid processing in sequence. The controller determines, based on a detection result of the value of the parameter, whether it is possible to supply the processing liquid continuously into a preset number of processors concurrently under a condition requested by the processors, and, if not, the controller performs a simultaneous processing restricting control of reducing a number of processors which are supposed to perform the liquid processing concurrently to be lower than the preset number.

Abstract: A substrate liquid processing apparatus includes a tank; a circulation line; a processing unit connected to the circulation line through a branch line and configured to perform a liquid processing on a substrate using a processing liquid flowing through the circulation line; a processing liquid producing mechanism configured to produce the processing liquid by mixing at least two kinds of raw material liquids supplied from respective raw material liquid sources at a controlled mixing ratio; a concentration measuring device configured to measure a concentration of the processing liquid flowing through the circulation line and a concentration of the processing liquid flowing through the processing liquid supply line; and a control device configured to control the processing liquid producing mechanism based on the measured concentrations of the processing liquid.

Abstract: Disclosed is a processing apparatus including a chamber, at least one nozzle, a measuring unit, an opening/closing unit, and a controller. The chamber accommodates a workpiece therein. The nozzle is provided in the chamber to supply a processing fluid toward the workpiece. The measuring unit measures a supply flow rate of the processing fluid supplied to the nozzle. The opening/closing unit performs opening/closing of a flow path of the processing fluid to be supplied to the nozzle. The controller outputs opening and closing operation signals at a preset timing. After outputting the opening operation signal, the controller calculates an integrated amount of the processing fluid based on a measurement result of the measuring unit, and performs an output timing change processing to change a timing of outputting the opening or closing operation signal from the preset timing based on the calculated integrated amount.

Abstract: A substrate liquid processing apparatus includes a tank; a circulation line; a processing unit connected to the circulation line through a branch line and configured to perform a liquid processing on a substrate using a processing liquid flowing through the circulation line; a processing liquid producing mechanism configured to produce the processing liquid by mixing at least two kinds of raw material liquids supplied from respective raw material liquid sources at a controlled mixing ratio; a concentration measuring device configured to measure a concentration of the processing liquid flowing through the circulation line and a concentration of the processing liquid flowing through the processing liquid supply line; and a control device configured to control the processing liquid producing mechanism based on the measured concentrations of the processing liquid.

Abstract: A substrate liquid processing apparatus includes a tank; a circulation line; a processing unit connected to the circulation line through a branch line and configured to perform a liquid processing on a substrate using a processing liquid flowing through the circulation line; a processing liquid producing mechanism configured to produce the processing liquid by mixing at least two kinds of raw material liquids supplied from respective raw material liquid sources at a controlled mixing ratio; a concentration measuring device configured to measure a concentration of the processing liquid flowing through the circulation line and a concentration of the processing liquid flowing through the processing liquid supply line; and a control device configured to control the processing liquid producing mechanism based on the measured concentrations of the processing liquid.

Abstract: A liquid processing apparatus includes: a substrate processing unit; a supply line that supplies the fluid to the substrate processing unit; a flow meter that measures a flow rate of the fluid flowing through the supply line; a flow rate adjustment mechanism that adjusts the flow rate of the fluid flowing through the supply line; and a controller that control the flow rate adjustment mechanism based on a measurement result of the flow meter. The controller receives the measurement result at a first cycle. When the measurement result of the flow meter indicates that the flow rate of the fluid flowing through the supply line is included in a preset range, the controller causes the flow rate adjustment mechanism to adjust the flow rate of the fluid flowing through the supply line at a cycle having a time interval longer than a time interval of the first cycle.

Abstract: Disclosed is a processing apparatus including a chamber, at least one nozzle, a measuring unit, an opening/closing unit, and a controller. The chamber accommodates a workpiece therein. The nozzle is provided in the chamber to supply a processing fluid toward the workpiece. The measuring unit measures a supply flow rate of the processing fluid supplied to the nozzle. The opening/closing unit performs opening/closing of a flow path of the processing fluid to be supplied to the nozzle. The controller outputs opening and closing operation signals at a preset timing. After outputting the opening operation signal, the controller calculates an integrated amount of the processing fluid based on a measurement result of the measuring unit, and performs an output timing change processing to change a timing of outputting the opening or closing operation signal from the preset timing based on the calculated integrated amount.

Abstract: Disclosed is a processing apparatus that includes a chamber accommodating a workpiece, a nozzle provided within the chamber, a measuring unit measuring the supply flow rate of the processing fluid supplied to the nozzle, an opening/closing unit performing opening/closing of the flow path of the processing fluid, and a controller. The controller sends an opening/closing operation signal that causes the opening/closing unit to perform an opening/closing operation according to recipe information that indicates processing contents. After sending the opening/closing operation signal to the opening/closing unit according to the recipe information, the controller starts the integration of the supply flow rate based on the measurement result of the measuring unit, monitors the rise of the supply flow rate based on the calculated integrated amount, and when supplying a specific flow rate, monitors the supply flow rate based on a value actually measured by the measuring unit.

Abstract: A substrate liquid processing apparatus includes a tank; a circulation line; a processing unit connected to the circulation line through a branch line and configured to perform a liquid processing on a substrate using a processing liquid flowing through the circulation line; a processing liquid producing mechanism configured to produce the processing liquid by mixing at least two kinds of raw material liquids supplied from respective raw material liquid sources at a controlled mixing ratio; a concentration measuring device configured to measure a concentration of the processing liquid flowing through the circulation line and a concentration of the processing liquid flowing through the processing liquid supply line; and a control device configured to control the processing liquid producing mechanism based on the measured concentrations of the processing liquid.

Abstract: The liquid flow rate control apparatus includes a first flow rate control unit which includes a first flow rate control valve for a small flow rate with a first controlled flow rate range, and a second flow rate control unit which includes a second flow rate control valve for a large flow rate with a second controlled flow rate range. In particular, an overlapped range is present between the first and second controlled flow rate ranges and a liquid flows on either any one or both of the first and second flow rate control units depending on variation of a required value of a total rate. The flow rate on any one of the first and second flow rate control units is maintained and the flow rate on the other one increases while increasing the total flow rate of the liquids.

Abstract: Disclosed is a substrate processing apparatus capable of decreasing the frequency of shutdown of the apparatus due to lack of processing liquid in a processing liquid supply unit, as well as efficiently using the processing liquid to improve a yield ratio. The substrate processing apparatus includes a plurality of liquid processing units to conduct liquid processing of substrates a substrate carrying unit to carry the substrates in and out of the liquid processing units, a processing liquid supply unit to supply the liquid processing units with processing liquid, and a level gauge to detect an amount of the processing liquid remaining in the processing liquid reservoir of the processing liquid supply unit. The carry of the substrates in the liquid processing units is suspended when the level gauge detects that the amount of the processing liquid remaining in the processing liquid reservoir is below a predetermined threshold.

Abstract: Disclosed is a liquid flow rate control apparatus including a first flow rate control unit which includes a first flow rate control valve for a small flow rate with a first controlled flow rate range, and a second flow rate control unit which includes a second flow rate control valve for a large flow rate with a second controlled flow rate range. In particular, an overlapped range is present between the first and second controlled flow rate ranges and a liquid flows on either any one or both of the first and second flow rate control units depending on variation of a required value of a total rate. The flow rate on any one of the first and second flow rate control units is maintained and the flow rate on the other one increases while increasing the total flow rate of the liquids.

Abstract: A processing liquid mixing apparatus and method capable of maintaining a mixing ratio of the processing liquid produced in a mixing tank constant, a substrate processing apparatus including the processing liquid mixing apparatus, and a storage medium storing a program for controlling the processing liquid mixing apparatus are disclosed. Discharge valves are first open and supply valves are close to discharge stock solutions to an outside through the discharge valves. After all flow rates of the stock solutions detected by LFC reach a predetermined flow rate, the discharge valves are close and the supply valves are open to supply the stock solutions to the second mixing tank through the supply valves.

Abstract: A processing liquid mixing apparatus and method capable of maintaining a mixing ratio of the processing liquid produced in a mixing tank constant, a substrate processing apparatus including the processing liquid mixing apparatus, and a storage medium storing a program for controlling the processing liquid mixing apparatus are disclosed. Discharge valves are first open and supply valves are close to discharge stock solutions to an outside through the discharge valves. After all flow rates of the stock solutions detected by LFC reach a predetermined flow rate, the discharge valves are close and the supply valves are open to supply the stock solutions to the second mixing tank through the supply valves.