Abstract: A pattern, in which a groove of an optional position is deeper than that of the other portion, is formed on a surface of a flexible resin sheet by laser process, and then a fluorine-carbon monomolecular film release layer is formed on the surface of the thus obtained pattern, thereby forming an intaglio plate. The intaglio plate is filled with Ag paste and then dried. The intaglio plate is then laminated onto an insulating substrate, on which a thermoplastic resin layer is formed using heat rollers. Thereafter, the intaglio plate is peeled from the insulating substrate so that the pattern of the Ag paste is transferred thereon, and the conductor pattern is formed through burning. Further, an insulating layer is formed so as to cover the conductor pattern and another conductor pattern is formed on the insulating layer, whereby forming a multilayered structure.

Abstract: For minimizing the size of a ceramic electronic device for elimination of noise in a digital circuit installed in an electric apparatus, a method comprises the steps of placing a ceramic layers structure encapsulating internal electrodes on a substrate which has a plurality of apertures arranged therein, making through holes in the ceramic layers structure by applying a sand blasting through the apertures of the substrate, and forming in the through holes external electrodes connected to the internal electrodes.